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Hervé MATHEZ IPNL CALICE Meeting CERN 12 –07-07 1 PCB with 256 RPCs pads (Status) IPNL - LAL - LLR.

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Presentation on theme: "Hervé MATHEZ IPNL CALICE Meeting CERN 12 –07-07 1 PCB with 256 RPCs pads (Status) IPNL - LAL - LLR."— Presentation transcript:

1 Hervé MATHEZ IPNL CALICE Meeting CERN 12 –07-07 1 PCB with 256 RPCs pads (Status) IPNL - LAL - LLR

2 Hervé MATHEZ IPNL CALICE Meeting CERN 12 –07-07 2 PCB 256 RPCs pads Status 1.3 PCBs with all components 2.1 PCB without components used to test the pcb Xtalk 3.encountered problems

3 Hervé MATHEZ IPNL CALICE Meeting CERN 12 –07-07 3 Dig Part64 Pads 1 32 PCB Gnd Generator Scope Shield Xtalk measurements - Setup 64 Pads Small Probe 10µm diameter

4 Hervé MATHEZ IPNL CALICE Meeting CERN 12 –07-07 4 Xtalk measurements - Setup

5 Hervé MATHEZ IPNL CALICE Meeting CERN 12 –07-07 5 PCB 8 Layers : 2 face to face paths (2 layers) Hardroc Pin 2-7 (50 Ohms to GND) Pad 21-24 Input on Rpc Pad = 2V Measure = 3.2 mV Xtalk = 0.16% Input Measure Average of Measure Xtalk measurements

6 Hervé MATHEZ IPNL CALICE Meeting CERN 12 –07-07 6 6 layers 8 layers same layer 2 diff layers Coupling Cap 50 fF/cm 120 fF/cm 120fF/cm to 1pF/cm Xtalk 0.3 % 0.4% 0.3% gnd h d w h=50µm,w=200µm,d=330µm C = 50 fF/cm gnd h d w h=200µm,w=200µm,d=330µm C = 120fF/cm gnd h h=100µm,w=200µm w Measurements results depends on shield connection Difficult to conclude what configuration is the best Xtalk < 0.5% Xtalk measurements - Conclusion

7 Hervé MATHEZ IPNL CALICE Meeting CERN 12 –07-07 7 Board with components

8 Hervé MATHEZ IPNL CALICE Meeting CERN 12 –07-07 8 Encountered Problems 1 board in test 2 HardRoc in short circuit on Analog Power Supplies :  need to be changed  40 mA/HardRoc Problems with Xilinx power supplies (tps75003) :  Need to add external voltage regulators Foot print problems with USB interface circuit :  Need to do manual connection ! SOLVED Xilinx I/O problems :  Need to add wire and change VHDL code TO BE SOLVED

9 Hervé MATHEZ IPNL CALICE Meeting CERN 12 –07-07 9 Conclusion 1.2 PCB in Fab (return from Fab next week) 2.After a fully debugging of the first board modified 2 another boards launch 3 last pcb to solder components first tests with 1 RPC connected

10 Hervé MATHEZ IPNL CALICE Meeting CERN 12 –07-07 10 Conclusion


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