1. 1 Lead-free/RoHS Compliance Roadmap customer version, April 04

2. 2Contents  Artesyn lead-free/RoHS compliance position  RoHS Overview (Restriction of Hazardous Substances)  Current status  Implementation strategy  Outline implementation plan  Implementation timeline

3. 3 Artesyn lead-free/RoHS compliance position  Artesyn will actively pursue lead-free/RoHS compliance in direct response to:  RoHS legislation enacted in Europe  Market forces  Customer requirements  RoHS implementation deadline is July 1, 2006, but customer requirements dictate Artesyn compliance in advance of this date  Compliance goal – end 2005  Earlier compliance on some products, as required by customers  Artesyn lead-free definition:  A board mounted power product is defined to be lead-free if it contains no more than 0.1% Pb by weight.  A stand-alone power product, shipped in a chassis, is defined to be lead-free if each soldered assembly within the product contains no more than 0.1% Pb by weight. The chassis and each mechanically attached component will be evaluated individually and may contain no more than 0.1% Pb by weight.

4. 4 RoHS overview  RoHS legislation bans the following materials, effective July 1, 2006: Pb – solder and component terminations Cd – cables and insulation Cr+6 – conversion coatings on sheet metal and hardware Hg – maybe no problem PBB & PBDE – brominated flame retardants in component molding compounds  Exemption for Pb in solders exists for high-end storage and telecom networking equipment but component terminations must be lead-free and most customers covered by the exemption are requiring lead- free assembly in advance of July 1, 2006 –some customers may use exemption to cover shipment of existing products nearing end-of-life on July 1, 2006

5. 5Status  Lead-free/RoHS compliance team formed 10/03  Mission: –Identification of compliance issues throughout supply chain –Implementation of RoHS compliant components and materials –Development of lead-free assembly processes –Qualification of new components, materials and processes –Reliability testing to ensure product quality  Global participation with representation from all manufacturing sites and all engineering disciplines

6. 6Status  First lead-free customer samples built in ZhongShan Jan-04:  Existing BOMs used, approximately 45% of components lead- free/RoHS compliant  OSP and ENIG lead-free PWB finishes  2-sided SnAgCu reflow process with SnAgCu hand soldering for remaining through-hole components  Reliability testing in progress Thermal shock, HASS screening completed with good results Solder joint cross-sectioning and element analysis in progress

7. 7Status  First lead-free wave soldered customer samples built in ZhongShan April-04  Through-hole-only product on single-sided PWB with OSP lead-free coating  2 sided SMT product on 4 layer PWB with ENIG lead-free coating and selective wave soldering for remaining through- hole components  Process development, sampling conducted with active participation from Tatabanya, Redwood Falls and ZhongShan manufacturing engineers  Reliability testing scheduled to begin in May

8. 8Status  Component supply chain query under way

9. 9 Implementation Strategy  Ensure backward/forward process compatibility  All finish choices must be compatible with both SnPb and SnAgCu soldering processes Components: Sn with Ni barrier PWBs: OSP, probably Shikoku Glicoat and Entek Cu106A-HT No Bi finishes or materials  Reliability testing incorporated into implementation plan  Single solder paste, wave flux for global use  Local input sought, but global control required  Implement lead-free components by QML change  Many vendors have substituted lead-free terminations without part number change  Lead-free PCN to customers

10. 10 Implementation Plan  Three integrated, but parallel plans:  Components Identify, specify and procure RoHS-free components Implement lead-free parts when available – one way change  PWB finishes Identify, specify, qualify and procure RoHS-free PWBs Ensure solderability, reliability with both SnPb and SnAgCu processes Implement lead-free PWB coatings by product after qualification  Lead-free processes Develop and qualify lead-free soldering processes Implement lead-free processes by product after successful conclusion of reliability testing

11. 11 Implementation Plan - Components  Vendor query:  RoHS free? When? Part number change?  Specify termination finish in detail: metal content by %, plating specification, including underplate thickness and annealing process if matte Sn  Identify MSL changes by exception (vendor PCN) To date, all remain MSL 1  Implement RoHS-free components by QML change  FIFO control required  Single PCN to customers – implement as available  When RoHS-free available and implemented, old parts cannot be used or reordered  Develop and qualify RoHS-free internally sourced magnetics  Lead-free terminations  Heat resistant packages (>260º C)

12. 12 Implementation Plan – PWB finishes  Customer input:  ENIG banned by many  Immersion Ag maybe  OSP preferred  OSP results to date:  Shikoku Glicoat OSP used for lead-free assembly trials to date with good results  Entek Cu106A-HT will be tested soon

13. 13 Implementation Plan – PWB finishes  OSP controlled implementation:  Verify solder joint quality with SnPb and SnAgCu processes  Verify solder joint quality with SnPb and RoHS-free component terminations  HALT testing  Thermal cycling followed by electrical test, solder joint cross-sectioning and metallurgical analysis  Implement by product

14. 14 Implementation Plan – Lead-free solder  Lead-free solder implementation: three parallel plans  SMT reflow  Wave and selective solder  Rework & repair

15. 15 Implementation Plan – Lead-free reflow  Lead-free SMT reflow  Select no-clean SnAgCu paste with distribution & technical support in China, Europe, US  Optimize profiles Upgrade factory equipment where necessary  Verify solder joint quality, minimum voiding  Reliability testing by product HALT Thermal cycling Solder joint cross-sectioning and metallurgical analysis

16. 16 Implementation Plan – Lead-free wave  Lead-free wave and selective solder  Select no-clean, lead-free compatible flux with distribution & technical support in China, Europe, US  Select bar solder alloy SAC305 used in recent trial  Upgrade or replace wave and selective solder equipment  Optimize profiles Verify solder joint quality, minimum solder balls  Reliability testing by product HALT Thermal cycling Solder joint cross-sectioning and metallurgical analysis

17. 17 Implementation Plan – Lead-free rework  Lead-free rework and repair  Select no-clean, lead-free SnAgCu wire and flux with distribution & technical support in China, Europe, US  Upgrade or replace hand solder equipment  Develop process to segregate SnAgCu and SnPb rework Ensure that SnPb soldered assemblies are reworked with SnPb Ensure that SnAgCu soldered assemblies are reworked with SnAgCu  Reliability testing by product HALT Thermal cycling Solder joint cross-sectioning and metallurgical analysis  Implement lead-free rework and repair

18. 18 Implementation Plan – customer notification  Product level PCN sent to customers when:  Lead-free PWB finish implemented  Lead-free processes qualified and implemented  Product level qualification passed Actual or by similarity  Will not claim RoHS compliance until RoHS-free BOM can be guaranteed  Reference “IPC Lead-free 2”  Final RoHS compliance statement still to be defined  Some customers will require a unique product TLA

19. 19 RoHS compliance verification  The following method is proposed for RoHS compliance verification:  Product will be ground, aqua regia leached  Presence and concentration of Cd, Cr+6, Hg, Pb identified by ICP-AES or ICP-SFMS and reported as a percentage of product weight  Presence of PBB and PBDE identified by solvent extraction and measurement by GC-MS

20. 20 Implementation Timeline

21. 21Glossary  Bi – bismuth  Cd – cadmium  Cr+6 – hexavalent chromium  ENIG – electroless nickel, immersion gold  FIFO – first in, first out  GC-MS – gas chromatography- mass spectrometry  HALT – highly accelerated life testing  HASS – highly accelerated stress streening  Hg – mercury  ICP-AES – inductively coupled plasma – optical emission spectrometry  ICP-SFMS – inductively coupled plasma – sector mass spectrometry  MSL – moisture sensitive level  OSP – organic solder preservative  Pb – lead  PBB – polybrominated biphenyl  PBDE – polybrominated diphenyl ether  PCN – process change notification  PWB – printed wiring board  QML – qualified manufacturer list  RoHS – “Reduction of Hazardous Substances” legislation  SAC305 – solder alloy containing Sn with 3% Ag by weight, 0.5% Cu by weight  SMT – surface mount technology  SnAgCu – tin-silver-copper  SnPb – tin-lead  TLA – top level assembly

22. 22Assistance  Please contact the following Lead-free/RoHS compliance team members with questions, complaints and requests for assistance:  Wayne Fitzgerald, Project manager, Youghal  Roger Brandt, CE, Tucson  Susan Johnston, Director component engineering, EDP  Kathy Teuber, ME, Westminster  Dave Widmer, Global Material System Manager/Commodity Manager, RWF  Susie Worden, Global Material System Coordinator, RWF