Virtual Imaging Peripheral for Enhanced Reality Aaron Garrett, Ryan Hannah, Justin Huffaker, Brendon McCool

Abstract Our project, code named Virtual Imaging Peripheral for Enhanced Reality or VIPER, is an augmented/virtual reality system. It will track a user’s head location and perspective and use this information to find the location of a camera position in a virtual environment. With a pair of video glasses the user would then see the virtual environment at the cameras location. As the user moves around a table top sized environment their actual and virtual perspective changes, allowing them different viewing angles of the virtual space.

Project-Specific Success Criteria 1. The ability to communicate time stamp data using RF between the base unit and head unit. 2. The ability to display images to the video glasses. 3. The ability to calculate estimate of angle and position of head unit using accelerometer, gyroscope, and compass. 4. An ability to find angle displacement of head relative to IR beacon origin using glasses mounted camera. 5. An ability to find distance from base to head unit using ultrasonic emitter and receiver.

Block Diagram

Commercial Product comparison #1: Vuzix STAR 1200 Augmented Reality System  What we will copy: position and shape of camera package  How ours differs: Calculations and calibrations will be done in separate package  Unique: Our “beacon” will be in its own stand-alone package

Commercial Product comparison #2: Vuzix Wrap 1200VR Virtual Reality System  What we will copy: packaging/design of glasses  How ours differs: size of package containing sensors will be bigger because of more degrees of freedom(also in same package as camera)  Unique: Our “beacon” will be in its own stand-alone package

Project Packaging Specifications  Our project will have three main packaging componets:  1. The “head unit” will contain the sensors, IR camera, microcontrollers, ultrasonic receiver, and Xbee module  2. The “beacon unit” will contain the IR LED, a microcontroller, an ultrasonic emitter array, and the other Xbee module  3. The “calculation unit” will contain just the microprocessor

Packaging Dimensions  208 pins, 31.2mmx31.2mm, QFP;AT91SAM9XE256  28pins, 8.20mmx10.5mm, SSOP;PIC24FJ6GA002  64 pins,12mmx12mm,TQFP;PIC32MX534F06H  7.62mm height by 11 mm diameter;40TR12B-R  6mmx6mmx4.5mm; TCM8230MD  24.38mmx32.94mmx8.12mm, WRL  4mmx4mmx0.9mm,QFN(chip);17.78mmx13.97(breakout);ITG-3200  3mmx3mmx1mm,QFN(chip);17.78mmx13.97(breakout); MMA8452Q  13.3mmx14.5mm(breakout); MAG3110  82.55mmx82.55mm; ND  Estimated head unit dimensions: 90mmx90mm  Estimated beacon unit dimensions:55mmx55mm

Packaging Illustration