Chip soldering for ALICE ITS upgrade Xiangming Sun Gangjie Wang.

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Presentation transcript:

chip soldering for ALICE ITS upgrade Xiangming Sun Gangjie Wang

outline current approach suggestions from a company study progress

current approach laser soldering under intensive study

talking with a company about the laser soldering proposal: 1,ball machine soldering 2,heat method

ball machine soldering thin solder wire

heat method 200 degree

before and after chip 2.5um FPC 25um

microscope picture

making ball on chip

making ball on FPC

ball in FPC

summary gold wire diameter is 50um, which can only make 100um diameter ball. 100um diameter wire is needed to make the proper ball for FPC more test is undergoing

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