1. G. Ruggiero / TOTEM 1 Si Edgeless Detectors in the RPs Edgeless detector (on the old “AP25 module”) active edges (“planar/3D”) planar tech. with CTS (Current Terminating Structure) 50  m 10  m 66 μm pitch dead area S/N distribution (X5 test beam Oct 2004) Planar with CTS edge Planar with 3D edge S/N S/N of 24 for a thickness of ~300  m S/N of 16 for a thickness of ~210  m

2. G. Ruggiero / TOTEM 2 Further improvements of Si Edgeless Detectors For the 3D/planar: the signal  new thicker detectors have been produced>>> Higher Signal –Never shipped here, never checked yet  New production later in this year For the CTS: the edge  Pre-series run ongoing (60 detectors)  the producers claims to be able now to achieve the precision of <5μm at the sensitive edge  CNM (Barcelona) has already made the mask to dry- etch some wafer (precision of 1μm)

3. G. Ruggiero / TOTEM 3 Pre-Series Run of the CTS: the wafer  Design completed  Production started (delivery by end of March)  Volume of this run: 60 detectors +test samples (15 wafers)  45 detectors with an edge of 47um  15 detectors with an edge of 34um  5 wafers (i.e. 20 detectors out of the 60) will be cut in Barcelona (plasma etching at the edge) The development and prototyping of the sensor has reached a mature stage to move towards the production phase. The pre- series run for the Planar Edgeless with CTS is ongoing. For the Edgless with 3D Edge pre-series later in the year

4. G. Ruggiero / TOTEM 4 Pre-Series Run of the CTS: the detector Strips (sensitive volume) Cut line Insensitive edge (47μm) Current Terminating Structure Voltage Terminating Structure Edgeless Side The detectors of the pre-series will have the same sensitive area, pitch adaptation on the device, alignment marks and identification pads of the detectors foreseen for the mass production and can be employed in the experiment.

5. G. Ruggiero / TOTEM 5 Pre-Series Run of the CTS : identification and numbering Binary Coding Pitch Adapter with numbered double bonding pads Identification The Identification of each detector will be made with a set of 8 pads marked following a binary code As in the prototype version the pitch adaptation to the chip will be made in the detector. The pitch adapter will be ended by a double array of bonding pads. Their numbering will ease the strip identification during their inspection.

6. G. Ruggiero / TOTEM 6 Detectors from pre-series run  Detailed electric study Acceptance tests also in view of a definition of the QA test for the mass production Acceptance tests also in view of a definition of the QA test for the mass production Contribution from Jan Bohm from Praha (Automatic Setup for single channel probing used for the ATLAS SCT) Contribution from Jan Bohm from Praha (Automatic Setup for single channel probing used for the ATLAS SCT)  Requests from the EDR Aging (and radiation?) studies. Do we do it with APV25 or we wait for the VFAT and integrate it in the TESTBEAM Aging (and radiation?) studies. Do we do it with APV25 or we wait for the VFAT and integrate it in the TESTBEAM  Fulfil the requirements for the 2006 Test Beam

7. G. Ruggiero / TOTEM 7 Mounting/Alignment of the Si detectors on the hybrid The old solution of Si detector mounted on PCB hybrid with a Cu frame discarded (lack of precision, stability and low thermal performance) Collaboration with the CERN PH-DT2 group definition of the new hybrid. alignment strategy on the hybrid and of the full package of detectors in the RP Mechanical jig used for the 2004 Testbeams