CPMT Technical Committee on Electrical Design, Modeling, and Simulation - TC-12 Organization: –Chair: Madhavan Swaminathan (Georgia Inst. Tech.) –Vice-Chair:

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CPMT Technical Committee on Electrical Design, Modeling, and Simulation - TC-12 Organization: –Chair: Madhavan Swaminathan (Georgia Inst. Tech.) –Vice-Chair: Alina Deutsch (IBM Watson Research) –Web Masters: Moises Cases (IBM Austin) and Jaya Bandhyopadyay (IBM Austin) Committee Members: 21 –10 from Industry: IBM, SUN, Agilent, Intel –11 from Academia/Institutes: GIT, UM, UG(Belgium), NIST, UH(Germany) UA, IME(Singapore), KAIST(Korea), OSU, SRC, UI.

CPMT Technical Committee on Electrical Design, Modeling, and Simulation - TC-12 Conference and Workshop Participation: –EPEP: chair, presenters, sessions chairs –ECTC: Electrical Modeling committee, presenters, session chairs –Future Directions in IC and Package Design Workshop, Oct. 20, 2001, Boston –Interpack 2001: two sessions on electrical Publications –Yearly special issue of Transactions on Advanced Packaging based on ECTC Conference: 8 papers, A. Deutsch, M. Swaminathan guest editors

CPMT Technical Committee on Electrical Design, Modeling, and Simulation - TC-12 Short Courses/Invited Presenters: –6-8 Tutorials at EPEP 2000 –6 Invited Speakers for EPEP –6-8 Invited speakers for TC-12 workshop in Boston, Oct Database of Reference Publications by Topics –Publications cover many IEEE societies and broad range of conferences. Updated twice a year. –Topics: System Design - M. Cases, G. Katopis, R. Bracken On-Chip Interconnections - A. Deutsch, H. Grabinski Measurement and Characterization - D. Williams, L. Martens Power Distribution - L. Smith, D. Becker, T. Roy Simultaneous-Switching Noise - J. Libous, M. Swaminathan Radiated Emissions and Coupling - M. Iyer, J. Kim Microwave and RF Packaging - R. Jackson, A. Weissharr Accelerated Modeling - A. Cangellaris, J. Prince