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Dispatching Rule Considering Time-Constraints on Processes for Semiconductor Wafer Fabrication Facility LI Tongji University.

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Presentation on theme: "Dispatching Rule Considering Time-Constraints on Processes for Semiconductor Wafer Fabrication Facility LI Tongji University."— Presentation transcript:

1 Dispatching Rule Considering Time-Constraints on Processes for Semiconductor Wafer Fabrication Facility LI Tongji University

2 电子与信息工程学院 控制科学与工程系 Content »Problem description »Dispatching Rule Considering Time-Constraints on Processes »Simulations »Conclusions 1

3 电子与信息工程学院 控制科学与工程系 Problem Description »Dispatching with time-constraints on the processes 2 Figure 1 An example of a job with time-constraint  the requirements on the delivery of jobs  high utility and workload balance of machines with time- constraints requirements of processes  guarantee the yields of lots  increase the movements of jobs to utilize its capacity efficiently

4 电子与信息工程学院 控制科学与工程系 Dispatching workflow 3 The Workflow of DRTC

5 电子与信息工程学院 控制科学与工程系 Dispatching workflow »For non-BPM, the selection probability of job n is set to »For BPM, the selection probability of job n is set to 4

6 电子与信息工程学院 控制科学与工程系 Simulations 1 5 StageRecipeTool Metal Sputtering90:1 BOE Etching 6WET31 、 6WET32 Metal SputteringCleaning(F) 6FSI01 、 6RAD25 Metal SputteringSputtering ALSICU 6SPU81 、 6SPU81_A5 Metal Sputtering Sheet Resistance Measurement 6RES06 、 MFM01 Table 1 Time-constrain of Metal Sputtering StageRecipeTool BPSG DepositionCleaning (J) 6FSI01 、 6RAD25 BPSG Deposition 6WJ01 、 6WJ02 BPSG DepositionB/P Contents Test6RIG01 BPSG Deposition Silicon Oxide Thickness Measurement MIR02 、 TEN01 BPSG DepositionUV Test6UV03 BPSG Flow 6BTU34 BPSG FlowCleaning (SPM) 6FSI01 、 6RAD25 BPSG DepositionCleaning (J) 6FSI01 、 6RAD25 Table 2 Time-constraint of BPSG

7 电子与信息工程学院 控制科学与工程系 Simulations 1 6 No.PRIORDRTC P-MP-BMOVEP-SP-BMOVE 116.32%33.33%14404763.63%70.58%161507 218.64%71.43%14757561.29%65.38%160503 331.74%75%14763264.28%67.39%161131 431.42%80%13701857.14%66.04%156780 510.34%75%13553057.69%56.86%152577 63.50%50%13529266.67%62.74%151220 No.FIFOEDD P-MP-BMOVEP-SP-BMOVE 128.57%66.67%16721928.59%72.41%156789 220%66.67%15437123.68%75.86%148416 335.08%75%15385127.14%73.07%151870 430.66%75%15449829.11%92.30%146270 532.72%50%15412426.38%69.23%137065 633.92%80%15389127.39%73.07%130407 No.CRSRPT P-MP-BMOVEP-SP-BMOVE 141.66%43.75%15627250.66%50%149237 234.21%75%15064838.09%25%141263 343.54%77.77%15618042.5%75%139484 438.66%81.25%14873041.46%77.77%137225 536.50%88.88%14815730.98%61.11%131059 635.93%59.09%14855329.16%80%132232 No.α1α1 β1β1 γ1γ1 α2α2 β2β2 γ2γ2 σζ 1 0.510.49100.25 0.290.2110 2 0.550.45100.150.30.40.1510 3 0.650.3550.40.350.150.15 4 0.450.55250.30.10.350.2525 5 0.70.3150.250.150.3 15 6 0.350.65150.40.1 0.415 RuleP-M-Avg.P-B-Avg.MOVE-Avg. FIFO 30.25%70% 156409 EDD 27.10%75.92% 145136 CR38.25%70.29%151423 SRPT39%69.38% 138416 PRIOR18.66%64.13%141182 DRTC61.78%64.83%157286 P-M-Avg.: average proportion of the jobs satisfying TC-M P-B-Avg.: average proportion of the jobs satisfying TC-B MOVE -Avg.: average movements of the qualified jobs during one week Values of parameters impact the performance of DRTC critically

8 电子与信息工程学院 控制科学与工程系 Parameter Optimization 7 The workflow to determine the parameter values of DRTC

9 电子与信息工程学院 控制科学与工程系 Simulations 2 8 No.α1α1 β1β1 γ1γ1 α2α2 β2β2 γ2γ2 σζ 1 0.500.5714.890.140.320.20 14.89 2 0.370.5519.010.180.38 0.3119.25 3 0.500.4923.260.420.220.160.1823.33 4 0.870.3024.701.270.230.321.1325.67 5 0.380.4820.960.390.290.220.1521.33 6 0.450.4821.110.250.310.370.2021.21 No.MOVE-AMOVE-OM-Imp.P-M-AP-M-OP-M-Imp.P-B-AP-B-OP-B-Imp.Avg. 11610951614350.2166.5568.673.1962.6864.52.902.10 21580281637123.6068.4371.694.7660.4673.3321.299.88 31594341601680.4669.2468.08-1.6862.8369.2310.192.99 41580301594320.8966.8967.270.5760.368.9614.365.27 51543421590973.0859.14624.8461.3158.62-4.391.18 61530341534280.2660.0462.784.5664.6768.966.633.82 Avg.--1.42--2.71--8.504.21

10 电子与信息工程学院 控制科学与工程系 Conclusion »A dispatching rule considering the time-constraints on processes is proposed in this paper. »We also introduce how to determine its parameters to obtain better performance. »However, our work doesn’t relate these parameters to running information of a fab, and the latter is anticipated to be better than the former. »Our future work is to link these parameters with running information to realize its adaptability to changing environments. 9

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