MOTHERBOARD AND ITS COMPONENTS PRESENTED BY- Md. DANISH HEMLATHA J SUSHMITHA RAJ N GIRIRAJ. D ABHIRANJAN SINGH

The Motherboard Contents:  Introduction  Classification of Motherboard  Components & Functionality  Maintenance  Latest Market updates  Progress from past to present and to future(Timeline)

What is Motherboard?  Motherboard is the main component of computer.  Backbone of computer. Functions of Motherboard:  Integration  power

Specification  Speed : knowing motherboard speed is very crucial. Few ways to know the speed of motherboard are: Checking the box when purchasing.  Looking maximum speed of your BIOS.  Benchmark software such as 3Dmark and phoronix.  Up-gradable : Motherboard should be upgradable.  Form-factor : The height and width of Motherboard is called form factor. i.e. Standard ATX, Micro ATX, Mini ITX, Nano ITX.

Motherboard And Its Classification  Integrated motherboard  Components are built on the board.  Drawbacks:  On breakage  Cheaper but expensive.  Non up-gradable  Non Integrated motherboard  It has installable component and expansion card.

 CPU Socket  Memory Slots  CMOS Battery  ISA, PGP and AGP slots  Power Connectors  Chipsets  Graphical Devices  Back panel and Ports Main Components of Mother Board

CPU Socket  Provides mechanical and electrical connections between microprocessor and PCB.  Processor consists of ALU and CU.  Acts as a “computer’s brain”.

Memory Slots  Provides electrical connection between RAM and Mother Board.  RAM is used to store data while the computer is working.

PCI Slots  Used for connecting PCI cards.  Much faster than ISA slots.

CMOS Battery  CMOS-Complementary Metal Oxide Semiconductor.  Used to store BIOS Settings.  When the computer is turned off CMOS saves the data.

AGP Slots  AGP-Accelerated Graphics Port.  Specially designed for display cards.

Chipsets  Manages interface relation and provides data transfer.  North Bridge and South Bridge.

Heat Sinks  It is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device into a coolant fluid in motion.  Provides thermal protection.

Functional Diagram of Mother board

Things To Be Taken Care  Dust  PSU  CMOS Battery  Heat Sink  Processor Fan  Sockets  CPU Cabin

Motherboard Dependencies  Motherboard size  Processor Sockets  Chipsets  RAM  Connection  Expansion Slots

 RAM Frequency and Voltage Capacity Technology Error Correction Bus Speed  Processor Number of Cores How faster CPU Speed On-Board Cache  Expansion Slots  PCI/PCIE  SATA Ports  HDD/SSD Motherboard Dependencies

AT  Size-13.8”*12”.  Advancements-Tower design and power switch on the front panel.  Only Keyboard connectors.

ATX  Size:12”*9.6”.  Evolution of baby ATX.  Better support for current and future processor technology and I/O.  Reduced system cost.  Enhance ease of use.

Micro-ATX  Size:9.6”*9.6”  Address new market trends and PC technologies.  Current processor technlogies.  AGP high performance graphic solutions.  Smaller motherboard size and power supply form factor.

BTX(Balanced Technology Extended)  Size:12.8”*10.5”.  Replacement for aging ATX.  Designed to alleviate issues by using newer technologies on Motherboard(more power and heat).

LPX(Low Profile Extension)  Size-8.87”*9.25”.  Video adapters integrated.  High quality product at low cost.  Poor expandability and upgradability.

NLX(New Low Profile Extended)  Size:13.6”*9”  Supports current and future processor technologies,AGP.  Tall memory technology.  More system level design and integration flexibility.

Mini ITX  Size-5.9”*5.9  Passive cooling design.  Surface mount technology.

Nano ITX  Size:4.7”*4.7”.  Targeted at smart digital entertainment devices.  Very low power consumption.

Past, Present And Future The evolution of the motherboard can be divided into four major parts namely  Centralization  Peripherals movement  Form factor  Shrinking it down (size)

TYPEPASTPRESENTFUTURE 1.CENTRALIZATION Earlier there were no motherboards as we conceive today. Now the motherboards are located in CPU centrally Decentralization 2.FORM FACTOR High form factor Low form factor compared to the past motherboards As the sizes are reducing form factor also reduce but at a slower rate then the components on the motherboard. 3.SIZE The size for the motherboard was large Smaller sizes as compared to the past ones Sizes are still reducing and the final limit is yet to be discovered 4.PERIHERALS The peripherals were printed on separate central boards connected together Most of the peripherals are available on the motherboards now Peripherals are moving off the motherboards.

Questions