1. An Engineering & Design Services Company Presentation

2.  An Engineering Service Company specializes in Design, Analysis and Manufacturing services.  Established in 1998 with the corporate office in Raanana Israel.  Expert engineers with an average experience of 10+ years of experience.

3. Manufacturing & Assembly Lead: Valery Development & Library Lead: Alex Total Designer: 2 SI / EMI Analysis & Simulation Lead: Vadim P Expedition MENTOR Lead: Roman Total Designer: 3 ORCAD & Cadence Lead: VadimK Total Designer: 6 ALTIUM Designer Lead: Evgeny Total Designer: 3 Product Design Analog Lead: Eli Digital Lead: Roi Marketing & Consulting Lead: Dov Pinto Administration Lead: Shira  Total Employees: 18

4.  Design Services  Analysis & Simulation Services  Manufacturing Services  Product Design  PCB Design  PCB Library development  PCB Data migration & Re-Design

5.  High-speed Digital, Analog & Mixed signal design  Embedded, FPGA & CPLD based design  Power supply designs  Designs with High speed memory devices & High speed communication interfaces  Electrical Design from component selection & Schematic entry  PCB Design & 3D Step Modeling  Building of prototypes  Board bring-up, testing & design validation  FPGA verification testing (VHDL)  Transformation to production phase

6.  High speed Digital designs, Analog designs, mixed designs, power & RF design  Signal Integrity EMC & EMI Compliant designs  PCBs with DFM, DFT, DFA requirements  PCBs with Controlled impedance requirements  PCBs for mechanical constrained designs  PCBs for Flexi, Rigid & Rigid-Flex designs  HDI designs with via-in-pad, bling via, buried via & micro vias  Effectively used via stacking & staggering technology  High frequency PCBs of up to 10Gbps Ethernet & 800MHz BUS speed  High layer count PCBs of up to 24 layers  Dense PCBs with pin count of 18000+pins  PCBs with high pin density of 540 pins/sq. inch  High component count PCBs;> 5000 components  Designs with fine pitch BGAs of 0.4mm & 0.5mm  Designs with high pin count full matrix BGA+2400  Designs with 3mils/3mils trace & spacing

7.  Designs with various memory interfaces DDR3, DDR2, DDR, Rambus SDRAM, QDR, Flash, CompactFlash  Designs with interfaces like XAUI,SERDES,SPI-4,POE,GbE,10GbE  Designs with PCle, PCIX, cPCI, Rocket IO  Designs with the interfaces SCSI,SDIO,LVDS,RVDS,USB,UART,I2C.  Designs with video applications HDMI,DVI, Composite Video, S-Video, VGA  Designs with Bluetooth, WiFi, GPS & GPRS  Designs with Intel based Atom processors  Designs for the Mobile phones  Designs with FPGA & ASIC  Designs with printed antennas

8.  New Library Development  Library management solutions  Library conversions  Library verifications  IPC LP Wizard  Allegro Design Workbench (ADW)

9.  Schematic symbols are created as per the IEEE standards  PCB footprint & padstack creations as per the recommendations made in IPC- 2221 and IPC-2222 standards  PCB footprint & padstack naming as per IPC-2220 standards  Drill tolerances as per the IPC-2615 standards  Customer defined guidelines

10.  Cadence Allegro  Mentor Expedition  Altium Designer  CAM350  VALOR  ORCAD capture  ALTIUM Designer  DESIGN Capture  DX Designer

11.  PCB layout conversion  Gerber level verifications  Schematic conversion  Logical level verifications  Library conversion  Symbols & Footprints verifications

12.  Signal Integrity Analysis  EMI Analysis  Thermal Analysis  Power Integrity Analysis  Analog simulation  Cadence Sigrity SI/PI and PowerDC  Mentor Hyperlynx SI GHz  Mentor Hyperlynx PI  Mentor Hyperlynx Thermal

13.  Signal Integrity Analysis  Pre-route and post-route Signal Integrity Analysis  SI compliance verification for an existing design  Reflection & Ringing Waveform Analysis  Eye-diagram analysis  Crosstalk analysis  Radiated Emissions (RF) simulation and analysis

14.  Thermal Analysis  Identifying points of weakness in thermal design (hot spots)  Looking for zones of stagnation (Iow cooling efficiency)  Identifying overstressed components (junction temperature exceeding established value)  Power Integrity Analysis  DC Drop Analysis  Decoupling Analysis

15.  Analog circuits Simulation  Digital circuits Simulation  Mixed circuits Simulation  Power circuits  PSPICE  LT SPICE

16.  PCB Fabrication  PCB Assembly  Component Sourcing  3D Analysis and Printing  CAM Validation

17.  Large pool of highly experienced designers with expertise in multi tools & technologies  Easy scale up of the resources as per the design requirements  We will work around your schedule with flexible timings to meet your requirements  More reliable and consistent in the quality of deliverables  Extensive design process & Quality checks – ISO9001:2008  Offer 24x7 design support  On & Offsite design support  Expert project management, open communication & Daily status reports

18.  Project based  Fixed Bid- TRACE PCB Takes complete ownership  Time & Material (T&M)  Provide staff both On-site & Off-shore ownership for project activities  Offshore Development Centre  Dedicated team for specific customer

19. For more details kindly visit www.tracepcb.com