1. Suggestions for a MPGD Workshop in Frascati Rui de Oliveira 1

2. outline 1- Rapid presentation of typical manufacturing processes for MPGDs (GEM, Micromegas, R-WELL... as examples) 2- machines needed 3- know-how and manpower needed 4- space needed 5- cost 6- possible synergy with CERN 7- time estimate to set-up the workshop and go in “production” 8-Futures detectors processes 2

3. Electrons liberated by ionization drift towards the anode wire. Electrical field close to the wire (typical wire Ø ~few tens of  m) is sufficiently high for electrons (above 10 kV/cm) to gain enough energy to ionize further → avalanche – exponential increase of number of electron ion pairs. Cylindrical geometry is not the only one able to generate strong electric field: parallel platestripholegroove/wellmwpcwire 3 Detector = structures with high local field

4. By reducing structure sizes MPGDs have improved a lot the detector capabilities in many domains Micromegas GEM Thick-GEM, Hole-Type Detectors and RETGEM MSHP MPGD on ASICs : Ingrid ElectronsIons 60 % 40 % Micromegas GEMTHGEM MHSPIngrid 4 4 Higher rate higher granularity friendly gases less aging better energy resolution

5. Process description for a few of them 5

6. PCB Lamination Mesh deposit Lamination Development Bulk MicroMegas Process Standard Bulk MicroMegas suffers from limited efficiency at high rates due to discharges induced dead time 6 ATLAS small wheels upgrade project resistive MicroMegas prototype Micromegas 6

7. Induction gap e- e- e- e- I+I+ 70 µm 55 µm 5 µm 50 µm Thin, metal coated polyimide foil perforated with high density holes. ElectronsIons 60 % 40 % Fabio Sauli 7 GEM

8. 8 GEM process Same base material Hole patterning in Cu Polyimide etch Bottom electro etch Second Polyimide Etch Limited to 40cm x 40cm due to Mask precision, alignment and cost Limited to 2m x 60cm due to Base material Equipment Double maskSingle mask

9. R-Well description (preliminary) Base material Bottom patterning Resistive coating Dielectric coating Micro via + new resistive coating Diel coating + Microvia + Metalic layer Microwell pattern Processes needed: -Photolithography -screen printing -Copper plating -Polyimide etching Goal: -1Mhz/cm2 rate -<100um spacial resolution -single foil detector -spark protected 9

10. In the 3 examples we can see that chemistry is the main technique to build MPGD. It allows: 3D structure with a size around 100um Possibility of large sizes Edges defined with a few um accuracy Uses equipment existing in industry 10

11. outline 1- Rapid presentation of typical manufacturing processes for MPGDs (GEM, Micromega, R-WELL... as examples) 2- machines needed 3- know-how and manpower needed 4- space needed 5- cost 6- possible synergy with CERN 7- time estimate to set-up the workshop and go in “production” 8-Futures detectors processes 11

12. Machine needed All kind of machines are interresting The idea for a good workshop is to group in the same place under the same supervision all kind of technologies. – Photolithography – Mechanics – Chemistry – Screen printing – Plasma – Laser – Ink jet printing If you can’t put them all, the 4 first are crutial to start something, and Chemistry is probably the first 12

13. Let’s take the GEM process to see what are the machines behind 13

14. Image transfert/ Photolithography Laminator Solid resist deposition New: 35 000 CHF Second hand: 10 000 CHF UV lamp Resist exposure New: 18 000 CHF Development machine Solid resist development New: 60 000 CHF GEM Base material 5/50/5 Apical NP 14

15. Etching/ stripping Etching Copper etching New: 60 000 CHF Stripping Alcaline Resist stripping New: 60 000 CHF Stripping Solvent resist stripping New: 15 000 CHF 15

16. Chemical polyimide etch Kapton etching Bath + Hood: 15 000 CHF Machine 80 000 CHF 16

17. Other important equipments 17

18. Milling -Drilling Milling machine For PCB production New: 70 000 CHF Second hand: 30 000 CHF Drilling machine For PCB production New: 70 000 CHF Second hand: 30 000 CHF 18

19. Screen printing Screen printer Resist, conductor, dielectric deposit Second hand: 30 000 CHF 19

20. Press Isostatic press Vacuum gluing under pressure at high temp Honey combs panels, thin flexes, multilayer boards New: 250 000 CHF Second hand : 50 000CHF 20

21. Control Binocular with camera X 100 New: 15 000 CHF Microscope with camera X 1000 New: 20 000 CHF 21

22. ovens Ovens 2 to 3 are needed Up to 300 deg at least for 1 Size depending on application New: 7 000 CHF/ piece 22

23. Plating holes Deasmering (or plasma) line – Clean the holes after drilling Brown oxyde line – Prepare the copper for gluing Palladium or Carbon pre-coating line – Plate dielectrics Electrolytic copper line – Create thicker copper layers Total investment – 500 000 CHF Subcontracting this part is probably a better idea 23

24. outline 1- Rapid presentation of typical manufacturing processes for MPGDs (GEM, Micromega, R-WELL... as examples) 2- machines needed 3- know-how and manpower needed 4- space needed 5- cost 6- possible synergy with CERN 7- time estimate to set-up the workshop and go in “production” 8-Futures detectors processes 24

25. Know-how and man power Two persons is the minimum to start R&D activities Bachelor or Master in Electronics, Mecatronics Good Knowledge in chemistry – A connection with an academic institute on chemistry will be a real + Experience in PCB production CAD experience on UCAM or GENESIS software Good knowledge in physics 25

26. Space needed Clean room for final cleaning and test 40m2 min Main room around 200 m2 should be ok – Needs a detailled study to be sure – We have presently 1000m2 at CERN Wet area – DI water production – Water treatment equipment – Fume cupboards for trials – Storage for chemistry 26

27. Cost Already given in the talk Pay attention to hidden costs – Software maintenance – Machine maintenance – Efluents treatments – Chemistry analysis Fume cupboards and large sinks for chemistry 27

28. Possible synergy with CERN What will be your working model?: – R&D or Service workshop R&D model  hidding a bit the activity – Select the projects – Financed by budgets Service  open all your possibilities to any request at any time – Accept any project – Self financed Hot subjects that could be shared in the future – Resistors production survey – Converter survey – Review all the single board detector, and find a way to protect them – High rate single board protected detectors – Embedded electronics for ultra-thin detectors – Embedded cooling We should set up regular meetings We should also exchange personnel 28

29. 200  m To be re-studied MSGC FGLD Dot structures Micro dot structuresMicro-slit Micro well and groove 29

30. Time estimate for a working workshop 1 year to buy all the machines – Market surveys – Buying procedures ½ Year to connect machines ½ Year to fill and start machines 30

31. Futur detector processes DRIE Plasma – 10um scale 3D structures  Microbulks Micromegas Laser ? – 10um scale patterns are difficult – Carbonization is a really big problem – Large sizes is still a big chalange Resistive material – DLC : Diamon like carbon – ALD : Atomic layer deposition Ink jet printing – Open 3D micron level patterns in large size – Probably cheaper – A new world to discover 31

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39. Conclusion 500 000 CHF 2 years 220m2 2 engineers Good ideas 39

40. Thank you 40