1. Detector R & D Harry van der Graaf NIKHEF Jamboree Dec 19, 2006

2. GridPix SiProt InGrid, TwinGrid, TripleGrid TimePix Gossip, Ageing Gossipo-1, Gossipo-2 MediPix, Micro-structures/electronics Rasnik RasIce, USB Rasnik, Color Rasnik RasClic

3. Micromegas + MediPix 2 MediPix2 pixel sensor Brass spacer block Printed circuit board Aluminum base plate Micromegas Cathode (drift) plane 55 Fe Baseplate Drift space: 15 mm MIPs He/Isobutane 80/20 Modified MediPix δ-ray! 14 mm GridPix

4. Gas discharge protection Melt pixel pad Grid damaged –1 μm thin grid –Aluminum T f ~ 660 °C Proposals: –Resistive layer, RPC principle SiProt –Multi-stage amplification TwinGrid

5. Empirical method: Try RPC principle Amorphous Si Silicon Protection: SiProt Technology A-Si deposit: standard wafer post processing, but wafers may get too hot Univ. of Neuchatel/IMT/P. Jarron (CERN) uses this for integrated X-ray sensor/convertor on MediPix 2

6. Digital scope cathode Rn alfa’s charge spectrum Th – Rd alfa’s Discharge signals: short-circuit between grid and anode due to plasma Looks like it works! no hot plasma on pixel input pads reduced charge & current

7. 55 Fe source, Argon-Isobutane mix Look at the pulses from a (calibrated) preamplifier (low grid voltage) Look at the current flowing through the power supply (high grid voltage) No sparks up to 570 V on the grid ! Extreme gain possible Next step: SiProt (and InGrid) on Medipix, TimePix CMOS pixel chips from current from pulse height Gain measurement

8. TimePix chip + SiProt Now under HV! Today, 12:30 h. 55 Fe!

9. InGrid, an integrated Micromegas Integrate grid by wafer post processing Low tempertaure process (spin coating, wet etching) Perfect alignment between grid holes and pixel pads No dead areas due to pillars Flexible design ‘There is plenty of room at the top’ -Jurriaan Schmitz’

10. hidden pillars! Prototypes Very good energy resolution: Very precise dimensions d < 0.1 μm WPP Technology is ready to be applied

11. A-Si not adequate? Then TwinGrid!

12. And it works! Ar 20 % C 4 H 10, Iron 55 source Voltage on top grid, middle grid floating Signal development? Field shape? Readout grid signals 2 grid lines on top of each other

13. TripleGrid TwinGrid not adequate? Then TripleGrid!

14. The TimePix chip idea: Jan Visschers Based on MediPix2 design –Same dimensions and readout protocol –Replace 14 bit hit counter by TDC –Only low threshold –Fired pixels count clock pulses 100 MHz Counting modes (can be mixed) –“Time over threshold”Charge info. –“Common stop”Time info. Characteristics: –Dynamic range, 160 µs @ 100 MHz –Integration time, 200 ns 11 2244 55 66 preamp/shaper Low threshold High threshold Control logic MediPix2 → TimePix

15. Time over threshold events TOT linear above ~ 4 ke- Better calibration to come… > 30 ke- per pixels Ar CO 2 70/30 No time information (2D) Charge information should improve spatial resolution TOT counts N e- Freiburg Bonn

16. “Common stop” (Time) mode Every fired pixel counts till the end of a 12 μs shutter window Tracks parallel to the pixel plane (same color) The larger the number of counts, the shorther the drift time Freiburg Bonn

17. Mixed Mode operation Consecutive pixels have Time and TOT assignment and are here separated via mapping onto a 181x181 matrix Benefit from charge & time information Interesting for double track separation Ar CO 2 70/30 He CO 2 70/30 Freiburg Bonn

18. GOSSIP CMOS chip Si depletion layer V bias Si strip detectors Si pixel detectors MAPs Gas: 1 mm as detection medium 99 % chance to have at least 1 e- Gas amplification ~ 1000: Single electron sensitive All signals arrive within 16 ns Cluster3 Cathode (drift) plane Integrated Grid (InGrid) Cluster2 Cluster1 Slimmed Silicon Readout chip Input pixel 1mm, 100V 50um, 400V 50um Si (vertex) track detector

19. First Gossip (dummy) chamber: study:chamber signals ageing

20. Sr-90 β-source 1.2 mm Proto GOSSIP thin gas layer

21. Housing for Source + Gossip Chamber Source Holder Applying 90Sr source (10 9 Bq!) in Petten: Failure; accident 2007: new attempt in Russia

22. - match extreme small source capacity: 10 fF - peaking time: 40 ns - noise (expected: 60 e- input eq.) - power: 2 μW/pixel (!) MultiProject Wafer: NIKHEF + CERN Micro-electronics group - Input noise eq. reached - No effect of digital switching within pixel GOSSIPO chip Submitted December 2005. GOSSIPO (RO-FE) chip design

23. test of preamp-shaper-discriminator and 700 MHz TDC per pixel 0.13 μm technology containing 16 x 16 pixels Submission Nov 29, 2006 Can be used for GOSSIP demo ! GOSSIPO-2 3 x 2 mm 2

24. - Ladder strings fixed to end cones - Integration of beam pipe, end cones & pixel vertex detector - 5 double layers seems feasible Virtual goal: ATLAS pixel vertex

25. Stainless steel tube: - string - power - CO 2 cooling Gossip chip + InGrid drift gap cathode foil ladder cross section data lines (Cu/kapton) casted aluminium ladder side view ladder top view ATLAS Upgrade of SCT: new mechanical concept

26. Medipix en RELAXD

27. Principle of Hybrid Pixel detectors no CCDs no CMOS imagers but Hybrid Pixel detectors: High Density Interconnect Schematic of a hybrid pixel detector bump Au Sensor Substrate InGaAs UBM Insulator Au UBM Al Au Sensor Substrate Al UBM Insulator CMOS ROIC UBM Al MediPix chip 14 x 14 mm 2 sensitive area periphery

28. Medipix Family (1998-2010) 1998: Medipix1: 700 nm SACMOS technology 2003: Medipix2: 250 nm IBM -> 2006: TimePix 2007: Medipix3: 130 nm IBM -> TimePix3, Gossip? 2012: 65 nm ? -> ILCpix ?? Downscaling: Higher density, Higher speed, Lower power, Constant price… Smaller Pixels, more Intelligent Pixels, RadHard MUST follow the trends in Industry! Medipix2: Design finished, Applications, Postprocessing… Medipix3: New start, New IP, New Applications, Chips in 2008.

29. RELAXD: Vision Edgeless Silicon Sensors (Pixel redistribution) Thinned CMOS pixel ASICs with Through-Silicon Via contacting with Through-Silicon Via contacting High bandwidth readout (Gigabit Ethernet)  Tile-able Microsystems, produced in Industry ‘There is plenty of (even more) room at the bottom’

30. PANalytical Now: 1 Medipix 256X256 pixels

31. Alignment (RASNIK)

32. RasIce 3e prijs ‘Nieuwe Ideeen Prijsvraag UvA Low-cost Rasnik based on webcam (RGB!) Correction for light dispersion

33. Laser Zonelens Pixel Sensor RasClic 100 m

34. RasClic: een nieuwe seismograaf FOM wedstrijd: Win de toekomst! Henk Groenstege Marc Kea 20 November 2006 1e Prijs! Image-on-sensor: 0.6 μm (RMS)

35. Image Position Analysis: Auto-Correlation Fouries analysis Fast image analysis (50 ms) Application of DSP Relevant for (ATLAS) Rasniks 1 micron dX dY First RasClic results in vacuum RMS ~ 80 nm

36. NIKHEFHarry van der Graaf Jan Timmermans Jan Visschers Maximilien Chefdeville Vladimir Gromov Ruud Kluit Fred Hartjes Els Koffeman Martin Fransen Wim Gotink Joop Rövenkamp Peter Jansweijer Henk Groenstege Marc Kea Egge van der Poel NijmegenNicolo de Groot Adriaan Konig Thei Wijnen Saclay CEA DAPNIAPaul Colas Yannis Giomataris Dan Burke Univ. Twente/Mesa+Jurriaan Schmitz Cora Salm Sander Smits Victor Blanco Carballo CERNErik Heine Medipix Consortium