IEC TC93 Liaison Report DASC SC Alex Zamfirescu IEC USNC Technical Aadviser TC93 Convener IEC TC93 WG2 September,

News from IEC TC93 TC93 meetings took place during the week of September 4 to 9, 2005 Hosted by Japan NC in Nara TC93 WG1 and WG2 discussions included –Interoperability of international standards –Maintenance of IEC standards –Future candidates for IS Analog VHDL (IEEE ); SystemC (IEEE P1666); SystemVerilog (IEEE P1800); IEEE 1647; IEEE 1850; IEEE 1500™ (Sponsor CSS); Extend 1603 for Radiation Hardening (RH&R) Register Description Language; Numerics Ontology as PAS

Good progress on IEEE DASC Dual Logo Submissions All DL Submissions were voted and approved by the P member countries –IEEE Std – IEEE Standard for Standard Delay Format (SDF) for the Electronic Design Process………… IEC –IEEE Std – IEEE Standard VHDL Language Reference Manual ………………………………….. …..IEC –IEEE Std – IEEE Standard Verilog® Hardware Description Language ………………………….. ………..IEC –IEEE Std – IEEE Standard for VITAL ASIC Modeling Specification……………………………….....IEC –IEEE Std – IEEE Standard for Advanced Library Format (ALF) Describing Integrated Circuit (IC) Technology, Cells, and Blocks …… IEC Ed. 1.0 –IEEE ………………………………......IEC –IEEE …………………………………..IEC 62142

IEC TC93 Std Maintenance Extract IEC Publication NumberKindFeederMnemonics IEC Maint. IEC ( ) DL IEEE 1076VHDL2007 IEC ( )IEEE 1149MVL92004 IEC ( )IEEE VHDLMATH2004 IEC ( )IEEE VHDLNUM2000 IEC ( ) DL IEEE 1364VERILOG2006

Discussion about VHDL IEEE/IEC DL Maintenance The first four standards (on previous slide) are in the process of being merged into one LRM with additional VHPI documentation The group (WG2) agreed that the only alternative left for IEC participation is to wait until IEEE draft comes for ballot, form Accellera now jointly working on the documentation with the IEEE VASG. Note that IEC was not invited to form a joint working group as required by the DL procedures agreed upon in the IEEE-IEC MOU on DL maintenance (summary of the MOU was circulated twice in DASC SC minutes, and attached again to this report – next 4 slides). No draft was circulated so far to IEC (possibly in contradiction to DASC SC assigned actions).

Dual logo maintenance process see pages 2/3 An IEC-TC/SC needs to revise an IEC-IEEE standard IEEE needs to revise an IEC-IEEE standard MCRPAR IEC and IEEE agree on a common need YES Dual logo maintenance team (DLMT) set up with members from IEC and IEEE and a convenor jointly accepted ( see note 3 ) IEC disagrees see note 1 IEEE disagrees see note 2 INFO Maintenance Procedure

Maintenance Procedure The DLMT prepares a draft for comments (CD) IEC National Comments ( 3 months ) IEEE experts internal ballot ( electronic ) The DLMT prepares a common compilation of comments with possible proposals for change IEC-TC/SC takes decision by correspondance or at a TC/SC meeting CDV OK? See note 4 IEEE takes decision for the next step ( possibly a second internal ballot ) INFO Ballot OK See note 4 The DLMT prepares a second draft based on commonly agreed changes IEC votes on CDV (5 months) IEEE sponsor ballot ( days ) INFO NO YES See note 5

Maintenance Procedure Positiv e results Positiv e results INFO The DLMT prepares a common compilation of comments on the CDV together with proposals to solve them YES See note 6 NO See note 6 NO IEC-TC/SC takes final decisions on the comments by or at a meeting IEEE takes final decisions on the comments received INFO The DLMT prepares the FDIS based on commonly agreed modifications. Revised IEC-IEEE standard IEEE final ballot. Once approved IEC submits the FDIS for final vote (2 months) See note 7

Maintenance Procedure Notes Note 1 – IEC may decide to continue its own route. If any material is used from the IEC/IEEE standard, a separate license agreement will be required. Note 2 – IEEE may decide to continue its own route leading to publish a revised single IEEE logo standard replacing the previous one. If so IEC will withdraw the existing IEC-IEEE standard. Then IEEE may submit to IEC this new standard as a candidate for a possible new IEC-IEEE standard according to the agreement. Note 3 – The organisation which initiates the process, proposes a convenor first. If the proposal is not accepted by the other organisation, another convenor has to be chosen amongst the members of the DLMT by mutual agreement. Note 4 – At this stage, IEC or IEEE are requested to task the DLMT to provide a new draft for comments Note 5 – The 2 ballot processes must be carried out in such a way that the deadlines are the same Note 6 – At this stage, IEC or IEEE may decide either to continue their respective route or to task the DLMT to provide a new draft for vote by both organizations. If IEC decides to continue its own route, then note 1 applies. If IEEE decides to continue its own route then note 2 applies. –Note 7 – The comments made at this stage must be limited to corrections of misspelling or obvious errors which may have been generated during the preparation of the FDIS.

Discussion about Verilog® IEEE/IEC DL Maintenance The Verilog® situation is unfortunately similar. The IEC was not contacted to form a joint working group. However from the reports of WG1 we (the IEC TC93) know that some unprecedented deprecation took out nearly half of the LRM and the semantic of important functions used to interoperate tools and integrate applications. Therefore, there is a proposal to re-affirm the IEC Verilog (in 2006) without modifications. That will make sure that a standard including the IEEE version will still be a live standard. Decision should be reached by end of September (to keep Verilog as is in the IEC, to seek standardizing at the international level the new IEEE version or to do nothing).

Future Work Towards clarifying DL Std maintenance issues Develop roadmap for next generation standards –Language independent numerics, TC93 WG2 will participate in DASC/DATC 2005 Workshop –Analyze EDA relevance of efforts like SPIRIT and SAE Architecture Std. –Standards to support Statistical EDA, 3D, Farming –Plans to simplify standardization by separating PASs from STDs –Involve all available experts from around the globe