1. Haga clic para modificar el estilo de texto del patrón Overall view of Radiation Detectors Group activities Manuel Lozano

2. IFIC-CNM Meeting. April 2010 Overview of RDG activitiesManuel Lozano CNM Clean Room expansion  From 1000 to 1500 m2  New equipments ready with partial coverage for 15 cm (6’’) wafers  We plan to do prototype runs of simple detectors in 6’’ in 2010 New ion implanter for 6’’

3. IFIC-CNM Meeting. April 2010 Overview of RDG activitiesManuel Lozano Radiation detector group  Started in 1996  12 people 6 PhD, 4 PhD students, 2 Eng.  2 senior + 1 PhD student from Power devices group  More researchers at CNM from other department joining radiation detector activities  Circuit design Device development Simulation Radiation effects

4. IFIC-CNM Meeting. April 2010 Overview of RDG activitiesManuel Lozano Radiation Detector Group  PhD Manuel Lozano Enric Cabruja Miguel Ullán Giulio Pellegrini Celeste Fleta David Quirion Salvador Hidalgo David Flores  Engineers David Almansa Joaquín Rodríguez  PhD students Sergio Díez Juan Pablo Balbuena Daniela Bassignana Consuelo Guardiola Pablo Fernández  Incorporation of a CPAN Engineer and a CSIC Electronic Technician  Increased technical capacity

5. IFIC-CNM Meeting. April 2010 Overview of RDG activitiesManuel Lozano R&D in radiation detectors at CNM Collaboration with other Spanish Groups IFIC IFAE IFCA University Santiago de Compostela University Barcelona

6. IFIC-CNM Meeting. April 2010 Overview of RDG activitiesManuel Lozano IFIC  ALIBAVA detector readout system  ALIBAVA Telescope  Modules for ATLAS upgrade  APDs for tracking in future accelerators (Angeles Faus project)

7. IFIC-CNM Meeting. April 2010 Overview of RDG activitiesManuel Lozano ALIBAVA: A readout system for microstrip silicon sensors  System finished  20 units already distributed  20 more units manufactured  Upgrade for test beam telescope  Upgrade for ethernet connectivity

8. IFIC-CNM Meeting. April 2010 Overview of RDG activitiesManuel Lozano Modules for ATLAS upgrade  Study of radiation hardness of 0.25 µm SiGe BiCMOS technologies from IHP (Germany)  Study of radiation hardness of LDMOS transistors for DC-DC converters.  Understanding radiation degradation mechanisms  Simulation and modeling of irradiated devices (transistors, detectors, etc)  Embedded fanins for Endcap modules  Dummies 2nd IHP test chip 1st IHP test chip 1st IBM test chip

9. IFIC-CNM Meeting. April 2010 Overview of RDG activitiesManuel Lozano GICSERV  Easy access through the Spanish “Access to Large Facilities” Program: ICTS GICSERV  Projects related to radiation detectors: 2010: 5 projects approved (1 rejected)  3D pixels for CMS, 3D for synchrotron, dummies for IBL, proof of concept for Totem, UBM for DEPFET bump bonding 2009: 7 projects approved (1 rejected)  3D medipix-type detectors; Stripixels; Thin pixel detectors; Thin strip detectors; Atlas pixels with slim edge; UBM for DEPFET bump bonding 2008: 5 projects approved 2007: 3 projects approved  Big increase in radiation detector activity in CNM Clean Room  GICSERV Progam working very satisfactory

10. IFIC-CNM Meeting. April 2010 Overview of RDG activitiesManuel Lozano Technologies under development  Planar & 3D pixels for IBL and ATLAS upgrade 3D detectors  Thin devices  Thin pixels for LHCb upgrade  3D detector technology  3D pixels for LHCb  IR transparent detectors  Double side strip detectors  Stripixels  Active edge and trenched detectors  Ultrathin 3D detector  Neutron detectors  Avalanche Photodiodes  6 inches processing: pixel detectors only (no poly)

11. IFIC-CNM Meeting. April 2010 Overview of RDG activitiesManuel Lozano Planar & 3D pixels for IBL and ATLAS upgrade  CNM and IFAE are part of the ATLAS 3D Collaboration for the IBL (Insertable B-layer) of the ATLAS Pixel detector  Collaboration being formed. MoU to be signed soon. Ref.: O. Rohne – Vertex 2009

12. IFIC-CNM Meeting. April 2010 Overview of RDG activitiesManuel Lozano Thin devices  Run already started  Based on SOI wafers  100, 150 and 200 µm thick active devices  Strip detectors with integrated fanins in double metal technology  Grooves in silicon to integrate optical fibres to measure deformation  GICSERV funded GICSERV

13. IFIC-CNM Meeting. April 2010 Overview of RDG activitiesManuel Lozano Thin pixels for LHCb upgrade  First tests of bump bonding of thin pixel detectors with Timepix chip.  Detectors already manufactured at CNM  Waiting for thinning and bump bonding  GICSERV funded GICSERV

14. IFIC-CNM Meeting. April 2010 Overview of RDG activitiesManuel Lozano 3D detector technology  Second institute in the world (after Stanford) in developing a 3D detector technology  Success with Medipix type pixel sensors  Now we are designing of a new mask set for ATLAS pixel sensors  Work done in the framework of RD50 collaboration. Partially funded GICSERV Electron collecting strip detectors  Bias Voltage fixed at 150V for all irradiated samples  Non-irradiated sample biased at 18V  Detector’s ceramic based board temperature between -10°C to -15°C  Measured with ALIBAVA system (25ns shaping time) GICSERV

15. IFIC-CNM Meeting. April 2010 Overview of RDG activitiesManuel Lozano 3D pixels for LHCb  In collaboration with Glasgow University  First 3D Medipix-like sensor bump bonded to Timepix chip  Successfully tested in CERN test beam Pion beam Individual pion tracks telescopeDUT GICSERV

16. IFIC-CNM Meeting. April 2010 Overview of RDG activitiesManuel Lozano IR transparent detectors  In collaboration with IFCA  Run almost finished  12 different detectors  Common parameters: active area= 1.2x1.5 cm2 circular window in the back metal 256 readout strips with 1.5 cm length SiO2 thickness map (wafer 2) Strips with 3 µm Al width lines GICSERV

17. IFIC-CNM Meeting. April 2010 Overview of RDG activitiesManuel Lozano Double side strip detectors  Double side strip detectors developed for Monash University (Australia)  Also developing double side packaging and wire bonding  Future collaboration with Universidad de Huelva for nuclear physics Stripixels  Combination of the concept of double side reading with 3D contacts Better performace than classic stripixels Single side processing 2D position sensitivity 2N readout channels (instead of N 2 )  Simulations and mask design ready  Wafers to be processed GICSERV

18. IFIC-CNM Meeting. April 2010 Overview of RDG activitiesManuel Lozano Active edge and trenched detectors  Trenches used to reduce the dead area at the edge of the sensor (also named edgeless, slim-edge,...)  Work started in collaboration with IFAE (Cristobal Padilla)  Features: Implanted edge side Backplane and edge in the same electrode  Designed detectors: PAD Microstrips MediPix2 Circular

19. IFIC-CNM Meeting. April 2010 Overview of RDG activitiesManuel Lozano Ultrathin 3D detector  10 µm thick detector  Virtually no entry window  Used for tracking of light particles 300um Etched backside Thin membrane GICSERV

20. IFIC-CNM Meeting. April 2010 Overview of RDG activitiesManuel Lozano Neutron detection  Neutrons interact very lightly with matter and cannot be detected by ionization  Neutron detection can not be made directly with silicon devices  It is necessary to use conversion layers and detect the converted particle: Fast neutrons  Moderator  slow down Slow neutrons  Converter  capture Moderator Converter Detector Moderator Converter Detector H-rich materials like polyethylene Materials with high cross-section for neutrons  High cross-section  Charged particle with high E  It’s possible develop compatible compounds with Si 10 B

21. IFIC-CNM Meeting. April 2010 Overview of RDG activitiesManuel Lozano High efficiency neutron detectors  Planar covered diodes only achieve 3% efficiency  Enough for many applications  When more efficiency id needed, 3D structures are needed Textured surfaces Holes filled with converter material Pillar type diodes surrounded by converter material Future

22. IFIC-CNM Meeting. April 2010 Overview of RDG activitiesManuel Lozano Simulation of Geiger mode APDs  Device simulation of Geiger mode APDs with Sentaurus AMS HV 0.35 µm CMOS technology. Difficulty to get technology parameters Some are deduced from technological kit, others are estimated indirectly.

23. IFIC-CNM Meeting. April 2010 Overview of RDG activitiesManuel Lozano Avalanche Photodiodes (APDs)  Power Devices and Radiation Detectors Groups at IMB-CNM have started a new research line in optoelectronic silicon detectors.  Cover the needs of the scientific community with custom made devices designed for specific applications  We have finished electrical and technological simulations  We are now designing the masks  Next year we will process the devices.  We plan to develop Linear mode APDs (to use with scintillators) Geiger mode APDs high energy tracking In the future, also SiPMs  We are open for collaboration and feedback from other groups Electric field in the avalanche zone

24. IFIC-CNM Meeting. April 2010 Overview of RDG activitiesManuel Lozano Announcement Next RD50 meeting will be held in Barcelona (31st May, 1 st & 2nd June 2010) http://cern.ch/rd50/