1. Mike Capell / Jan ‘04AMS-02 Electronics1 AMS-02 Avionics FSR-II (21 May 2007) Mike Capell Avionics Lead Senior Research Scientist ISS: 108x80m 420T 86KW 400km AMS: 3x3x3m 6T 2.3+KW 3+ years

2. Mike Capell / May ‘07AMS-02 Electronics2 Subdetector Requirements: Summary SubdetectorReq’mentsChannelsRaw Kbits U: TRDGas gain5,24884 S: ToF+ACC100 ps48*4*849 T: Trackerfew fC196,6083,146 R: RICHSingle g 680*16*2348 E: ECAL1:60,000324*(4*2+1)47  Raw Kbits/event 3,674 * Event Rate≤ 2 Khz = Total Raw Data Rate~7 Gbit/sec 7 Gbit/sec >> 2 Mbit/sec ⇒ Restrict Rate & Size Specify, design, develop, produce: High Speed, High Capacity, Low Power, Low Weight, Reliable Signal & Data Processing ON ORBIT !

3. Mike Capell / May ‘07AMS-02 Electronics3 Subdetector specific front ends (5 types, 1600 units) Common DAQ nodes (1 type, 300 units) General purpose computers with specialized interfaces (4x redundant) Trigger system to meter data flow. Data Acquisition & Trigger Scheme DAQ Intermed. DAQ Digitization Preperation Signal Trigger FastLevel -3 Level Detector Front End Output Buffer &Top Level

4. Mike Capell / May ‘07AMS-02 Electronics4 NASA AMS Electrical Interfaces on ISS Power: 109-124VDC 2KW max LRDL 1553B Bus 1 Kbit/s in 10 Kbit/s out 10 B/sec CHD HRDL Taxi F/O orbit xRDL: Duty cycle ~50-70% Ensure AMS side of interfaces conform to NASA requirements & Command Monitoring EventData Earth TDRS LRDLHRDL UMA EVA International Space Station M&C Power Subsystems Power & Thermal DAQ & Trigger Monitor & Control Electrical Interfaces AMS POCC

5. Mike Capell / May ‘07AMS-02 Electronics5 Electronics Designed for Low Earth Orbit Challenges: Static loads:40+10+10g Vibration:6.8g rms Depressurization: 1 to 0 atmosphere in 2 min. 0 g & Vacuum: No convection, outgassing (evaporation) Operational Range: -20 to +50 C operational Ionizing Radiation: ~ 1 Krad/year Heavy Ions (SEE): latch ups, bit flips Atomic O, Solar UV:Etching & Aging MM/OD(Space Junk):Impact Electromag. Compat:with ISS, within AMS AMS Magnetic Field:several hundred Gauss NO ACCESS:3+ years

6. Mike Capell / May ‘07AMS-02 Electronics6 Electronics Designed for Low Earth Orbit Challenges:Solutions: Static loads:Mechanical Design Vibration:Mechanical Design Depressurization: Mechanical Design 0 g & Vacuum: Materials, Thermal Management Operational Range: Components, Thermal Management Ionizing Radiation: Component Selection Heavy Ions (SEE): Comp Sel, Beam Tests, Protection Atomic O, Solar UV:Materials MM/OD(Space Junk):Mechanical Design Electromag. Compat:Shielding, Grounding AMS Magnetic Field:Selection & Test NO ACCESS:Redundancy, Reliability, TEST, TEST, TEST Process validated with AMS-01 electronics

7. Mike Capell / May ‘07AMS-02 Electronics7 AMS-01 Electronics: Qualification

8. Mike Capell / May‘07AMS-02 Electronics8 AMS-01 Electronics: Typical board

9. Mike Capell / May ‘07AMS-02 Electronics9 Process to transform electronics from High Energy Physics for use in Low Earth Orbit Prototype EM QM1 QM2 FM, FS (==QM2) functional + Vibration, Thermal + Thermal- Vacuum, EMC, Prod. All (min level) Models Testing Components Performance, Beam Test

10. Mike Capell / May ‘07AMS-02 Electronics10 GSI Heavy Ion Beam Test Setup: Main Computer components CPC 700 Bridge PPC 750 CPU Ion Beam Direction GSI Heavy Ion Accelerator

11. Mike Capell / May ‘07AMS-02 Electronics11 Reliability Thermal requirements (-40 to +85 C) test Space use heritage, fabrication process technology Single lot procurement & Screening Total dose (600 Rad/year) test Single Event Effects – Latch-ups & Upsets:test Design modified for some components for:retest Latch-up & Bit flip protection. AMS-02 Electronics Component Selection DateLocationIonsLET MeV/mg/cm 2 Test/Pass Nov’00GSI, Darmstadt Xe, Au, U6-5921 / 11 Nov’01GSI, Darmstadt Kr, Au3-4019 / 18 Dec’01GSI, Darmstadt U19-307 / 4 May’02GSI, Darmstadt U16 - 5933 / 29 Feb’03LNS, Catania Kr27 - 396 / 5 May’05GSI, Darmstadt Au12 - 3337 / 32 Sep’05Indianap1 - 1411 / 5

12. Mike Capell / May ‘07AMS-02 Electronics12 AMS Custom/Common Readout Unit Cust/Comm power supplies w/high efficiency. Cust/Comm monitor & control interfaces. Cust/Comm processing unit, software, links. DSP (ADSP-2187L), Gate Array (Actel A54SX-2A), SRAM (Samsung K6R-016V1C), Flash (AMD Am29LV004), LVDS Tx/Rx (TI SN65LVD-39-), etc.

13. Mike Capell / May ‘07AMS-02 Electronics13 Data Acquisition Tree (parallel, independent tree for trigger) x4 redundant 10 MB/s serial links

14. Mike Capell / May ‘07AMS-02 Electronics14 JT-Crate Connects about ~ 200 signal cables.

15. Mike Capell / May ‘07AMS-02 Electronics15 Data Reduction (UDR2, TDR2) Boards 70 types of boards 454 boards total Where to put them ?

16. Mike Capell / May ‘07AMS-02 Electronics16 Electronics Mechanics– Crates & Boxes on Radiators 1. Keep heat away from Magnet 2. Temp range of electronics >> detectors 3. Shortest path to radiators

17. Mike Capell / May‘07AMS-02 Electronics17 Ram Radiator (~4m 2 ) Electronics ~ 750W “xPD” “x-Crate” 28VDC to LV readout & monitoring Each type of box optimized for weight vs. thermal vs. structural performance. Design and test supported by NSPO, Taiwan x=E,J,S,T,TT,U,UG,…

18. Mike Capell / May ‘07AMS-02 Electronics18 Electronics Production & Quality Assurance Designed by Academia Sinica, CSIST & MIT Adapted for particular subdetectors by Aachen, Geneva, Perugia, Bologna, Madrid, Annecy, Pisa, … Most electronics produced at CSIST: High Reliability (Mil Spec) infrastructure, Qualification: Vibration, Thermal, EMC on site Team of 25 engineers and 40 technicians Quality assured by NASA & AMS team reviews every 3 months. Testing & Qualification by board designers

19. Mike Capell / May ‘07AMS-02 Electronics19 Recent Board Tests at CSIST Jesus & Antonio test DC-DC (July) Lucio testing TBS & TPSFE (July) Sylvie & Nadia testing EIB (July) Daniel testing TDR2 (June) Sandor testing DCDC with Wang & Liu (June)

20. Mike Capell / Jan ‘07AMS-02 Electronics20 Thermal Stress Screening

21. Mike Capell / Jan ‘04AMS-02 Electronics21 J-Crate Scheme & test setup 4* Main Computer + Interfaces

22. Mike Capell / Jan ‘04AMS-02 Electronics22 J-Crate in Thermal Chamber Thermal Qualification Operating: -15, +60C Non-Oper: -40, +90

23. Mike Capell / Jan ‘04AMS-02 Electronics23 J-Crate inside EMI Chamber

24. Mike Capell / May ‘07AMS-02 Electronics24 J-Crate in Thermal Vacuum Tests

25. Mike Capell / May ‘07AMS-02 Electronics25 NASA AMS Electrical Interfaces on ISS Power: 109-124VDC 2KW max LRDL 1553B Bus 1 Kbit/s in 10 Kbit/s out 10 B/sec CHD HRDL Taxi F/O orbit xRDL: Duty cycle ~50-70% Ensure AMS side of interfaces conform to NASA requirements & Command Monitoring EventData Earth TDRS LRDLHRDL UMA EVA International Space Station M&C Power Subsystems Power & Thermal DAQ & Trigger Monitor & Control Electrical Interfaces AMS POCC

26. Mike Capell / May ‘07AMS-02 Electronics26 AMS-02 HRDL Interface ISS is Zero Fault Tolerant for Payloads ROEU

27. Mike Capell / May ‘07AMS-02 Electronics27 Practicing EVA cable swap at in Neutral Buoyancy Lab

28. Mike Capell / May ‘07AMS-02 Electronics28 High Rate Data Link Data Flow

29. Mike Capell / Jan ‘07AMS-02 Electronics29 PIT: Preliminary Interface Test - JSC - Jun 2003

30. Mike Capell / Jan ‘07AMS-02 Electronics30

31. Mike Capell / Jan ‘07AMS-02 Electronics31 ISIL Testing – July ’05 at JSC

32. Mike Capell / Jan ‘07AMS-02 Electronics32 AMS-02 Magnet & Cryogenics Electronics Vacuum vessel TMPs ΔT = 0.01K 4 types of Valves Many sensors Passive Phase Separator ΔT = 0.001K SFHe tank

33. Mike Capell / May ‘07AMS-02 Electronics33 2100W peak

34. Mike Capell / May ‘07AMS-02 Electronics34 Cryomagnet Current Source under test (460A)

35. AMS-02: Power System (PDS) for ISS+SSRMS+STS

36. Mike Capell / May ‘07AMS-02 Electronics36 AMS Electronics Adapted particle physics capabilities to work in low Earth orbit. Key steps Component selection & beam testing, Thermo-mechanical design, Quality assurance & Hi-rel processing, High Power (PDS), High Current(CAB) units produced by “space rated firms”, Continuous oversight/interaction with NASA/(Lockheed/LM/JS/Jacobs).