1. April 28, 2009 IACHECH. Matsumoto1 Introduction of the Soft X-ray Imager (SXI) on board the Astro-H satellite H. Matsumoto (Kyoto Univ.) on behalf of the SXI team

2. April 28, 2009 IACHECH. Matsumoto2 The SXI team PI: H. Tsunemi (Osaka Univ.) –Osaka Univ.: K. Hayashida, N. Anabuki, H. Nakajima –Kyoto Univ.: T. Tsuru, H. Matsumoto –ISAS/JAXA: T. Dotani, M. Ozaki, A. Bamba –Kogakuin Univ. : T. Kohmura –Rikkyo Univ.: H. Murakami –RIKEN: J. Hiraga –Miyazaki Univ. : K. Mori, M. Yamauchi –Noqsi: J. P. Doty –MIT: M. W. Bautz

3. April 28, 2009 IACHECH. Matsumoto3 Soft X-ray Imager (SXI) Requirements –Imaging capability for compensating the calorimeter (Soft X-ray Spectrometer; SXS) –Bridging the dynamic ranges of the SXS(0.3—10keV) and of the Hard X-ray Imager (HXI; 5—80keV) SXI = X-ray CCD Wide dynamice range: 0.2 – 20 keV Low background: similar to the Suzaku X-ray CCD (XIS)

4. April 28, 2009 IACHECH. Matsumoto4 From XIS (Suzaku) to SXI (ASTRO-H) XIS 4 cameras 1 chip/camera FOV 18arcmin □ MIT/Lincoln chip Nch CCD FI and BI Temp -90 ℃ Peltier Cooler Optical Blocking Filter SXI 1 camera 4 chips/camera FOV 38arcmin □ HPK chip Pch CCD BI Temp -120 ℃ Stirling Cooler Optical Blocking Layer

5. April 28, 2009 IACHECH. Matsumoto5 X-ray CCD chip of SXI Spec (manufacturer : Hamamatsu Photonics) Pch back-illuminated CCD (carrier = hole) Depletion layer is > 200μm 4 chip mosaic 1 chip Pixel : 24μm □ 、 1280x1280 、 30.72mm □ FOV 38arcmin □ (Focal Length ~ 5.6m) Optical Blocking layer (Al - PI – Al) on the chip Chip gap (dead area) : >0.6mm We need off-set the bore-sight by 5x5mm. SCI technique (Charge injection) is employed. 1 CCD chip

6. April 28, 2009 IACHECH. Matsumoto6 CCD current status Spectrum of 55Fe FWHM 135+/-4eV@6keV Noise 5.6 +/- 0.1 e- X-rays from 109Cd Detection Effificency

7. Overall view of the SXI camera April 28, 2009 IACHECH. Matsumoto7 Analog Elec Stirling Cooler

8. Optical Blocking Layer (OBL) Specification –Optical/UV light is blocked –Eliminate the thin plastic film (OB Filter) to avoid the vacuum system. April 28, 2009 IACHECH. Matsumoto8 CCD Al 1000 Å Al 400 Å Polyimide 1000~2000 Å OBL

9. Efficiency and Effective Area April 28, 2009 IACHECH. Matsumoto9 SXI (with OBL) SXI + XRT

10. April 28, 2009 IACHECH. Matsumoto10 CCD SXI System dark level process event extraction DE/IF FPGA DE/IF FPGA * Hardwares of DE I/F board and sequencer board are identical Pixel CODE Δ∑ modulator & decimation filter frame data event candidates memory Command ① Driver DAC set ② High/Low Switching ③ PreAmp gain 、 Pump DAC set & ASIC timing SOI SOC SOI SOC memory Space Card memory 電圧 / 温度モニタ Temp Control HK CPU SXI PSU ③ ② ① SXI-E SXI-A HeaterPow Cmd I/F FPGA Cmd I/F FPGA Drive clock Sequencer FPGA Sequencer FPGA Heater Temp monitor SpW FPGA SpW FPGA SpW FPGA SpW FPGA Inter-board bus Universal SpW Module x2 SXI FrontEnd HK ADC CCD Driver ( DAC + Analog SW) CCD Driver ( DAC + Analog SW) Video ASIC ver.20080408 SXI-DE SXI-S Frame data

11. Calibration plan Screening process will begin this fall. –Optimize parameters such as voltage etc. –OBL, noise, bad pixels etc.. Calibrations of flight sensors will begin in spring, 2012. –At Osaka Univ. (soft-energy band) and Kyoto Univ. (hard-energy band) –QE, energy resolution How to calibrate QE of BI sensor with OBL? April 28, 2009 IACHECH. Matsumoto11