1. Hybrid and Module Status 1

2. Hybrid Delivery First hybrids over-etched and shrunk due to changes in design and mistakes in manufacturing – Shrinkage for both circuits and alignment holes To use at all have to re-drill holes, hand solder all surface mounts, re-set all wire bonds – Build also not as expected 2 bond-ply between ground and shield layers, 9  m instead of 5  m copper for two layer, 35  m instead of 5  m copper for shield Modifications to design to make manufacturing easier submitted by Nov. 1 st, production are supposed to have started on the Nov. 9 th – Misunderstanding by vendor lead to devices manufacture to start on Dec. 3 But have improved communication path to track progress, confront problems, etc. Build is back to original specifications. New understanding on the method to locate the tooling holes 2

3. Hybrid Delivery (cont) Thus, the delivery is now delayed relative to AUW schedule – Foresee delivery week before Christmas First pieces back from passive stuffing 2 nd -3 rd week of January – First working re-spun hybrid last January-early February To keep closer to schedule and get experience, we are populating 3 hybrids with over-etched, shrunk circuit now to start program 3

4. Module Fixturing Status ConceptDrawingManufactureTestingFinalETA Chip TrayNov Vacuum Placement Chuck Nov Hybrid Bonding JigDone Module Assembly Plate Late Nov (Dec)  Module FrameLate Nov (Jan)  Module Bonding Plate Late Nov (Dec)  Module Testing BoxJan Design/manufacture/testing processing well, in the order needed. Progress since AUW in grey arrows. Slightly off schedule due to unanticipated testing of BCC and emergency work in shop for another project 4

5. Asics ‘Set out’ jig Material :- Acetal (Static Dissipative) Chip Tray 5 Second version made. Chips and pickup tool fit snugly. Vacuum removed ASICs cleanly Trialling multiple pickup trial to ensure ASICs aren’t damaged.

6. Material:- top Aluminium bottom Acetal Location dowels Face contacts ASICs Vacuum Placement Chuck 6 Second version finished. Fits all jigs and has be levelled on legs. Checking placement accuracy of ASICs after pickup trialling

7. Hybrid Bonding Jig First version finished – Used successfully to bond first ASICs Will make second version with separate vacuum areas for each hybrid – Easier repair cycles – Will only happen after first few modules finished 7

8. Dowel holes for Placement chuck (In shop) Height setting pins (In shop) Vacuum holes Dowels stops for Silicon Vacuum port Module Assembly Plate 8 Dowels being finished this week. Next week, we will start smart scope measurements of the placement accuracy achievable for silicon relative to hybrid pins Will need to grind height setting pins to set correct glue level. Will attempt first super-mechanical in early January

9. With now machine rebate for module at Liverpool Machined “mechanical” blank to continue assembly testing Used for:- Electrical testing Assembly movement Storage Ready to submit today. Will get just before Christmas Module Frame 9

10. Test Assembly 10 With mechanical sensor, failed electrical hybrids, and mechanical frame, we have shown that everything “fits” together After gluing, we will be able to give precisions of the assembly

11. Dowel locators Vacuum Module Bonding Plate 11 Dowels in shop. Fits on wirebonder. Will be ready in time for first assembled module

12. Short Term Plans Using over-etched electrical hybrids, we will die- attach, wire bond and test 3 hybrids with proper jig set – Hopefully the first before Christmas With 1 electrical and 1 mechanical, and “failed” electrical sensor, we will assemble, bond, and test 1 module in first 2 weeks of January Hope to use the other 2 hybrids with FZ2 sensor to make first module for stavelet program following this first piece 12

13. Overall Time Schedule Finish all jigs needed to assemble and bond module- before Christmas (with minor tweaks afterward) Super-mechanical modules- early January Bond/test “over-etched” electrical hybrids- December-early January Receive new electrical hybrids- before Christmas ?? QA and passive attach-early Jan Assemble/bond/test first “over-etched” electrical module with best method available- Mid-Jan – This is the first test of single-sided module with correct grounding/HV filter, still some concern about noise performance with two hybrids on one sensor Assuming first assembly ok, will make next 4 modules in February –Maybe we should have a working meeting at Liverpool of the future module assembly sites at this point to discuss results Depending on results of first mechanical assemblies and electrical tests, put out jigs sets to industry for other single-sided module build sites in March/April 13