A suggestion for the naming of parts in Silicon Run IIb L. Bagby, E. Chabalina, A. Nomerotski, E. von Toerne + others February 2003.

Slides:



Advertisements
Similar presentations
Week 2 Vocabulary Review Quiz Friday, September 3 rd.
Advertisements

1 Time Domain Reflectometer TECHTRONIX. 2 Time Domain Reflectometer INTRODUCTION Transmission Line Discontinuities VOP, Velocity of Propagation How a.
10/24/2003Yu Chul Yang(CHEP,KNU) Layer0 Prototype Test Abstract,,,,,,,, Shabeer Ahmad Mian( ),,,, ( ),,, ( ). We have carried out prototype test for Silicon.
A Common Naming and Numbering Scheme for ALICE L. Betev, P. Chochula ALICE week Geneva, June 16.
HFT Technical Overview September 26, HFT 2013 TPC FGT 2011 STAR Detectors Fast and Full azimuthal particle identification EMC+EEMC+FMS (-1 ≤ 
Layer 0 Grounding Requirement in terms of noise performance Grounding/Shielding studies with L0 prototype Summary Kazu Hanagaki / Fermilab.
Workshop on Silicon Detector Systems, April at GSI Darmstadt 1 STAR silicon tracking detectors SVT and SSD.
The Intermediate Silicon Layers detector OUTLINE ISL inside CDFII Why the ISL? Conceptual Design Ladders and Spaceframe Rasnik Online Alignment System.
ISL David Stuart, UC Santa Barbara May 11, 2006 David Stuart, UC Santa Barbara May 11, 2006.
PHENIX Vertex Tracker Atsushi Taketani for PHENIX collaboration RIKEN Nishina Center RIKEN Brookhaven Research Center 1.Over view of Vertex detector 2.Physics.
For high fluence, good S/N ratio thanks to: Single strip leakage current I leak  95nA at T  -5C Interstrip capacitance  3pF SVX4 chip 10 modules fully.
Brenna Flaugher Oct. 31 th CDF Meeting1 RunIIb Silicon Project Successful Lehman Review Sept Workshop at LBL 10/23-10/25: Wednesday-Thursday  hybrids.
SVX4 chip 4 SVX4 chips hybrid 4 chips hybridSilicon sensors Front side Back side Hybrid data with calibration charge injection for some channels IEEE Nuclear.
Copyright - Planchard 2012 History of Engineering Graphics Stephen H. Simmons TDR 200.
1 Module and stave interconnect Rev. sept. 29/08.
1 SSD status report – 16 July 2004 Jerome Baudot, Strasbourg STAR Collaboration Meeting BNL, 16 July 2004 Silicon Strip Detector status report  Report.
Copyright © Cengage Learning. All rights reserved. 2 Descriptive Analysis and Presentation of Single-Variable Data.
Silicon Inner Layer Sensor PRR, 8 August G. Ginther Update on the D0 Run IIb Silicon Upgrade for the Inner Layer Sensor PRR 8 August 03 George Ginther.
Mapping for Silicon Run IIb L. Bagby, A. Nomerotski, E. von Toerne December 2002
Silicon RunIIb Workshop, Dec , A. Bean, M. Demarteau Slide 1 Workshop  Workshop is to “Move beyond the Technical Design Proposal”  Many.
Silicon Meeting July 10, 2003 Module and Stave Production Status James Fast Fermilab.
Installation and operation of the LHCb Silicon Tracker detector Daniel Esperante (Universidade de Santiago de Compostela) on behalf of the Silicon Tracker.
11 SSD Power and Cooling on the Cone STAR Integration Workshop Howard Matis May 16, 2008 STAR Integration Workshop Howard Matis May 16, 2008.
Ronald Lipton PMG June Layer 0 Status 48 modules, 96 SVX4 readout chips 6-fold symmetry 8 module types different in sensor and analog cable length.
DOE Rev of Run IIb Sep 24-26, Detector Production WBS James Fast Fermilab.
ATLAS Pixel Detector September 2003 Services E. Anderssen LBNL Service Connectivity from Module to PP1b Eric Anderssen LBNL Pixel Services Meeting, CERN.
Swadhin Taneja Stony Brook University On behalf of Vertex detector team at PHENIX Collaboration 112/2/2015S. Taneja -- DNP Conference, Santa Fe Nov 1-6.
8. February 2012 Thomas Bergauer (HEPHY Vienna) SVD Construction Database SVD-PXD meeting.
Andrei Nomerotski, Fermilab Silicon Electronics & Readout Silicon Electronics & Readout Andrei Nomerotski, D0/Fermilab April , Temple Review Overview.
L. Greiner 1IPHC meeting – May 7, 2012 STAR HFT Plans for the next year A short report on HFT/PXL plans for post May 2012 TPC – Time Projection Chamber.
L0 Technical Readiness Review-Electronics Installation Linda Bagby L0 Electronics Installation  System Electronics Overview u Low Voltage s Filter.
Tevatron II: the world’s highest energy collider What’s new?  Data will be collected from 5 to 15 fb -1 at  s=1.96 TeV  Instantaneous luminosity will.
Rev of Run IIb, Nov 4-8, 2002, A. Bean 1 Silicon Management  Organization and Management  Schedule  Resources  Conclusions Alice Bean Univ. of Kansas.
Director’s Review of RunIIb Dzero Upgrade Installation Linda Bagby L0 Electronics Installation  System Electronics Overview u Low Voltage u High.
Solid State Detectors for Upgraded PHENIX Detector at RHIC.
11 June 2015 Thomas Bergauer (HEPHY Vienna) Belle II SVD beam Test SPS 2015 SPS users meeting.
Proposal for LST-based IFR barrel upgrade Roberto Calabrese Ferrara University Workshop on IFR replacement, SLAC, 11/14/2002.
Local Supports to IDR Discussion ATLAS Upgrade Week November 2014.
TC Straw man for ATLAS ID for SLHC This layout is a result of the discussions in the GENOA ID upgrade workshop. Aim is to evolve this to include list of.
DOE Rev of Run IIb Sep 24-26, Run IIb Silicon Mechanical Design  Run IIa and IIb geometries  Sensor dimensions, numbers, and drawings  Hybrids,
ILD Vertex Detector Y. Sugimoto 2012/5/24 ILD
Leo Greiner IPHC1 STAR Vertex Detector Environment with Implications for Design and Testing.
Silicon Mtg July 24th, Eckhard von Toerne, KSU RunIIb Silicon Database Eckhard von Toerne Kansas State U. July 24 th, 2003.
1 KU MRI What is the MRI? What is KU doing? Firmware/testboards Optical hybrids Sensors.
DZero Run IIb PMG December 10, Agenda Run IIb D-Zero PMG December 10, 2002  ESAAB news (Lab, Project, DOE)  Project status, overview (Kotcher)
Silicon Meeting July 10, 2003 Module and Stave Production Status James Fast Fermilab.
SiD Vertexing and Tracking Contribution to the LOI Bill Cooper Marcel Demarteau Ron Lipton Rich Partridge Dong Su For the SiD Vertex/Tracking Group SiD.
8/12/2010Dominik Dannheim, Lucie Linssen1 Conceptual layout drawings of the CLIC vertex detector and First engineering studies of a pixel access/insertion.
Redesign of LumiCal mechanical structure W.Daniluk, E.Kielar, J.Kotula, K.Oliwa, Wojciech Wierba, L.Zawiejski Institute of Nuclear Physics PAN Cracow,
Dzero Collaboration Meeting, Sept. 14, M. DemarteauEric Flattum - Fermilab 1 Slide 1 Alice Bean Fermilab/University of Kansas for the D0 Run2b silicon.
SVD Cables & Pipes Markus Friedl (HEPHY Vienna) B2GM, 24 July 2012.
Learning Outcomes By the end of the chapter student should be able: to define vector quantity and scalar quantity and differentiate between them. to add.
L. Bosisio - 2nd SuperB Collaboration Meeting - Frascati SuperB SVT Update on sensor and fanout design in Trieste Irina Rashevskaya, Lorenzo.
/ 11 Updates of PANDA 3D Model CM June 2016 at GSI, MEC Session J. Lühning, GSI Updates for: Panda Hall Target Spectrometer Latest version.
Straw man layout for ATLAS ID for SLHC
SVD Electronics Constraints
Alpine, very forward, EOS…
Technical Design for the Mu3e Detector
Reflections Geometry.
7.2 Reflections Geometry Ms Bateman 2010.
- STT LAYOUT - SECTOR F SECTOR A SECTOR B SECTOR E SECTOR D SECTOR C
SuperB SVT Definition of sensor design and z-side connection scheme
SuperB SVT Silicon Sensor Geometry Optimization
SIT AND FTD DESIGN FOR ILD
How to use Latitude & Longitude
Warm Up Problem 1 2 ÷ 3 4.
Silicon tracker and sensor R&D for sPHENIX
Reflection Bingo.
How to use Latitude & Longitude
Presentation transcript:

A suggestion for the naming of parts in Silicon Run IIb L. Bagby, E. Chabalina, A. Nomerotski, E. von Toerne + others February 2003

General Remarks Labeling of production parts and installed parts differs Worst case naming scenario: Each subgroup uses different names for the same installed object: HV naming different from DAQ naming different from reconstruction different from MC simulation... It might be convenient to have a scheme similar to RunIIa Because it is convenient not to have to learn new names It might be better NOT to have a scheme similar to RunIIa Because the detector geometry is very different and the naming should reflect the geometry. The proposed scheme is a good compromise of these two principles

Naming of Installed Parts A few technical terms Module: A sensor/hybrid combo in Layers L2-5 Types: 1010A 2020A 1010S 2020S A= axial S=stereo Stave:1010A+2020A+1010S+2020S+ support Ladder:Sensors ganged together in readout (1 Module = 2 Ladders)

D0 Coordinate System Right-Handed coordinate system, Positive z and positive eta point south Protons travel along positive z-axis (south) Documentation Positive y points upwards Positive x points East (x increases while going east)

Module Position on Stave 2020 South End North End 1010 Naming of ladders: Lisa will use “barrel” label Protons Going along positive Z axis Z-Axis

Stave Location in R-phi Compromise between STT note and reconstruction needs Label with 3 digits highest significant digit indicates layer Start at x-axis, similar to U.Heinz’s STT note) Go counterclockwise Odd numbers have always smaller radius than even numbers in the same layer, consis- tent with Table 9, TDR Seen from South end North/South,Axial/Stereo labels: AN, AS, SS, SN L2-01 L L5-01 L

Punch-through symmetry: L5-18South is OPPOSITE of L5-18North L2-01 L L5-01 L Seen from North EndSeen from South End North End South End Z-Axis L2-01 L L5-01 L

Naming of Layer 0 and 1 - RPhi Analog to Stave map Seen from South End

North End South End Naming of Layer 0 Sensors/Hybrids in Z SouthNorth Z-Axis

North End South End Naming of Layer 1 Modules in Z SouthNorth Sensor Module 56-South 34-South 12-South12-North56-North 34-North Module/Hybrid Z-Axis

Naming of Module/Staves – Part2 How to address a module: L4-05NA-1010 How to address a sensor located inside the run IIb detector? Use stave number and local sensor number It is in layer 3, North side, Axial alignment in an outer radius stave (because of even stave number) the 6 th sensor from the middle of the detector => outermost sensor on the north side Advantage: Everybody is able to find it using the map L3-08NA-6

Naming of Production Parts

Naming of Production Parts, Hybrids Name of Production parts conveys part properties. Hybrid properties to appear in naming: Layer 0 / L1 / L2-5 Axial / L2-5 Stereo I suggest to label production hybrids with a 4-digit number, following a suggestion by Jim Fast Highest significant number could indicate the hybrid type Example:Hybrid-0001 Layer0 Hybrid-1001 Layer1 Hybrid-2001A Layer2-5 Axial Hybrid-3001S Layer2-5 Stereo How does the database handle preceding 0’s ? Does the database accept hyphens? How do we handle pre-production parts? Highest Significant Digit

Naming of Production Parts, Sensors Layer 0 / L1 / L2-5 production sensors with a 3-digit number, preceded by L0, L1, L2 Pre-production sensors have the version number appended.

Naming of junction cards/adapter cards No differentiation by layer Assign consecutive production numbers Naming of Production Parts, Modules L2-5 Modules named after hybrid they contain + appendix to indicate 10/10 and 20/20 Modules Hyb-2001A (L2-5, axial hybrid) becomes either M /10A or M /20A

Naming of jumper cables Differentiation by length Naming of L0 flex cables Assign production numbers based on layer and length Naming of twisted pair cables Consecutive production numbers

Naming of Production Parts, Staves Are all staves alike? Yes! We can label staves with consecutive production numbers: Stave-1, Stave-2, Stave-3, … Stave-199 … Once the staves are installed, they receive numbers that indicate their location. Location numbers and production numbers will be different and can be mapped onto each other using the database. The map can be put into excel and posted on the web. That way everybody will know where his/her favorite stave/hybrid/sensor ended up. This knowledge is important for the operation of the detector.