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Microprocessor Design Process
Dr. Mongkol Ekpanyapong
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Inside a computer
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A Typical PC Motherboard (D975XBX)
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A Typical PC System Architecture
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What’s the culprit in computer performance?
First transistor Bell Labs, 1948 Intel 22nm transistor 2006
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Device Feature Size Feature size reductions enabled by process innovations. Smaller features lead to more transistors per unit area and therefore higher density.
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Microprocessor performance
40% performance increases when new generation of transistor is introduced
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Transistor speed Shorter transistor length, faster switching speed
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CPU clock speed Name Date #trans Length Clock Width 8086 1974 6k 6 um
2MHz 8 bits 8088 1979 23k 3 um 5MHz 16 bits 80286 1982 134k 1.5 um 6MHz 80386 1985 275k 16MHz 32 bits 80486 1989 1.2 M 1 um 25MHz Pentium 1993 3.1 M 0.8 um 60 MHz PentiumII 1997 7.5 M 0.35 233MHz Pentium III 1999 9.5 M 0.25 450MHz Pentium4 2000 42 M 0.18 1.5 GHz Prescott 2004 125 M 0.09 3.6 GHz
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Rapid Increase in Density of Memory
Memory chip density versus time.
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Prescott architecture
Single core Long pipeline (31 stages) The higher pipeline depth, the faster clock speed Processor speed 3.8 GHz Cache 512 kB 3 Arithmetic Logical Units (ALUs) 32 bit architecture
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Core 2 definition Core 2 solo: only 1 processor in your PC
Core 2 duo: 2 processors in your PC Core 2 quad: 4 processors in your PC Core 2 is the name of the architecture likes 8086, Pentium, Pentium4
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How long does it take to design a microprocessor?
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Intel roadmap
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Merom die
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Core 2 architecture
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Penryn die
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Nehalem die
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Nehalem Core
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Westmere die
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Sandy Bridge
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Batman : arkham asylum
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Batman : performance
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Microarchitecture Design
VLSI Design Flow Architecture Design Microarchitecture Design Logic Design Circuit Design Physical Design Fabrication Packaging and Testing
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Management team + Financial team + Architect
Product planning Product roadmap Product schedule Product cost Performance/Power/Area tradeoff Management team + Financial team + Architect
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Architecture/Microarchitecture design
Architecture: (visible to external world) Architecture selection Intellectual Properties (IP) based design Instruction set Microarchitecture: (functional units) Product features Performance and power study Performance/Power/Area study Architect + Logic designer
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Architect + Logic designer + Circuit designer
Register transfer level (RTL) using Hardware Description Language (HDL) Architect + Logic designer + Circuit designer
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Functional unit block design
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Logic Synthesis
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Circuit design Timing optimization Power optimization
Logic designer + Circuit designer + Mask designer/Design automation Engineer
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Timing tools
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Clock gating and power compiler
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Layout design Area compaction Routability & congestion
Circuit designer + Mask designer / Design automation Engineer
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Layout simulation
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VLSI routing
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Thermal map
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Manufacturing Fabrication process Process Engineer Oxidation
Photolithography and Etching Diffusion and implantation Metallization Process Engineer
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Czochralski process
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Silicon Ingot
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Silicon wafer before processing
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Final Silicon wafer
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Packaging Package Engineer
Signal and power connections between the chip and a circuit board Remove heat produced from the chip Protects from mechanical and thermal damage Cost saving Package Engineer
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Wafer/Die
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Structure of CMOS chip + packaging
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Validation/Debugging and testing
From logic design till silicon debugs Pre-silicon testing: Design for testability Test input vector Formal verification Post-silicon testing: Stress testing -Electrical testing Platform testing -Burn-in self test Speed path testing
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Design rule check
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Design flow
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Design Team Roles Architect - define microarchitecture
Logic designer – convert microarchitecture to RTL Circuit designer – convert RTL to transistor level Mask designer – convert circuit design to layout Validation engineer – verify logic/circuit correctness Design automation engineer –create/support design CAD tools
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System design
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Design Automation
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Questions?
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