1. MAGNESIUM THIXOMOLDING
DESIGN GUIDE ( v 1.0)

2. THIXOMOLDING PROCESS 1. Mg Dry Chips Fall Into Barrel
Melt
Chips
Melting
Begins
AZ91D Magnesium Chips
1. Mg Dry Chips Fall Into Barrel
2. Screw Conveys Material Down Barrel
Magnesium Chips
3. Heater Bands + Mechanical Screw add Energy to Material F
Melt
Check Ring
Semi-Solid
“Slush”
4. Melting Material Driven Forward As Screw Returns
5. “Slush” In front of Check Ring Pushed Out Into Tool Cavity
6. New Cycle Begins

3. MAGNESIUM TXM PART CANDIDATES
UTILIZE
CURRENT
TOOL
Parkway-TPS Group
Magnesium
VOLUME
CURRENT
PART
STIFFNESS
STRENGTH
PLASTIC
CAST METAL
SHEET METAL
COMPOSITE
CERAMIC
REDESIGN
NEW TOOL
Parkway-TPS Group
Magnesium
NEW
DESIGN
Parkway-TPS Group
Magnesium
DESIGN FOR THIXOMOLDING

4. Designing for Magnesium TXML w t
Mg Stiffness Advantage =
E Mg x I Part E Mg x t Part =
E Current x I Part E Current x t Part 3
Mg Strength Advantage =
s Mg x t Part
s Current x t Part 2
Mg Weight vs Current =
(L x W x t ) Part x Density Mg
(L x W x t ) Part x Density Current
MATERIAL PROPERTIES & PART GEOMETRY DELIVER VALUE

5. Converting Plastic to Magnesium TXM (ELECTRONIC HOUSING EXAMPLE)
Design Example #1 :
ELECTRONIC / ELECTRICAL HOUSING
Current Material : 30% Carbon-filled PC
Key Customer Requirements (KCR’s)
Stiffness Strength (Bending & Impact)
Shielding Heat Dissipation
Appearance Light Weight
Thin Wall Dimensional Stability
Recyclability Cost L w t

6. KEY MECHANICAL PROPERTIESw t
Redesigned to Match Stiffness
Mg Nominal Wall = .77x Plastic Wall

7. (ELECTRONIC HOUSING EXAMPLE) (Carbon Filled, Metal Filled)w t
EMI / RFI SHIELDING
(ELECTRONIC HOUSING EXAMPLE)
120
100 80 60 40 20
Mg TXM
DS Plating
Metal Liners
Metal Liners
Vac. Met
Ag Paint
Note : Material Price only, may require
plating, vacuum metallization, etc.
SS Plating
SHIELDING EFFECTIVENESS
( dB )
Ni/Cu Paint
Inherently Shielding
(Carbon Filled, Metal Filled)
Plastics
$1 $ $ $ 4
$11 $12 $13
Shielding Costs - $/ft ² of Coverage
INHERENT, HIGH-LEVEL SHIELDING AT THINNER NOMINAL WALL

8. HEAT MANAGEMENT MOST EFFECTIVE HEAT MANAGEMENT
(ELECTRONIC HOUSING EXAMPLE) L w t
High Thermal Conductivity = Fast Heat Transfer
Low Volumetric Specific Heat = Efficient Heat Dissipation
High “Heat Deflection” Temperature = Operating Margin
MOST EFFECTIVE HEAT MANAGEMENT

9. ADDITIONAL Mg TXM BENEFITS (ELECTRONIC HOUSING EXAMPLE)
DIMENSIONAL STABILITY: MOLDED TO TIGHTER TOLERANCES
LOWER THERMAL EXPANSION
STABLE DIMENSIONS - unaffected by moisture, chemicals, etc.
NO FLATNESS DISTORTION - minimal residual stress
IMPROVED SURFACE FINISH: PAINTING, COATING, ETC. METHODS WELL-ESTABLISHED
LOW C.T.E. IMPROVES COATING LIFE
STABILITY OF SUPPLY: GLOBAL CAPACITY INCREASING
UNLIMITED SUPPLY
STABLE PRICING - not linked to oil commodity price
ENVIRONMENTAL CONFORMANCE:
ELIMINATION OF PLATING PROCESS & V.O.C.s
“BLUE ANGEL” COMPLIANT
IMMEDIATELY RECYCLABLE - no separation processes req.
PERCEPTION OF “HIGH-TECH” METALLIC QUALITY

10. KEY CUSTOMER REQUIREMENTS SCORECARD
KCR Mg TXM PLASTIC
Stiffness X
Strength (Bending & Impact) X
Shielding Effectiveness X
Operating Temperature X
Heat Dissipation X
Appearance X X
Surface Finish X
Light Weight X
Thin Wall X
Dimensional Stability X
Recyclable X
Overall Cost X
Environmental Issues X
Design Confidence X
Customer Perception X L w t

11. DESIGNING WITH MAGNESIUM TXM (HEAT SINK EXAMPLE)
Design Example #2:
HEAT SINK - AUTOMOTIVE
New Design: Material & Process Selections Open
Key Customer Requirements (KCRs)
Efficient Heat Transfer
High Volume Low Cost
Durability
Light Weight (No Wasted Weight)

12. HEAT TRANSFER BASICS HEAT SINK “COLD” BODY NEARBY HEAT SOURCE
CONVECTION & RADIATION
Dissipate / Remove Heat from Heat Sink
into Surroundings to Protect “Cold” Body
Q = h A ( Tsink - Tair )
Efficiency:
Surface Area In Contact with Air (A)
Maximum Surface Area / Volume Ratio
Low Density Material
CONDUCTION
Move Heat Away Thru Heat Sink
Q = K A (dT / dx)
Efficiency:
Thermal Conductivity (K)
Contact with Heat Source (A)
MATERIAL & GEOMETRY
GEOMETRY

13. HEAT SINK DESIGN KEYS MAXIMIZE THERMAL CONDUCTIVITY: MATERIAL
MAXIMIZE SURFACE AREA CONTACT TO HEAT SOURCE: DESIGN & PROCESS
MAXIMIZE (SURFACE AREA / VOLUME) RATIO IN FINS: DESIGN & PROCESS
MINIMIZE WEIGHT: MATERIAL & PROCESS
MINIMIZE COST: MATERIAL & PROCESS

14. VOLUMETRIC THERMAL CONDUCTIVITY (Thermal Cond / Matl Density)
HEAT SINK DESIGN
VOLUMETRIC THERMAL CONDUCTIVITY
(Thermal Cond / Matl Density)
Why Thixomolded Magnesium ?
Mg: High Thermal Conductivity per unit weight
Mg: Lowest Density of Materials Considered
Mg: Rigidity & Durability
TXM: Complex Designs Manufacturable
TXM: Thin Walls & Fins (t = .020")
TXM: Thin Walls = Lightweight
TXM: No Voids, Dross, Process Defects
to Maximize Material Thermal Properties
TXM: Cost-Effective High-Volume Process
MATERIAL DENSITY
OPTIMUM COMBINATION OF
DESIGN, MATERIAL & PROCESS

15. GENERAL DESIGN BENEFITS