1. 1 Passive Components TWG Report NEMI Meeting March 25 TWG Chairman Needed Joe Dougherty - Penn State, Co-Chair Dennis Fritz - MacDermid, reporting

2. 2 NEMI National Electronics Manufacturing Initiative Association driven by large OEMs - IBM, Motorola, Nortel, Cisco, Intel, etc. TWG - Technology Working Group

3. 3 Situation (Infrastructure) Analysis Benchmark Traditional state of art –Production of 0201 Surface Mount Components –Production of Metric “0603” components –Integral and Network components - infrastructure Crosscuts –How many resistors, capacitors go into “SIP” modules –Assembly - true “embedded” passives inside boards. –Definition of “embedded” and “integral” components –Embedded - “blur” with RFID devices

4. 4 Situation (Infrastructure) Analysis Benchmark Embedded Passive state of art (cont.) –Infrastructure Standards - under IPC and JPCA development UL - Satisfactory Design tools - Progressing Test tools - ?? Training - Progressing Conceptual - Missing “Product Managers”?

5. 5 Situation (Infrastructure) Analysis Benchmark Embedded Passive state of art –Demonstrated U.S. laboratory capability Capacitors - 4 Laminate, 2 Thin layer, 1 Ceramic Resistors - 4 Thin Film, 1 Ceramic, 3 Polymer Film Inductors - No new technology required –Demonstrated Commercial capability Motorola - Pagers and cell phones Distributed capacitance - being designed in and used Specialty thin film resistors - being designed and used –Cost Analysis Tools - available, but not friendly

6. 6 Situation (Infrastructure) Analysis 2002 (Review)

7. 7 NEMI Emulators Portable Electronics Medical “System in a Package” = SIP Defense (Harsh Environment) Automotive (Harsh Environment) Office Systems “Netcomm”

8. 8 Emulator Columns Passive Devices: Embedded Passives Max. Ohms Max. Capacitance Type/Size # per sq. cm PWB Costs (FR4) 2 layer flexible 4 layer flexible 4 layer conventional

9. 9 Roadmap of Quantified Key Attribute Needs - 2003

10. 10 Roadmap of Quantified Key Attribute Needs - 2005

11. 11 Roadmap of Quantified Key Attribute Needs - 2007

12. 12 Roadmap of Quantified Key Attribute Needs - 2009

13. 13 Roadmap of Quantified Key Attribute Needs - 2013

14. 14 Critical (Infrastructure) Issues - Paradigm Shifts –Embedded Active Devices –Broad Component Value Processes (Greater than 1.5 decades in value) –E-Test Routinely Done at Board Fab –Simulation and Design Tools for Component/Package Combination Cost Modeling –Tools readily available to designers - based on data, not projections

15. 15 Technology Needs: - Research, Development Priorities - Grouped Into Categories: –Mfg. Processes, Better Singulated Capacitor Technology Board Fabrication for Embedded Passives Board Fabrication for Embedded Active Components –Energy - none –Systems Integration Responsibility for function - Board Fab? CEM? ODM? –Materials High Dk organic capacitors High R “metallic like” materials

16. 16 Gaps and Showstoppers Discretes - Tiny Component Availability vs. Machine Placement Capability Embedded Passive - “Chicken and Egg” - Risk Aversion System Design Capability - Single CAD Tool Test Capability - All Parameters at All Manufacture Levels

17. 17 Recommendations on potential Alternative Technologies Follow Japan JISSO on Embedded Active Components

18. 18 Contributors Joe Dougherty - Penn State Richard Ulrich - U of Arkansas John Galvagni - AVX Murata Rob Sheffield - Nortel Delphi Merix Coretec Sanmina DuPont Rohm and Haas Electronic Materials

19. 19 Contributors (cont.) MacDermid Gould Ohmegaply 3M ESI

20. 20 Contacts for Participation NEMI (Passives Chapter will not include embedded passives) –Chuck.Richardson@nemi.org –jim.arnold@motorola.com –Bob.Pfahl@NEMI.org –jxd6@psu.edu (Joseph Dougherty - Penn State)

21. 21 Contacts for Participation NEMI (Organic Substrates Chapter will include embedded passives) –fish5er@mindspring.com (Jack Fisher) –DieterBergman@ipc.org