1. PITCH ADAPTER NI & AU THICKNESS. PN: LAT-DS-00370 rev 6 CMI X-Ray Fluorescence Measurement ExpressTech Santa Clara, Ca.

2. INVENTORY Teledyne ~ 80 Pitch Adapters SLAC 87 Pitch Adapters No flight TMCM’s have been manufactured using any Pitch Adapters from these two lots. MIP-1 yield is currently 0% from a production lot of 18 boards.

3. PARLEX, SAN JOSE Parlex to provide lot to lot data today. Lots manufactured early 2004 are acceptable. ExpressTech has always been the plater.

4. LOT 6228-01X NOV. 15, 2004 Sample size 1 Au thickness microinches: –Spread: 22.1 – 21.4 –Mean: 21.7 microinches –Dwg spec. 10 microinches Au

5. LOT 6228-01X NOV. 15, 2004 Sample size 1 Ni thickness microinches –Spread 130.3 – 168.5 –Mean 149.4 microinches –Dwg spec. 150 microinches Ni

6. LOT 5887-04 SEPT. 9, 2004 Sample size 1 Au thickness microinches –Spread: 24.9 – 30.6 –Mean: 27.8 microinches –Dwg spec. 10 microinches Au

7. LOT 5887-04 SEPT. 9, 2004 Sample size 1 Ni thickness microinches –Spread: 162.1 – 204.7 –Mean: 183.4 –Dwg spec. 150 microinches Ni