1. RBSP Radiation Belt Storm Probes RBSP Radiation Belt Storm Probes RBSP/EFW I-PER 21 January 2011 43 EFW Systems Engineering Michael Ludlam Space Sciences Laboratory University of California, Berkeley

2. RBSP/EFW I-PER 21 January 2011Michael Ludlam 44 Introduction Overview Block Diagram Instrument Status Instrument Interfaces Instrument ICD Changes since CDR Grounding Diagram Documentation Process Deliverable Documentation Limited Life Items Deviations / Waivers Problem Failure Reports (PFR’s).

3. RBSP/EFW I-PER 21 January 2011Michael Ludlam 45 Instrument Block Diagram

4. RBSP/EFW I-PER 21 January 2011Michael Ludlam 46 Instrument IDPU AXB (1 of 2), Stowed SPB (1 of 4), Stowed

5. RBSP/EFW I-PER 21 January 2011Michael Ludlam 47 Booms Deployed Four 40-50m Spin Plane Booms (SPB) Two 6m Axial Booms (AXB) Spin Plane Boom Deployment Unit (1 of 4) Axial Boom Deployment Unit (1 of 2)

6. RBSP/EFW I-PER 21 January 2011Michael Ludlam 48 Instrument Status All IDPU boards have completed board level testing. Both IDPU units have been integrated. Calibration and Instrument functionality testing now complete. Instrument meets performance requirements. Boards have recently been cleaned, staked and coated. All boom units are fully qualified except 1 AXB (SN_004) requires a workmanship vibration after PFR fix.

7. RBSP/EFW I-PER 21 January 2011Michael Ludlam 49 Instrument Interfaces Mechanical –AXB ICD: RBSP-AXB-ICD-001 –SPB ICD: RBSP-SPB-ICD-001 –IDPU ICD: RBSP-IDP-ICD-500C Electrical –All electrical interfaces are through the EFW IDPU. –3 30V power interfaces (Instrument Power, SPB Deploy, AXB Deploy) –1 data interface (LVDS Serial data interface) –All controlled by the signed off EFW ICD (7417-9083B) Thermal –IDPU is thermally coupled to the S/C via Cho-seal. –Booms are thermally coupled directly to the S/C.

8. RBSP/EFW I-PER 21 January 2011Michael Ludlam 50 Interface Testing Mechanical –Axial Boom Tubes test fitted on S/C. –SPB ICD has not changed since CDR. –IDPU ICD has not changed since CDR. Electrical –IDPU has been using S/C Emulator since ETU development. –Recently received the voltage swing adjustment dongle for the LVDS interface. No problems with interface when using this. –No test conducted with Engineering S/C IEM, first time that interface will be verified using S/C IEM will be after delivery. –Power interface turn on circuit contained in EMECP. Circuit was assembled for testing and will be used for instrument inrush measurements (LVPS has already made inrush measurements using large capacitor on power supply output)

9. RBSP/EFW I-PER 21 January 2011Michael Ludlam 51 ICDs Spacecraft to EFW ICD released and signed off (7417-9083) –No open issues. EFW Subsystem specifications define interfaces between subsystems –Axial Boom specification – RBSP_EFW_AXB_001C –Spin Plane Boom specification – RBSP_EFW_SPB_001A –Each IDPU board has specification (DCB, BEB, DFB, LVPS) –IDPU Backplane specification holds details on the board interfaces

10. RBSP/EFW I-PER 21 January 2011Michael Ludlam 52 Changes since CDR No major changes to the design since CDR. Changes to design are controlled by Engineering Change Notices (ECN’s). ECN’s are tracked and held by SE. There have been 64 ECN’s – 31 since the last review (Boom PER). These have all been small changes - e.g. correction of part number in Bill of Materials, or resistor value change.

11. RBSP/EFW I-PER 21 January 2011Michael Ludlam 53 Grounding Diagram PREAMP CHASSIS EFW Operational Power VOUT VIA BACKSHELL CHASSIS USHER, GUARD DIRECT BONDING or GROUND STRAP - TBD VIA BACKSHELL EMFISIS Drivers / Recievers EFW SPB Deploy Power, EFW AXB Deploy Power +28V GND V 28V RET - + DC MOTOR CHASSIS S/C Data Interface VIA BACKSHELL CHASSIS 6x CHASSIS VIA BACKSHELL VIA BACKSHELL ACTUATOR 3x V GND-FLT V-FLT GND CHASSIS V FLOATING LVPS SENSE CHASSIS V EFW IDPU GND-FLT VIA BACKSHELL LVDS Driver/Recievers EMFISIS Data Interface CHASSIS VIA BACKSHELL WIRE BOOM / STACER CHASSIS LVPS V SPB (4x), AXB (2x) SPHERE S/C Power Interface

12. RBSP/EFW I-PER 21 January 2011Michael Ludlam 54 Documentation EFW Configuration Management Plan RBSP_EFW_PA_010 –Document details how documentation and flight hardware is controlled at UCB. –Specifications and Requirements are controlled by the Systems Engineer. Documents are stored on SSL site of record, where only the SE posts revisions and updates. All assembly, test and integration procedures are signed off by lead engineer and QA. Procedures where requirements are verified are also signed by the SE. Data review of test procedures where requirements are verified has sign off by QA and SE.

13. RBSP/EFW I-PER 21 January 2011Michael Ludlam 55 Deliverable Documentation Current versions of deliverables: –MA-001-007 PA Matrix –MA-002 FMEA –MA-002-009 Limited Life Items –MA-005 Parts List –MA-006 Instrument Safety Data Inputs –SE-001 IRD –SE-002 ICD –SE-006 Instrument Users Manual –SE-007 Materials List –SW-002 SRD –TE-001 Test, Verification, Validation & Calibration Plan –TE-004 Instrument on S/C Test Plan All deliverables up to date.

14. RBSP/EFW I-PER 21 January 2011Michael Ludlam 56 Limited Life

15. RBSP/EFW I-PER 21 January 2011Michael Ludlam 57 Deviations/ Waivers 33 waivers and deviations to date. 12 new waivers/deviations submitted since BoomPER 2 withdrawn 8 approved and closed. 2 need extra information to CCB.

16. RBSP/EFW I-PER 21 January 2011Michael Ludlam 58 Problem Failure Reports Status 60 Raised 46 Closed. 14 remain open or are in the process of being closed. Of the 14 that remain open: 1 requires a workmanship vibration shake on AXB SN_004 to close 6 in signature cycle process 2 other AXB fixed, but looking for better solutions. 2 raised last week on workmanship issues – DCB, LVPS. 2 SPB fine wire and shorter deploy length. 1 DCB PROM issue

17. RBSP/EFW I-PER 21 January 2011Michael Ludlam 59 Backup Slides Budgets

18. RBSP/EFW I-PER 21 January 2011Michael Ludlam 60 Mass Budget Needs IDPU updates after board coating and staking.

19. RBSP/EFW I-PER 21 January 2011Michael Ludlam 61 Power Budget Not to exceed value is 11.16W Typical power usage at 30V 10-11W. Full characterization of power will occur during thermal vacuum – at different temperatures and voltages.

20. RBSP/EFW I-PER 21 January 2011Michael Ludlam 62 Telemetry Budget Proportions of real time data and playback of burst are adjustable to keep within 12kbps budget.