1. TWEPP Paris, 09 Radiation Tests on the complete system of the instrumentation electronics for the LHC Cryogenics at the CNGS test facility Evangelia Gousiou CERN TE CRG

2. Outline o Overview of the Cryogenic Instrumentation Electronics o Radiation tolerance strategy o CNGS Test Facility o Test Setup o Test Results o Conclusions

3. Outline o Overview of the Cryogenic Instrumentation Electronics o Radiation tolerance strategy o CNGS Test Facility o Test Setup o Test Results o Conclusions

4. The Cryogenic Instrumentation Electronics o ~10.000 electronic boards assembled in ~800 crates, all around the LHC tunnel and in “protected areas”. Conditioners: measure temperature, pressure, He level Actuators: AC and DC electrical heaters o All electronics will be subject to radiation (ionizing, non-ionizing dose and SEE). o Manufactured mainly with COTS that have been prequalified, since space or military technologies were incompatible with the project budget. ->-> Replacements foreseen during maintenance campaigns.

5. Conditioner Channels Architecture Conditioner card (holds 2 independent channels) ASIC ADC FPGA MUX ASIC ADC FPGA Temp. Sensor Pressure Sensor

6. ASIC ADC FPGA MUX ASIC ADC FPGA Conditioner Channels Architecture ASIC ADC FPGA MUX ASIC ADC FPGA Conditioner card (holds 2 independent channels) ASIC ADC FPGA MUX ASIC ADC FPGA MUX FPGA WFIP Communication card (for up to 7 cards) WorldFIP AGENT SRAM Temp. Sensor Pressure Sensor

7. ASIC ADC FPGA MUX ASIC ADC FPGA Conditioner Channels Architecture ASIC ADC FPGA MUX ASIC ADC FPGA Conditioner card (holds 2 independent channels) ASIC ADC FPGA MUX ASIC ADC FPGA MUX FPGA WFIP Communication card (for up to 7 cards) WorldFIP AGENT SRAM WorldFIP FIELDBUS Temp. Sensor Pressure Sensor

8. ASIC ADC FPGA MUX ASIC ADC FPGA Conditioner Channels Architecture ASIC ADC FPGA MUX ASIC ADC FPGA Conditioner card (holds 2 independent channels) ASIC ADC FPGA MUX ASIC ADC FPGA MUX FPGA WFIP Communication card (for up to 7 cards) WorldFIP AGENT SRAM WorldFIP FIELDBUS Features for high accuracy o Continuously auto-calibrated system: Comparison with a reference on each measurement for gain drift correction. Voltage polarity inversion on each measurement for offset correction. Excitation current inversion for compensation of thermocouple effects. Features for high accuracy Temp. Sensor Pressure Sensor

9. Outline o Overview of the Cryogenic Instrumentation Electronics o Radiation tolerance strategy o CNGS Test Facility o Test Setup o Test Results o Conclusions

10. Radiation tolerance strategy Components Selection o Rad-hard ASIC, Voltage Regulator developed at CERN o Anti-fuse FPGA o WorldFIP agent using signal transformer rather than optical insulators o Radiation tests on COTS in dedicated test facilities

11. Radiation tolerance strategy Mitigation Techniques o Triple module redundancy on FPGA logic o Frequent refreshment of WorldFIP agent’s SRAM memory to reduce error probability o Overdesign of power supplies and thermal dissipators 1s 20ms WorldFIP FIELDBUS 1s WorldFIP Communication Card Conditioner Card FPGA SRAM Components Selection o Rad-hard ASIC, Voltage Regulator developed at CERN o Anti-fuse FPGA o WorldFIP agent using signal transformer rather than optical insulators o Radiation tests on COTS in dedicated test facilities

12. Radiation Test Campaigns LHC Tunnel Electronics o Tests in dedicated test facilities for all the components (ITN-Portugal, UCL-Belgium, PSI-Switzerland, CERN-Switzerland). Protected Areas Electronics o Radiation levels underestimated -> -> Electronics not designed to stand radiation. The test campaign at CNGS aims at Validating the performance of the complete systems for both cases (tunnel and protected areas).

13. Outline o Overview of the Cryogenic Instrumentation Electronics o Radiation tolerance strategy o CNGS Test Facility o Test Setup o Test Results o Conclusions

14. Why CNGS? o Tests of complete systems (crates) o Exposure to LHC-like radiation field o Good knowledge of radiation levels from simulations and real time monitoring o Free of charge!

15. The CNGS Test Facility Proton Beam 2ndary Beam Graphite Target Particle Shower...... Neutrino Beam Main Tunnel Service Gallery CERN Gran Sasso (Italy) Ducts

16. Graphite Target Particle Shower...... Main Tunnel Service Gallery CERN Ducts The CNGS Test Facility DUT Proton Beam 2ndary Beam Neutrino Beam Gran Sasso (Italy)

17. Gran Sasso (Italy) We are provided with o Mains o WorldFIP Communication o Real Time Rad Monitors o 2 x 48pins Connectors Proton Beam 2ndary Beam Graphite Target Particle Shower...... Neutrino Beam Main Tunnel Service Gallery CERN Ducts DUT The CNGS Test Facility Ctrl Room … … 2km

18. Outline o Overview of the Cryogenic Instrumentation Electronics o Radiation tolerance strategy o CNGS Test Facility o Test Setup o Test Results o Conclusions

19. Equipment to Test o 2 Cryogenic Instrumentation Crates fully equipped with Conditioners, Actuators, Communications and Power Supply Cards: o 25 Cards (=50 channels) of LHC tunnel electronics o 8 Cards (=16 channels) of “protected areas” electronics

20. Test Setup o Testing conditions: Fixed loads to conditioner channels Fixed set points to actuator channels 4 thermometers in different locations o On line measurements on DUT: WorldFIP data as in the LHC control system Current Consumption and Voltage Levels

21. Testing Periods o 1 month dry run tests to confirm electronics and measurements reliability. + o 1.5 months at low dose radiation station: o 1.5 months at high dose radiation station:

22. Outline o Overview of the Cryogenic Instrumentation Electronics o Radiation tolerance strategy o CNGS Test Facility o Test Setup o Test Results o Conclusions

23. Protected Areas Electronics o Cumulative effects failures: -> Failing component: Solid state relay ->-> Solutions for the LHC: Moving of electronics, shielding of protected areas. o Same results for 6 channels and reproduced in two different CNGS locations. 0.3 1. AC Heater Actuators Overview

24. Protected Areas Electronics 1MeV (cm -2 ) 2e10 4e10 6e10 8e10 1e11 1.2e11 1.4e11 TID (Gy ) 2 4 6 8 10 Power on load

25. Protected Areas Electronics 1MeV (cm -2 ) 2e10 4e10 6e10 7.3e10 1e11 1.2e11 1.4e11 TID (Gy ) 2 4 5 6 8 10 Power on load

26. Protected Areas Electronics FPGA Solid State Relay Mains Set point Failing Component 1. AC Heater Actuators

27. Protected Areas Electronics FPGA Solid State Relay Mains Set point Failing Component 1. AC Heater Actuators

28. Protected Areas Electronics o Cumulative effects failures: -> Failing component: DC-DC converter; plans for tests in dedicated test facilities. 4 o Same results for 12 channels and reproduced in two different CNGS locations. 2. Insulated Temperature Conditioners Overview (I)

29. Protected Areas Electronics TID (Gy ) Current Consumption (A) 70 2

30. o Single Event Upsets: -> Failing component: Digital Isolator ->-> Mitigation Technique for LHC: soft reset automatically forced by the control system; No influence on proper operation of the machine. Protected Areas Electronics o Same results for 12 channels and reproduced in two different CNGS locations. 6 2. Insulated Temperature Conditioners Overview (2)

31. Protected Areas Electronics FPGA Digital Isolation Amplifier PT 100 Analog Isolation Amplifier measurement ctrl signals ……………………….. = Sensor Resistance ASIC ctrl signal 4 wire measurement 2. Insulated Temperature Conditioners SEE occurrence

32. Protected Areas Electronics FPGA Digital Isolation Amplifier 50 Ω Analog Isolation Amplifier ASIC 100μA 1 1 5mV 100μA...................... = 50 Ω 2. Insulated Temperature Conditioners SEE occurrence

33. Protected Areas Electronics FPGA Digital Isolation Amplifier 50 Ω Analog Isolation Amplifier ASIC 100μA 1 1 5mV 0,5mV 100μA...................... = 5 Ω 0 10μA 0,5mV o A soft remote Reset brings the situation back to normal. o Cross section calculation: 2. Insulated Temperature Conditioners SEE occurrence

34. Tunnel Electronics Overview o Tunnel electronics have received till now a cumulated dose of:..and the tests are still ongoing! o No Single Event Errors! o Still within specs in output accuracy! >10

35. 51 48 TID (Gy) Resistance (Ω) Tunnel Electronics 50

36. Tunnel Electronics 0 10 20 40 60 80 100 120 51 +0.3% Design Specs -0.3% 48 TID (Gy) Resistance (Ω) 50

37. Tunnel Electronics Overview o No SEE! o Still within specs in output accuracy! o BUT! Gain drifts already observed and corrected by auto calibration features. o Tunnel electronics have received till now a cumulated dose of:..and the tests are still ongoing! >10

38. Tunnel Electronics Sensor Voltage Reference Voltage V ref = G*I*R ref V sens = G*I*R sens

39. Tunnel Electronics Sensor Voltage Reference Voltage V ref = G*I*R ref V sens = G*I*R sens

40. Tunnel Electronics Sensor Voltage Reference Voltage V ref = G*I*R ref V sens = G*I*R sens 51 48 V ref R sens =R ref V sen 50

41. Outline o Overview of the Cryogenic Instrumentation Electronics o Radiation tolerance strategy o CNGS Test Facility o Test Setup o Test Results o Conclusions

42. Conclusions o CNGS testing has provided quantitative knowledge about the radiation tolerance of our complete system. o Confirmation of LHC tunnel electronics reliability. o Identification of protected areas electronics weaknesses. o First approach of possible solutions.

43. Conclusions o CNGS testing has provided valuable knowledge for all our electronics o Further tests on specific components need to be performed o Optimism in the case of tunnel electronics o Multiple solutions for the protected areas electronics problems o Thank you for your attention

44. o CNGS testing has provided valuable knowledge for all our electronics o Further tests on specific components need to be performed o Optimism in the case of tunnel electronics o Multiple solutions for the protected areas electronics problems Conclusions o Thank you for your attention

45. TWEPP Paris, 09 Extras

46. Voltage & Current Measurements o In order to probe and gain access to the Current Consumption and Voltage Level signals, modification needed to be done on the Power Supply Card The Power Supply Card receives the mains and provides channels of DC Voltage for all the Cards in a Crate A 1Ω robust resistance inserted in series in the tracks of the Power Card I V 1 Ω1 Ω

47. Voltage & Current Measurements o In order to probe and gain access to the Current Consumption and Voltage Level signals, modification needed to be done on the Power Supply Card The Power Supply Card receives the mains and provides channels of DC Voltage for all the Cards in a Crate A 1Ω robust resistance inserted in series in the tracks of the Power Card I V 1 Ω1 Ω

48. Cryogenic Instrumentation Conditioner Channels Architecture High Accuracy main features o Auto-calibrated System: high precision resistor measured every time a variable measurement is taken and correction of amplifier offset by amplifier input inversion as well as correction of cable TC effects by current inversion. ASIC ADC FPGA MUX WorldFIP FIELDBUS MUX FPGA Conditioner Card (holds 2 independent channels) WFIP Communication Card (holds up to 7 Cards) WorldFIP AGENT SRAM ASIC ADC FPGA MUX ASIC ADC FPGA Pressure Sensor PT 100 Pressure Sensor ASIC

49. Cryogenic Instrumentation Conditioner Channels Architecture High Accuracy main features o Auto-calibrated System: high precision resistor measured every time a variable measurement is taken and correction of amplifier offset by amplifier input inversion as well as correction of cable TC effects by current inversion. ASIC ADC FPGA MUX WorldFIP FIELDBUS MUX FPGA Conditioner Card (holds 2 independent channels) WFIP Communication Card (holds up to 7 Cards) WorldFIP AGENT SRAM ASIC ADC FPGA MUX ASIC ADC FPGA Pressure Sensor PT 100 Pressure Sensor high precision resistor ASIC V sens = G*I*R sens

50. Conditioner Card (holds 2 independent channels) ASIC PT 100 Cryogenic Instrumentation Conditioner Channels Architecture High Accuracy main features o Auto-calibrated System: high precision resistor measured every time a variable measurement is taken and correction of amplifier offset by amplifier input inversion as well as correction of cable TC effects by current inversion. ASIC ADC FPGA MUX WorldFIP FIELDBUS MUX FPGA WFIP Communication Card (holds up to 7 Cards) WorldFIP AGENT SRAM ASIC ADC FPGA MUX FPGA Pressure Sensor Pressure Sensor high precision resistor V sens = G*I*R sens V ref = G*I*R ref ASIC

51. Conditioner Card (holds 2 independent channels) ASIC PT 100 Cryogenic Instrumentation Conditioner Channels Architecture High Accuracy main features o Auto-calibrated System: high precision resistor measured every time a variable measurement is taken and correction of amplifier offset by amplifier input inversion as well as correction of cable TC effects by current inversion. ASIC ADC FPGA MUX WorldFIP FIELDBUS MUX FPGA WFIP Communication Card (holds up to 7 Cards) WorldFIP AGENT SRAM ASIC ADC FPGA MUX FPGA Pressure Sensor Pressure Sensor amplifier input inversion V + sens = V off + G*I*R sen ASIC

52. Conditioner Card (holds 2 independent channels) ASIC PT 100 Cryogenic Instrumentation Conditioner Channels Architecture High Accuracy main features o Auto-calibrated System: high precision resistor measured every time a variable measurement is taken and correction of amplifier offset by amplifier input inversion as well as correction of cable TC effects by current inversion. ASIC ADC FPGA MUX WorldFIP FIELDBUS MUX FPGA WFIP Communication Card (holds up to 7 Cards) WorldFIP AGENT SRAM ASIC ADC FPGA MUX FPGA Pressure Sensor Pressure Sensor amplifier input inversion V + sens = V off + G*I*R sen V - sens = V off + G*I*R sen ASIC

53. Conditioner Card (holds 2 independent channels) ASIC PT 100 Cryogenic Instrumentation Conditioner Channels Architecture High Accuracy main features o Auto-calibrated System: high precision resistor measured every time a variable measurement is taken and correction of amplifier offset by amplifier input inversion as well as correction of cable TC effects by current inversion. ASIC ADC FPGA MUX WorldFIP FIELDBUS MUX FPGA WFIP Communication Card (holds up to 7 Cards) WorldFIP AGENT SRAM ASIC ADC FPGA MUX FPGA Pressure Sensor Pressure Sensor TC effects V I+ sens = G * (I*R sens +V TC ) V I- sens = G * (-I*R sens +V TC ) ASIC V TC + -