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Published bySydney Mosley Modified over 8 years ago
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Surface Reactivity What determines the surface reactivity?
What is physisorption? What is chemisorption? What are the trends in Reactivity? What is the underlying fundament?
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Physisorption By Taylor expansion Attractive part Repulsive part
(0,0,d) (x,y,z) d + - = (x,y,z), By Taylor expansion Attractive part Repulsive part Result:
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Physisorption Often is the less accurate Lennar-Jones potential used with n=12 Molecule Enthalpy kJmol-1 CH4 -21 CO -25 CO2 N2 O2 Remember: Physisorption is only polarizaion, there is no exchange of electrons Where do we utilize physisorption???
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The Chemical Bond The simplest chemical bonding: Hydrogen molecule H2+
Saa= Sbb= 1 since and were already normalized. Sab=S the overlap intergral
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Simplified Approach Consider a simple two level system:
Consider the limit where S is small (small overlap)
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Homonuclear system < 0 and S > 0 Strength of bond
b is proportional to the overlap
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Homonuclear system < 0 and S > 0 Energy in the chemical bond
If E < 0 will the molecule be stable and the work required for dissociation will be Ediss= - E. b is proportional to the overlap
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The Chemical Bond So why is Cl2 much more reactive than O2
Ebond = eV 1s He ``He2´´ Ebond > 0 eV N N2 Ebond = eV 5s 1p 6s 2p O O2 Ebond = eV 2s So why is Cl2 much more reactive than O2 and why does Ne2 not exist?
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The heteronuclear system
s* E- s E+ 1sa E1s 1sb E1s Sb b2/d
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Molecules in general strong weak no bonding atomic molecular atomic
orbital orbital orbital anti bonding Big overlap Small overlap bonding
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Electronic structure of the solid
.. 4 p 4 s 3 d Energy Atom Metal Density of states (DOS)
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Trends in the periodic system
To the left the outer atomic orbital tends to be extended and will be more localized as we go to the right where they become filled. Thus the tendency for forming bond will decrease when going to the left. From metallic to covalent to none. When going down the periodic system the outer orbital increases and becomes more extended and delocalized i.e. forms better bonding. Eventually even Xe can form covalent bonding and the highest melting point of metals have to be found in the third transition series where there is an additional bonding effect. gas Filling =localized=less strong bonding Increasing size= delocalization= increasing bonding metals
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What is the work function
EF EVac Sp-band Core level 1 Core level 2 Metal Adsorbed atom Free atom Work function Vacuum level Fermi level ea Ionization energy
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Jellium model of a solid surface
metal vacuum + - electrons ionic cores distance density + - dipole Notice exponential decay can be probed by STM
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The solid surface The energy distribution of the electrons
will follow a Fermi-Dirac Distribution since the electon gas is strongly degenerate, I.e. many electons on few states: where is the chemical potential of the electrons which at T= 0 K is Notice how this expression becomes the usual Boltzman distribution for large temperatues where the electron gas is getting diluted on many states
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Free electron metals Typically for metals sp-bands like
Ca, Mg, Al, Cu, K, Cs; ect. Evaporation of electrons Increase T or lower F When does metals melt?
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The solid surface k will be continous and they will occupy a sphere in k-space with radius kF and volume .
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The Tight Binding Model
LCAO Where F are the individual atomic wave functions a e0 Core levels Construct Block waves
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The Tight Binding Model
Anti-bonding states Bonding states
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Metals vs. Insulators E Why is a metal a conductor?
EF Evac Valence band Conduction Free electron metal Transition metal Insulator sp-band d-band E Why is a metal a conductor? Why are metal reactive? Why may insulatords break down at elevated temperatures? Band gap
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Simple model of transition metals
eF E DOS sp-band W W/2 d-band There will however always be a repulsive Term proportional to the overlap:
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Simple model of transition metals
There is an attractive term from the sp electrons roughly 5eV. Why do we get a maximum? Why does the interaction increase with increasing d number? Which metals have the highest melting points?
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The Newns-Anderson Model
What happens when an atom with an energy level Fa, ea approaches a surface with valence electron at Yk, ek ? Fa, ea EF Yk The affinity level becomes filled when crossing EF Fa, ea na(e)
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The Newns-Anderson model
Now we should try to explain what happens when an atom approaches a metal surface When a simple atomic level approaches a surface with a constant sp-band will the level broaden: Why is it broadened?
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The Newns-Anderson model
When a simple atomic level approaches a surface with a simple sp-band will the level broaden and be lowered in bonding energy, I.e. be chemisorbed
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The Newns-Anderson model
If we again have a narrow atomic level approaching a broad sp-band on which there is superimposed a narrow d-band will we again see a broadening and a lowering, but when the interaction to the d-band is turned on will we have a splitting into bonding and anti-bonding levels. Non-bonding orbitals
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Summary of The Newns-Anderson model
Simple sp-band results in broadening and lowering: Evac EF Metal Adsorbate levels Distance from surface
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Summary of The Newns-Anderson model
Narrow d-band on top of sp-band results in splitting: Evac EF Metal Adsorbate levels Distance from surface
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Summary of The Newns-Anderson model
For molecules this may mean that the anti bonding orbitals get occupied resulting in bonding to the surface, but weakening of the internal bonding the essence of catalysis sp-band Evac EF Metal Adsorbate levels Distance from surface d-band s s*
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Free electron metals Cl orbital is occupied and it will be Cl-
Li 2s is not populated so it will be positively charged Li+
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Free electron metals + - E + - E
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Trend in atomic chemisorption energies
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Trend in atomic chemisorption energies
Attractive part Repulsive part
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Trend in atomic chemisorption energies
will be fixed for fixed adsorbate and fixed site and will reflect a proportionality for different adsorbates x Vad2 or b2 decreases with filling because d orbital becomes more localized, while increases with n since they become more extended
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Trend in atomic chemisorption energies
Remember Ebond=Esp+DEd-hyp Since Esp~-5 eV we will start out with strong bonding that decreases with incresing f (filling of d-band) f=1, n=5 Why is Gold so noble?
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Trend in molecular chemisorption energies
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Trend in molecular chemisorption energies
For the late transition metals (from Fe,Ru,Os) Attractive part Repulsive part Not as easily interpreted as the atomic trends, but CO adsorbs stronger when going to the left, at least to the middle part of the TM
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Trends in surface reactivity
For the late transition metals the 2p is more important than the 5s The bonding increases when going to the left since the d-band moves upwards faster than f decreases If we look at a fixed f then we can evaluate the influence of strain or compression of a metal
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Trends in surface reactivity
EF Ed p*
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The overall Picture Physisorption Molecular Chemisorption
Atomic Chemisorption Reaction Desorption?
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Density Functional Theory (DFT)
z Repeat super cell in xyz Use a plane basis set for describing eletrons Solve the Schødinger equation in an approximate manner Accurate within eV x
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N2 approaching Ru(0001) Ex: DFT Calculation
It costs 9.8 eV to dissociate N2 in the gas phase while on Ru(0001) it only cost 1.4 eV i.e. Catalyst
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Trends in Reactivity The hight in the transition state will basically go as the molecular bonding energy. For the late transition metals: Cu, Ag, and Au cannot dissociate CO Ni can barely, but Pd and Pt cannot. In principle they should be able to do this by the final state is bonded to weakly (I.e. C and O) So this is a final state effect.
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Sabatier´s Principle Perfect Too Reactive Too Noble
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Separating of electronic and geometric effects
Geometrical
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Active Sites on Ruthenium
Surface Particle
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Size Distribution Before and After Annealing
B5 sites, (110) geometry B5 sites, (311) geometry 600 particles analyzed TEM PDSP01 Ru/MgAl O 2 4 P: 50 bar ; Temp.: 475 °C gas: H :N = 3:1 2 2 170 hours at 500 °C. 6,0 2½ hours at C. H. Jacobsen, S. Dahl, P. L. Hansen, E. Toernqvist, H. Topsøe, D. V. Prip, P. B Møenshaug, and I. Chorkendorff, J. Mol. Catal. A: Chemical 163 (2000) 19. 5,0 500 °C Activity [mmol/(g*s] 4,0 3,0 50 100 150 200 250 300 Time [h]
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Designing catalysis by alloying?
Ni, Cu / Fe Cu / Co Cu, Pd, Ag / Ru Cu, Pd, Ag / Rh Ag / Pd Cu, Pd, Ag, Pt, Au / Ir Ag, Au / Pt Ru, Ir / Co Fe, Ru, Rh, Ir, Pt / Ni Ni, Pt / Cu Fe, Co / Rh Fe, Co, Ni, Cu / Pd Co, Ni, Cu, Rh, Pd, Pt / Ag Fe, Co, Ru / Ir Fe, Co, Ni, Cu, Ru, Rh / Pt Fe, Co, Ni, Cu, Rh, Pd, Pt / Au Fe, Co / Cu Ru, Rh, Ir / Pd Fe, Ru, Ir / Ag Ru, Ir / Au Co, Rh, Pd/Fe Ag, Ir, Pt, Au / Fe Rh, Pd, Ag, Pt, Au / Co Cu, Pd, Ag, Au / Ni Ag, Au / Cu Fe, Co, Ni, Pt, Au / Ru Ni, Pt / Rh Au / Pd Curve shape + alloy - phase-separation substrate atoms segregate to the surface adsorbate atoms segregate to the surface Designing reactivity
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Thermal Experiment: CH4 Dissociation at 530 K
2 min annealing to 1100 K 3e-7 Initial sticking probability 700 K flash 2e-7 1e-7 1 2 3 4 Ni Coverage [ML] R. C. Egeberg and I. Chorkendorff, Catal.Lett. In press 2001.
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Universality in Heterogeneous Catalysis
Brøndsted-Evans-Polany (BEP) relationship: There is a linear relation between bonding energy and activation energy barrier. Why is it structure dependent? For a given substrate and site the TS all look alike Why is it adsorbate independent? In TS the molecules lose indentity Why is the relationship between the activation energy and the adsorption energy linear? When the molecule have lost identity in TS the energy is determined by the products
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The Industrial Ammonia synthesis
The Real Ammonia reactor The schematic reactor inlet outlet A B D C The equilibrium curve The optimum operating line
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The Industrial Ammonia synthesis
The equilibrium curve The optimum operating line C. H. Jacobsen J. Catal. 205 (2002) 382
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The Concept of Optimal Catalyst Curve
2:1 80bar 420oC 3:1 200bar 450oC 5% 5% Defines optimal Catalyst 90% 90% High ammonia conc. 90% requires low bonding energy 2:1 80bar 420oC 3:1 200bar 450oC Low ammonia conc. 5% requires higher bonding energy Claus Jacobsen et al. J. Catal. 205 (2002) 382
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