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May 2013 Tensilica Overview. Copyright © 2013, Tensilica, Inc. All rights reserved. 2 Tensilica At a Glance Market Focus Mobile wireless and Infotainment.

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Presentation on theme: "May 2013 Tensilica Overview. Copyright © 2013, Tensilica, Inc. All rights reserved. 2 Tensilica At a Glance Market Focus Mobile wireless and Infotainment."— Presentation transcript:

1 May 2013 Tensilica Overview

2 Copyright © 2013, Tensilica, Inc. All rights reserved. 2 Tensilica At a Glance Market Focus Mobile wireless and Infotainment Market Segments Baseband PHY and MAC, Audio/Voice, Video/ Imaging Semicustom Solutions: customized dataplane processors for many other markets SSD/storage, printers, cameras, network infrastructure/access, & more Business Model – Semiconductor IP licensing 200+ Licensees worldwide Over 2 Billion cores shipped! Run rate ~1B cores/yr. >1,000 different cores generated and in silicon Licensed by 8 of the top 12 semiconductor manufacturers Designed into 7 of the top 12 Smartphone manufacturers’ products Licensed by #1, #2, #3 and #4 DTV system companies Company Facts Fastest Growing IP Company: ~29% CAGR 2009-2011. Profitable. #1 Supplier of DSP IP in Q4’12!! >200 licensees ( 55+ in Audio) Over 210 employees including 27 PhDs HQ in Santa Clara, CA; satellite development centers in India & China 48 International technology patents; 24 additional patents pending

3 Copyright © 2013, Tensilica, Inc. All rights reserved. 3 10-100x better performance than DSP/CPUs Tensilica DPUs Deliver Higher Performance Performance + Programmability at Lower Power / Lower Cost Strengths Control-oriented, Software Development Strengths SIMD, VLIW, Stream processing Strengths Task-specific, Differentiating, Direct point-to-point interfaces. CPU Strengths DSP Strengths Custom Strengths Dataplane Processor Unit 10-100x better performance than DSP/CPUs Better control and tools than DSPs More flexible than custom logic

4 Copyright © 2013, Tensilica, Inc. All rights reserved. 4 Dataplane “Compute & Throughput” Control plus DSP High Performance High Throughput Low Power “DPU” - Dataplane Processor Unit Dataplane “Compute & Throughput” Control plus DSP High Performance High Throughput Low Power “DPU” - Dataplane Processor Unit Programmability in the Dataplane What is the Dataplane? Multi-standard support, rapid evolution & shorter time-to-market drive increasing need for programmability in the Dataplane ARM intel Control Plane “Control code & Operating Systems” Control Plane “Control code & Operating Systems”

5 Copyright © 2013, Tensilica, Inc. All rights reserved. 5 Xtensa – Full Development Automation Optimizing Cores with Complete Software Tools in Minutes Xtensa Processor Generator* Use standard ASIC/COT design techniques and libraries for any IC fabrication process Complete Hardware Design Source pre-verified RTL, EDA scripts, test suite Customized Software Tools C/C++ compiler Debuggers, Simulators, RTOSes 1. Select from menu 2. Explicit instruction description (TIE) Processor Configuration Processor Extensions in minutes!Iterate… * US Patent: 6,477,697

6 Copyright © 2013, Tensilica, Inc. All rights reserved. 6 Common DPU Platform Across Multiple Applications – Example: Mobile Wireless Image and Video Post Processing Audio and Portable Media Player/Music Advanced Noise Reduction Voice Processing Satellite / Terrestrial Video Demodulation Multi-Standard Internet Video Decoding LTE Baseband DSP GPS Bluetooth Mobile Wi-Fi Wireless USB Camera Image Pre- Processing User Authentication Still Image Compression /Decompression Functions Using Tensilica DPUs in Mobile Wireless Systems Today

7 Copyright © 2013, Tensilica, Inc. All rights reserved. 7 Market Focus Mobile Wireless & Home Entertainment Games Digital Cameras Auto InfoTainment Printers Network Infrastructure Network Access Storage PC Graphics Home Entertainment DTV STB Blu-ray Receiver Mobile Wireless SmartPhone Wireless BaseStation Samsung Galaxy-S iPhone 4 Blackberry Bold 9780 Fujitsu LTE F-01D Android Tablet UltraBooks

8 Copyright © 2013, Tensilica, Inc. All rights reserved. 8 Market Focus Mobile Wireless & Home Entertainment Home Entertainment Mobile Wireless Intel Showing some of our publically announced customers, many others are unannounced

9 Copyright © 2013, Tensilica, Inc. All rights reserved. 9 Xtensa DPU Technology Foundation Xtensa Architecture, Development Tools, 3 rd Party Ecosystem Product Focus All Based Upon a Common Platform

10 Copyright © 2013, Tensilica, Inc. All rights reserved. 10 How Have Tensilica Customers Benefitted? By Making More Competitive Products Through… Differentiation Customers are able to implement their own IP with less effort Easy customization -> harder for competitors to copy Automatic tools to optimize/customize implementations Reduced Time To Market Dramatically less verification time One architecture, many applications Single integrated development tool Flexibility Programmable solution Make changes after tape-out Add new features to prolong life Best Performance/Power/Area Optimized for application’s performance, power and size Directly connect to other RTL Wide solution range from micro DPU to high-performance DPU/DSP

11 Copyright © 2013, Tensilica, Inc. All rights reserved. 11 Testimonials Tier 1 Companies Confirm Our Benefits “Tensilica’s DPUs helped us pack the LTE functions in a small and power-efficient footprint, and they contributed greatly to the efficient implementation and first-time silicon success of our LTE chip.” “We also achieved a faster time to market and gained post-silicon flexibility due to programmability without sacrificing power or area efficiency.” Toshio Miki Associated Senior Vice President & Managing Director of Communication Device Development Department of NTT DOCOMO “We conducted a thorough review and evaluation of licensable DSP IP cores before selecting Tensilica.” “Tensilica’s unique ability to combine world-class DSP capability with the flexibility and customization of the Xtensa DPUs gives HiSilicon the opportunity to strongly differentiate our products.” “We feel this will give us a strong competitive advantage.” Teresa He Vice President of HiSilicon Huawei's silicon arm


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