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1. 2 Basic Food System Pre-foods are manufactured Products delivered to point of use Food processor assembles food Many recipes (programs) Healthy eating.

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Presentation on theme: "1. 2 Basic Food System Pre-foods are manufactured Products delivered to point of use Food processor assembles food Many recipes (programs) Healthy eating."— Presentation transcript:

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2 2 Basic Food System Pre-foods are manufactured Products delivered to point of use Food processor assembles food Many recipes (programs) Healthy eating is easier Dial-a-diet is popular Over 1 –million formulas on the UltraNET

3 3 Synthesized/compounded/processed/packaged Ingredients delivered to premises:  Bulk protein  Carbohydrates  Fiber  Flavor  Vitamins  Color  Texture agent Processor performs food chemistry & physics  Shape  Cook/bake/grill  Generates “Nutrient Facts” data Food Chain

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5 5 Nanoelectronics has dominated for since 2025 years but Photonics has been gaining. Nano-electro-mechanical systems have become a major sector and we have machines that are the size of a spec of dust. Mature Nanotech First transistor 2003

6 6 Nanotech Beginnings Early Nanocarbon Transistor The Nanotech craze began 65 years ago in 1990 when a company spelled out I-B-M with atoms.

7 7 Breakthroughs 50 Years Ago IBM Develops Alternative To Silicon Transistors - 500 times smaller than silicon-based transistors. Carbon Nanotubes Nano Solid-state NanoVIAS NanoCircuits? No silicon No solder Amplifier

8 8 MOLECULAR MOTORS

9 9 Nano Machines Memory

10 10 Computers -

11 11 Merge?

12 12 Commerce - Business There is one world-wide banking system “Business headquarters” is an obsolete idea Complete*, but balanced, globalization  Remote factories & distribution; “mfg. where consumed”  Remote management – Netlinked – the team only meet cyberly * A very few areas remain “ancient” by desire.

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14 14 Electronic Assembly ~1950 to ~1980: IC packaged and interconnected with PCBs using feed-through assembly. 1880 to 1920: Vacuum tubes were connected by hand wiring. ~1980 to 2025 packaged ICs interconnected using Surface Mount Assembly. In 2055 active devices interconnects are made by external and internal integration. Today’s assembly is modules only. 1920 to 1950: Vacuum tubes were connected using PCBs.

15 15 Assembly continued Nano, Bio, Photonic, Electromechanical and modules must be connected and assembly, but more like “brain surgery” or building a mainframe computer in a watch case”

16 16 Mostly telecommuting – from anywhere – not just abode! Where do you work? Only 4% of the workforce goes to a workplace. The Remote Factory was introduced in 2010 but not well-established until 2025

17 17 Remote Factory You Are Here Moving your “window” Customers Living quarters Control Management

18 18 Mfg. 2055

19 19 Your “Home” Office?

20 20 Distribution Most products assembled remotely Send the design not the engineer Fab the product near point of use Transport “pipeline” raw materials Build & ship only for small products

21 21 Anything is possible

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