2. ASE ASE Flip-Chip Laminate Substrate Design ASE Flip-Chip Laminate Substrate Design Date : 07/15/03 Rev. H

3. ASE  Package type & Body size  Wafer thickness & Die size. Die orientation Including Pin 1 logo, die up or die down.. Die pad number, metal size & passivation opening.. UBM diameter. Solder bump height, pitch & composition.  Solder ball size, pitch, number, location.  Net list ( net name, coordinates and ball no. )  Special Requirement (Thermal, Electrical or Others) Design Information needed

4. ASE Design Cycle Time : Flip Chip BGA 7 days >>> 5 days Laminated Substrate 1st Article Delivery: (After Vendor drawing confirm) Lead Time General Hot-Run 2 layers : 3 wk 2 wk 4 layers : 4 wk 2 wk 1+2+1 layers : 5 wk 5 wk Laminated Design Cycle Time

5. ASE Laminate Substrate Structure 2 Layer 1+2+1 Layer 4 Layer

6. ASE Line Width/Space S R Q P 2003 20042005 403530 ( 35 )( 30 ) QOuter Layer: Space403530 60 5045 ( 50) (45) ( 40 ) 605045 ( 50 )( 45 )( 40 ) Inner Layer: Line Inner Layer: Space P R S Outer Layer: Line Normal Proto. Type Normal Proto. Type Normal Proto. Type PTH & Blind Via for 4-Layer A B C E F G D 200320042005 AMin. PTH Size (Mechanical)120100 BMin. Blind Via (Laser)7065 CMin. PTH Land Size (Outer)Via+130Via+100Via+80 DMin. PTH Land Size (Inner)Via+130Via+100Via+80 EMin. Blind Via Land SizeVia+120Via+80Via+70 FClearance605040 GMin. Buried Via Land SizeVia+130Via+100Via+80 Signal Trace Design Rules

7. ASE AB C NSMD (No Pass Line) 200320042005 175 220195 ( 165 ) ( 190 )( 175 ) 20 3530 20 ( 20 ) CS/M Line 50 6050 AC4 Pad Pitch BS/M Tolerance Normal Proto. Type Normal Proto. Type D F E E 200520032004 210 270240 ( 190 ) ( 205 )( 195 ) 20 3530 20 ( 20 ) 30 4035 ( 25 ) ( 35 )( 30 ) DC4 Pad Pitch ES/M Tolerance FLine Width Normal Proto. Type Normal Proto. Type Normal Proto. Type NSMD (Pass One Line) SMD (No Pass Line) G H I 200520032004 185 225205 ( 170 ) ( 195 )( 185 ) 20 3530 ( 20 ) ISpace 30 4035 S/M Tolerance G H C4 Pad Pitch Normal Proto. Type Normal Proto. Type SMD (Pass One Line) J MK N 200520032004 245 305275 ( 235 ) ( 270 )( 250 ) 20 3530 ( 20 ) 30 4035 30 ( 35 )( 30 ) NSpace 30 40 35 J K M C4 Pad Pitch S/M Tolerance Line Normal Proto. Type Normal Proto. Type Normal Proto. Type Signal Trace Design Rules

8. ASE Laminate Substrate Roadmap :Prototype:Mass Production 200320042005 1PTH 2Blind Via 3Buried Via 4Via On Pad 5Via On PTH 6Via On Bump