1. © 2014 Centre for Process Innovation Limited. All Rights Reserved. Centre for Process Innovation. Dr Alf Smith Business Development Manager, Sedgefield

2. CPI: From Innovation to Commercialisation

3. Who are CPI? CPI is a UK technology innovation centre and the process element of the Government’s High Value Manufacturing Catapult. We use applied knowledge in science and engineering combined with state of the art facilities to enable our clients to develop, prove, prototype and scale-up the next generation of products and processes. Sustainable Processing Centre Thermal Technologies Centre National Printable Electronics Centre National Biologics Manufacturing Centre

4. Technology Focus CPI works across a distinct set of technological areas that offer the largest potential impact on the future of UK and global manufacturing. BiologicsPrintable Electronics Formulation and Flexible Manufacturing Industrial Biotechnology and Biorefining

5. Services Process Economics and Evaluation Commercialisation Support and Incubator Space Manufacturability, Process Modelling and Simulation Identification and Engagement of Key Collaborators Feedstock and Materials Investigation Pilot Production Prototype, Demo and Scale-up Product and Process Development

6. A single network covering high value sectors from pharmaceuticals to power generation, where knowledge gained in one area can be transferred to another. The High Value Manufacturing Catapult brings together UK-based centres of collaborative research to create something even greater than the sum of its parts... £350 million invested to dateOver £350 million for the next 5 yearsOver 430 industry clientsA combined 800 staff and growing High Value Manufacturing Catapult

7. Technology Readiness Level 1-3 Researchers and Inventors Technology Readiness Level 4-7 (Valley of Death) CPI helps companies succeed where many otherwise fail Component validation in laboratory environment Analytical and experimental critical function and/or characteristic proof of concept Technology concept and/or application formulated Basic principles observed and reported Component validation in relevant environment System model or prototype demonstration in a relevant environment Technology Readiness Level 7-9 Industry and Companies 321987654 Technology Readiness Levels (TRL) 987654321 Actual System proven through successful operations Actual System completed and qualified through testing and demonstration System prototype demonstration in an operational environment

8. Fabrication Prototyping Access to Scale-able Toolsets Commercialisation Support Incubator Space Facilities –2 clean rooms (Class100 &1000) –Formulation, optical, & electrical test labs –12 incubator offices –Expert techno-commercial team CPI Printable Electronics Facilities Funded by :- ~33% Catapult (TSB, UK Government) ~33% Collaborative Development (UK, EU) ~33% Commercial Development (Global)

9. Material design Formulation capability Application process Electronic Design Scale up capability Core competencies in formulation and processing of electro-active materials Photovoltaics OLED Lighting OTFT Flexible display backplane arrays Low cost sensor arrays Organic Logic & Memory Biosensors CPI’s activities Barrier film technology Architectural Automotive/ Aerospace Portable power Low cost off- grid generation SENSORS BARRIER

10. PHOTOVOLTAICS Interests in thin film, OPV, Perovskite Photovoltaics…………………………………… ………………….………………………. (not conventional Silicon) Partnering in solar cell and module development BIPV Portable power generation PV Integration into devices and systems Encapsulation Supply chain elements in solar cell and module fabrication Prototypes, Scale-up, Pilot production…………..Rigid, Sheet, Flexible, R2R ++++++++ ?????????

11. Some relevant abilities……………… Processing Techniques (lithography, etch, metallisation etc.) Barrier Technology (ALD) and Encapsulation Formulation of inks Organic semiconductors Wet Coating Technologies (slot die, spin coat, rotary screen, gavure, flexo, etc.) Dry Coating Technologies (ALD, Sputtering, evaporation) Printing (line printing press, ink-jet, aerosol) Rigid Sheet Roll to Roll

12. Cleanroom phase 1 – 600m 2 ISO5/6 clean room - virtual tour at http://www.uk-cpi.com/printable-electronics/facilities/ Photolith Ink-jet printing Aerosol printing Sputtering Wet-etch Mocon WVTr Ca-test SEM AFM

13. Clean Room 2 “GEN2” Equipment All large area processing in Class 100 / ISO Class 5 clean room Reduce manual handling Cassette-cassette processing Fully automated processes Key Support Equipment: Orbotech (defect analysis tool) Solar Semi (WET – wet etch/clean/resist strip) Solar Semi (CBD – coat/bake/develop) Tamarack Stepper (photolithography - patterning of ITO / Aluminium grid) Aurion Plasma etcher (resist strip/descum/surface modification) SMC Sputter coater Excellent environment for high yielding processes!

14. B- solvent coating module UV Ozone clean, 3 x hot plates Spin coating, dual head slot die Edge Bead removal, flip station A- ambient module Single head slot die Edge Bead Removal C- vacuum deposition module Metal and organic deposition Mask Storage D- encapsulation module Automated getter dispense Glue adhesive placement UV press Large Area Coating Equipment

15. Large Area Coating - LACE Fully automated, pilot production capability located in ISO Class 5 cleanroom Cassette-Cassette Batch Operation (up to 20 substrates) Capability to run 4”, 6”, 8” substrate size Full Robotic handling in all modules Dedicated recipe control / full system data-logging for unique traceability Secure password control for dedicated customer security HEPA filtered laminar flow / glove box environment Increased yield Improved reproducibility

16. Vacuum Coating

17. Atomic Layer Deposition ALD Nano-scale, conformal coatings: Ultra-barrier  on polymer film  direct encapsulation Carrier conduction layers Carrier blocking layers Charge recombination layers Contacts Nano-laminates Conformal interfaces Batch to GEN 2 size R2R ALD

18. R2R development programme To be installed in Q4 2014 R2R pilot production toolset for the coating of organic based materials (PV/OPV/OLED/LEC) 300mm web width with full interleave handling Plasma web clean treatment 2 x Interchangeable print modules – configured with slot die/screen 4 metres oven drying capability UV ink curing capability Encapsulation module Oven drying capability IR drying capability forPAS (moisture removal) Barrier film+PSA lamination process Inert atmosphere

19. R2R development programme Unique air turning concept to eliminate front side contact of web with roller bars – maximising process yield

20. R2R development programme R2R encapsulation module 300mm web width Oven drying capability IR drying capability for PSA for moisture removal Barrier film + PSA lamination process Reduced encapsulation volume (<5m 3 ) All performed in inert environment

21. 420mm web width 25-370 micron substrate thickness Paper, carton board, films, foils, label stock Interchangeable print units Litho UV / Conventional Screen UV and WB Flexo UV / Solvent / WB Gravure Solvent Delam-Relam, UV Lamination, Cold Foiling, Die-cutting and sheeting Pick and place Integrated smart systems line

22. Thank you... For more information visit www.uk-cpi.com Email: Twitter: info@uk-cpi.com @ukCPI Contact: alf.smith@uk-cpi.com

23. www.uk-cpi.com