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Shipping/Receiving concerning the BW/FW assemblies S.Bettarini/F. Forti.

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Presentation on theme: "Shipping/Receiving concerning the BW/FW assemblies S.Bettarini/F. Forti."— Presentation transcript:

1 Shipping/Receiving concerning the BW/FW assemblies S.Bettarini/F. Forti

2 Item description Elementary part: APV: ro-chips MDet: Micron sensor Hdet: HPK sensor PA: pitch adapters – PA0 – PF1,2 (PA FW) – PB1,2 (PA BW) Origami – O-z – Oce – O+z Composite: FH: FW Hybrid Phi:PCB+6 APVs Z:PCB+4 APVs BH: BW Hybrid Phi:PCB+6 APVs Z:PCB+4 APVs FWA: FW assembly MDet+ FH Sandwich (Z+phi)+ PF1+PF2 BWA: BW assembly HDet+ BH Sandwich (Z+phi)+ PB1+PB2 LO: Loaded Origami -z,ce,+z Origami circuit+ PA0 thinned APVs Ladder: L4: FWA + BWA+ 1 HDet+ PA+ 1 LO-z L5: FWA + BWA+ 2 HDet+ PA+ 1 LO-z + 1LOce L6: FWA + BWA+ 3 HDet+ PA+ 1LO-z + 1LOce + 1LO+z

3 IPMU(Tokyo) KEK (Tsukuba) Vienna Trieste (INFN) Pisa (INFN) APV PF PB L5 FW HDet Mdet (Burn-in) Mdet (test) FWA L4,L6 BWA FLUX of the PARTS BH BWA (30%) (70%) Return empty MPCs Return empty MPCs

4 Pisa point of view At the end of the sub-assembly production nothing (i.e. no items) must remain in Pisa  all the imported goods can be in a temporarily way by IPR Import (CIF: Cost, insurance and Freight): – Hybrids from Vienna* ( o(200) single face) – Micron det’s. from Vienna ( o(50) ) – HPK Large det’s from KEK ( o(50) ) – PAs from KEK ( o(200), phi+Z) Export (CIF) FW/BW-sub-assemblies ( o(100) ): – 30% to Vienna (L5) – 70% to Tokyo (IPMU/TIFR:L6/4) (*) is expected to be the 1 st IPR procedure made by Pisa, opening the contacts with the Italian customs

5 What to do To follow custom issues the INFN-Pisa has an agreement with a local (tested&certified) company (“MACROS”). No need to test the procedure in advance but let’s start doing that with the hybrids from Vienna. 1 st Step: Declaration of the INFN-Pisa Director to the Italia custom office stating the existence of an international collaboration/experiment (Belle2) and the motivation of such IPR to assembly the parts of the SVD. Time: 1 year (renewable). The pro-forma invoice is the document required for each shipment, indicating the list of the shipped items (each part must have: a name/label and a value). The book-keeping of the items is mandatory to load the incoming parts (hybrids, det’s, PAs) and release the parts when outgoing in composite objects (sub-assemblies). Each part will be identified and assigned to a commodities sector by MACROS. In case a custom inspection is needed, the responsible INFN person must be present to handle the goods.

6 Notice For the FW assemblies, Micron det’s are shipped by Pisa to Tokyo (IPMU/TIFR): final (definitive) receiver must cope with taxes (VAT exemption!) For the BW assemblies, HPK large det’s are shipped by Pisa to Vienna, Vienna will temporarily import them, build the L5 ladder and then send that to KEK. See: http://www.customs.go.jp/english/c- answer_e/imtsukan/1703_e.htmhttp://www.customs.go.jp/english/c- answer_e/imtsukan/1703_e.htm Articles for the purpose of scientific research and education are VAT exempted Needed Inquiry the Japanese customs about the details on how to actually achieve such an exemption and what are the requirements the sender must fulfill to allow such tax exemption.

7 Receiving parts: 1 st cost estimate (the sender’s must declare the value of each item they ship) In bold the correct Unit Price

8 Further Notes Shipping sub-assemblies back for rework easily accommodate in this scheme. The modified xyz-theta stages will remain in the ladder production sites at the end of the production (for a possible second phase of spare ladder production) Need to ship back to Pisa empty MP chucks during production (definitive, with a very low value). For IPR import of the parts, the cost for each shipment is due to: – Custom operation – Transfer T1, from Milan (1 st arrival airport) to Pisa – Insurance for tax payment (1% of the good’s value) For IPR export of the FW/BW assemblies: – Custom operation – Fed-Ex shipment (depending on box volumes and weights) To minimize the costs, the number of shipments must be minimized. Depending on the actual assemblies production/rate in Pisa and the ladder production/rate in the assembly sites, two solutions can be considered:  Ship every ~10 days  Ship every ~20 days

9 Let’s start soon! A lot of paper-work to do by the sending site and needed some info exchange with Pisa: – Hephy: hybrids (if production ends in October possible 1! Shipment, in time for the Class A sub-assemblies) Micron det’s: possible to send the already tested detectors. At least 2 shipment to Pisa required. – KEK (goods are returned to IPMU): HPK detectors (rad. hard issue?) PAs (needed info about production schedule)

10 To ship parts to Pisa INFN – Sezione di Pisa c/o MACROS s.a.s. Via Asmara 3C Presso Cargo Village International Pisa Airport 56121 Pisa ITALY Tel. +39 050 500861 Fax. +39 050 500728 macros@macsped.it


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