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2. 2 Paricon Company Overview  Founded in 1997 by Roger Weiss  23 years at Bell Labs  Expert in Interconnection Technology  Intel Capital First Investor  Technology Acquired From Bell Labs  Paricon has ~45 Patents – More Pending

3. 3 PariPoser ® Interconnection Fabric ® 2.5 – 15mils 0,05-0,38mm

4. 4 Differential Advantages of PariPoser  Low Resistance (<10 milliohm)  High Bandwidth (> 50 GHz)  Fine Pitch Capability (<0.1 mm)  Very High Count of Compressions (up to 2mio)  Cost Effective  Environmentally Friendly (RoHS compliant)  Broad Utility (Replace Copper Contact)  Passes Major Reliability Standards

5. 5 PariPoser® Technology Magnetic field applied during curing of silicone Columns “organize” themselves in the field South Pole North Pole

6. 6 PariPoser® Interconnection Fabric

7. 7 No Other Elastomer Can Provide Stable Contact Resistance for 40 Years The use of Magnetic Alignment allows less Metal and more Elastomer (only 9% metal compared to 85% with other Elastomers) >90% Elastomeric content guarantees NO mechanical settlement during use

8. 8 PariPoser® Interconnection Fabric Source: Gatewave Northern <0.3 db loss @ 40GHz

9. 9 Standard Materials

10. 10 Contact Design Rules Pitch Gap Gap ≥ 40% of Pitch Pad Area ≥ π(0.6 Pitch) /4 2

11. 11 Tradeoffs of PariPoser Material 1. Dynamic Range Not a Pogo Pin Works with Intel 775 package 2.Incompressible Fluid System Design Must Address Material Flow

12. 12 PariPoser® Interconnection Fabric

13. 13 Contact Resistance over 500k cycles

14. 14 Power Cycling Capability

15. 15 Summary of Resistance vs. Time (After Load Reaches 55 lbs)

16. 16 Dynamic Range (compression) vs. Resistance

17. 17 Rise Time of different thickness PariPoser Time domain response for transmitted signal Shunt Capacitance (G-S-G)<30 fFarad Self Inductance<94 pH Rise Time <2 ps ? Delay<1.5 ps

18. 18 Target Applications  Test and Burn in  Devices, Chip, Wafer, Display  Flip Chip Package  3D Stacking  OEM Sockets  Mezzanine Connectors  Circuit Pack to Backplane  Cable Connectors  Bussing Cable Connectors

19. 19 PariPoser® Custom die-cut Components

20. 20 PariPoser® Socket for 1670-contact LGA package

21. 21 BGA Testing

22. 22 Crown Contact

23. 23 BGA Testing PariProbe™ Contact System <1mm <0.4mm

24. 24 Crown PariProbe Contact

25. 25 < 1mm PariProbe® Contactor

26. 26 PariProbe® Socket BGA Device

27. 27 Bullet Nose PariProbe Contact

28. 28 Low Cost / High Performance Test-Sockets 200+ designs available

29. 29 Lock-N-Load™ Socket

30. 30 Application Sockets

31. 31 F15 Adapter – Handler Socket

32. 32 Modular Design Modifiable to include Peltier Devices Heat Sinks Fans Liquid Cooling

33. 33 Custom Fixtures

34. 34 Test In-Tray Socket

35. 35 Pitch Transformers

36. 36 New Products DDR Application Sockets Thermal Conducting PariPoser Fabric Low Stick PariPoser Fabric High Stick PariPoser Fabric Optical Transceiver Sockets New Elastomeric Structures High Performance RF-Gaskets