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Vacuum Technology and Components for Cryogenics
Spring School and Educational Courses at Fethiye April 2016 Vacuum Technology and Components for Cryogenics Yasuharu Kamioka Ph.D ColdTech Associates 2016 Cryogenics and Superconductivity Society of Japan
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Vacuum and Low Temperature
Deep relation of Vacuum technology and Cryogenics 1. Vacuum insulation is essential for cryogenics 2. Evacuation is required in case of replacement of gases 3. Lower temperature by evacuation of cryogen 4. Circulation of He-3 and depression of 1K pot of Dilution refrigerator
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Use of Vacuum Force of vacuum : Suction, Transfer > 300Torr (10kPa) Thermal insulation : below molecular flow region < 10-4Torr (10-2Pa) Clean surface : Solid state physics < 10-7Torr (10-5Pa) Removing obstacles : Ion, Cluster molecules, Particle physics < 10-8Torr (10-6Pa) P= 10-6 torr, lifetime ~ 4 sec 10-8 torr ~ 6 min 10-10 torr, ~ 11 hr
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Region of vacuum and pump, gauge
Two ranges according to molecular density (intermolecular collisions) Viscous flow range : bulk of molecules moving together, just as ordinary gas ・Vacuum pump : Diaphragm pump, Rotary pump, Kinney pump, Roots pump ・Vacuum gauge : Bourdon gauge, Diaphragm gauge, Pirani gauge Molecular flow range : each molecule moving any direction ・ Vacuum pump : Roots pump, Ejector pump, Diffusion pump, Turbo-molecular pump, Cryopump, Ion pump ・Vacuum gauge : Penning Gauge, B-A gauge (Ionization gauge)
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Vacuum components
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Vacuum pumps Cryopump
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Rotary vane pump / Kinney Vacuum pump
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Diaphragm pump
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Sorption pump Suction Safety valve Molecular sieve Net LN Dewar
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Scroll pump
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Roots pump
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Diffusion pump and Ejector pump
Vapor
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Turbo-molecular pump
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Cryopump
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Vacuum pump set A set of Turbo-molecular pump and Rotary pump
A set of Roots pump and Kinney pump
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Vacuum pump Pumping speed and pressure
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Ultimate pressure Ultimate pressure : Depending on the pumping speed, the out gas rate and the pumping capacity Torr (Pa) The lowest pressure after evacuation. Ultimate pressure of a pump : depending on a type of pump Pumping speed : Pumping speed of vacuum pumping system Out gas rate : Greatly depending on materials, it’s surface condition and related on the materials and cleanliness of evacuation system Working pressure of pump EUHV UHV HV MV LV Rotary pump Roots pump Turbo-molecular pump Steam ejector pump Oil ejector pump Oil diffusion ejector pump Oil diffusion pump Hg ejector pump Hg diffusion pump Sorption pump Sputter ion pump Getter pump(Troom) Getter pump(TLN) Cryopump Working pressure (Torr)
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Vacuum gauge He leak detector Diaphragm gauge Pirani gauge
Penning gauge B-A gauge (Ionization gauge)
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Vacuum gauge Ranges of gauges
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Vacuum piping Piping connectors and valves
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Vacuum components
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Vacuum pump set High vacuum pump set RP : Rotary pump
TMP: Turbo-molecular pump OME :Oil mist trap Low out gas materials must be selected for piping such as stainless steel, copper, ceramics, viton.
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Viscous flow and Molecular flow
Mean free path : Viscous flow and Molecular flow k×T mean free path L= 20.5×p×π×d2 k:Boltzmann constant T:temperature p:pressure d:molecular diameter Mean free path P = 10-3 torr, ~ 5 cm 10-6 torr, ~ 50 m 10-10 torr, ~ 500 km Viscous flow:bulk of molecules moving together pressure:high Molecular flow:each molecule moving any direction Pressure:low L1 L1 < L2 L2
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Three factors of vacuum evacuation and Leak / Out gas
Conductance : the rate of flow per unit difference of pressure m3/sec Pump speed : the rate of evacuation volume m3/sec Ultimate pressure : the attainable pressure. depending on pump speed and the rate of out gas Torr (Pa) Leak : Torr・liter/sec (atm・CC/sec, Pa・m3/sec) Out gas : Torr・liter/sec (atm・CC/sec, Pa・m3/sec)
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Conductance ① Quantity of gas : pressure × volume Pa・m3 Gas flow rate Q: pressure × volume /time Pa・m3 /sec Conductance C:Q=C(P1-P2) m3 /sec Conductance of viscous flow range πa4 proportional to 4th power of a C= Pav 8ηL Conductance of molecular flow range proportional to 3rd power of a 4a3 a3 C = (2πRT/M)1/2= 30.5× (T/M) 1/2 3L L Flow in a tube : Inner diameter a Length L, pressure difference P1-P2, average pressure Pav =(P1-P2) /2
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Conductance ② C = C1 + C2 + C3 + ・・・・+ C n C C
Total conductance of elements in series = ・・・ C C C C C n in parallel C = C1 + C2 + C3 + ・・・・+ C n C C
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Conductance ③ Ca = Cv+ Cm Short tubes Ca 3L Ca = ×K×C 8a
Clausing’s factor : K L Ca = ×K×C a Transition range of viscous and molecular flow Ca = Cv+ Cm
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Conductance ④
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Pumping speed Pumping speed : the rate of evacuation volume at point X
m3/sec Pump speed : pumping speed of pump Sp Pumping speed of a system : total pumping speed consist of pump, valve, piping etc. S = S Sp C The total pumping speed S is dominated by the smallest value of C and Sp. C is very important. S C Sp
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Calculation of evacuation time ①
Rough evacuation time:determined by the volume and pumping speed S t sec t = 2.3×τ×logK τ=V/S, K=P1/P2 initial pressure:P1 final pressure:P2 Chamber volume:0.5m3 Diffusion pump:0.7m3/sec, Rotary pump:0.01m3/sec Rotary pump:798sec Diffusion pump:76sec Total:874sec (14min. 34sec) 圧力範囲(Pa) logK S (m3/sec) τ (sec) t (sec) 105 103 2 8.3 x 10-3 60 276 103 102 1 6.6 x 10-3 76 175 102 10 3.3 x 10-3 151 347 圧力範囲(Pa) logK S (m3/sec) τ (sec) t (sec) 10 1 1 0.02 25 58 1 0.1 0.1 5 12 0.1 0.01 0.3 1.7 4 0.01 0.001 0.7 2
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Calculation of evacuation time ②
Rough pumping Out gas : water Evacuation of cryostat Out gas: H, N, CO2 High vacuum Attainable pressure Evacuation time in high vacuum : below 10-1Pa(10-3Torr), evacuation time changes by out gassing. out gassing is depending on materials and surface treatment.
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Baking Baking : heating of vacuum system during evacuation
by high vacuum pump Reducing evacuation time Keeping vacuum pressure after cut off Evacuate the system keeping heat the whole system about 120℃. Mean adsorbing time of adsorbed gas:t t=t0・exp(Ed/RT) t0 :10-13sec Ed: activation energy of desorption gas In the case of Ed : 3.1× 103j/mol, t=10-3sec at 20℃, 10-6sec at120℃. Most part of out gas is water. Baking box : 120℃ evacuation time 30days
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Thermal insulation vacuum
Pressure should be below10-3Pa(10-5Torr) In order to keep high vacuum in insulation vacuum, it is very important to know surface condition of materials in the vacuum. Without evacuation for many years Cryogenic dewar, bucket type cryostat, transfer tube Evacuation before use or once per several times Cryostat which can’t be baked : Cryostat with a SCM, He liquefier, Fusion reactor, Cryostat with a cryocooler
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Insulation vacuum is the same as UHV
Keep HV Reduce out gas How to reduce out gas Use low out gas materials : Stainless steel, Steel, Aluminum alloy, Titan, etc. Surface area : without large surface area Organic material like FRP : select materials and use clear background materials G10-FRP, polyester, Teflon, Viton Stock of materials : stock in dry space without grease, water in desiccator, in vacuum, in dry nitrogen gas Aluminized film, spacer etc. : stock in dry air/nitrogen Treatment of materials before use : removing grease/dirt clean with acetone Handling of materials : don’t use bare hands, wash tools with acetone, use polyethylene glove Welding : weld from inside, don’t weld both side
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Residual out gas in vacuum system
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