1. Module Assembly Jig Status Cambridge and DESY came to Liverpool Nov. 15 th -16 th for training on module assembly – A complete jig set was sent back with Cambridge with a complete set of jigs – Cambridge took extensive notes/photos/videos and is making web page to start a set of training documentation Second set is be made ready for UCSC/LBL – Last week during final commissioning of the set, the metal stencil was damaged for the chip tray and had to be re-glued yesterday – The jigs could be sent out next week but I would like to discuss the timing Worried about shipping during Christmas and would like to send include a new hybrid panel which is delayed (see next slide) We are making 3 additional wire bonding jigs to be ready when other sites are ready to start – Should be finished late Jan/early Feb – Will send one to DESY with a hybrid panels with 3 sets of ASICs attached (1 bonded, 2 unbonded) – Could send one to Freiburg if interested

2. Hybrid Delivery Originally, I planned on shipping out jigs to the west coast with one of the new hybrid panels – With one hybrid bonded and 2 more with chips attached to start the process at UCSC – The hybrid shipment was due 2-3 weeks ago but was delayed due to bad weather and an increased work load due to an eminent VAT increase in the UK. Hope to receive at the beginning of next week Shifts SMD attach to the week of Jan. 11 th Would be able to send this panel ~ week of Jan. 18 th So I can either delay shipment until these hybrids are ready or ship the jig now with 1 bonded hybrid (maybe)

3. Near term plans (1) Before Christmas – Will finish bonding/testing of all the hybrid/modules assembled during the training sessions – Work on finishing the commissioning the last jigs at Liverpool Extra pickup tools and module testing jigs – Define and start manufacture of testing system for irradiated modules – Receive and inspect hybrid delivery to prepare for SMD attachment – Finish gathering the needed components for the hybrid-to- sensor gluing study Have epoxies in hand, Glasgow is dicing glass dummies for ASICs, hybrids in process at Stevenage, ordering glass sensors from Schott Ltd. (Germany)

4. Near term plans (2) January – Focus on finalization of glue layer Determine maximum achievable glue layer with Epolite Decide if we need to “load” epoxy to increase viscosity to increase thickness and to improve accuracy of glue placement Use glass ASICs/sensor to determine glue coverage and to determine optimal glue patterning for hybrid-to-sensor gluing – Make 2 panels that have some hybrids with ASICs for UCSC/LBL, DESY and Freiburg (??) – Sending additional panel to Cambridge – Starting another order of 15 hybrid panels – Testing of DC/DC convertors on module frame – Testing of irradiated modules at CERN