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Published byDarcy Palmer Modified over 8 years ago
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GEM activities at LZU Xiaodong Wang ( 王晓冬 ) 09,25,2013
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Preparation of the drift cathode and PCB Simulation of the triple GEMs based on ansys and Garfield++ Next work …… test Outline The 2 th online meeting about GEM actives process
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A : B =10:4 mass ratio A B Araldite , AY103-1/HY991 Arrange two micron mylar film coated aluminum at the tension device
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We used 2 kg force to stretch the foil as a mirror And then, we placed the drift board with the Araldite glue at the tension device
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Put the Lead blocks at the drift board. in order to the foil bonding strongly Wait time: ………24hours Cut into small pieces
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We used a blank board (2mm) bonding at pcb in order to avoid gas leakage. Because we put some via holes in the PCB. Problem : Too much glue lead it to leakage. Next step we have to improve skill
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Two electrons drift and induce an avalanche effect in the holes Triple standard GEMs filed solution map by ANSYS
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