Plasma bay modernised in 2011. Sentech SI 500 RIE cluster Si 3 N 4, SiO 2, polySi and Al etching 2 x Oxford System 100 ICP Si 3 N 4, SiO 2, polySi, polymers,

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Presentation transcript:

Plasma bay modernised in 2011

Sentech SI 500 RIE cluster Si 3 N 4, SiO 2, polySi and Al etching 2 x Oxford System 100 ICP Si 3 N 4, SiO 2, polySi, polymers, Al, noble metals etching

Oxford System 80 Plus PECVD SiN x and SiO 2 deposition

Zygo NewView 7100 Optical white light profilometer for non – contact, three - dimensional surface topography measurements as well as for dynamic measurements of MEMS structures. Dektak XT Stylus profiler for surface topography contact measurements. Napson CRESBOX Semi-automatic four point probe for resistance/resistivity measurements.

To be installed till the end of 2012: 3 x Thermco diffusion furnace (Si wet and dry oxidation, P diffusion) Thermco LPCVD reactor (polySi, Si 3 N 4 deposition) 2 x Oxford Instruments magnetron sputtering system (Al and noble metals deposition) EVG 101 spray coater (PR deposition onto 3d surfaces) EVG 620TB double side mask aligner (including large gap alignment optics for 3d patterned surfaces) IBS plasma immerse ion implanter (B, P, As, Si, C ion species; S/D doping, Trench doping, Backside wafer doping, High dose poly-silicon doping, Contact doping, Shallow junction forming, 3D element doping, Nano precipitates and nano structure forming, Hydrogenation, Gettering, Resist curing) 2 x Plasma Parylene System Resist ashers (PR including SU8 removal) and other stuff such as wet benches, semi-automatic probe station, RTP system, microsystems assembling devices etc.