1. Date of download: 6/6/2016 Copyright © ASME. All rights reserved. From: Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications J. Electron. Packag. 2016;138(1):010910-010910-9. doi:10.1115/1.4032496 Schematic of 3D IC with microfluidic cooling Figure Legend:

2. Date of download: 6/6/2016 Copyright © ASME. All rights reserved. From: Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications J. Electron. Packag. 2016;138(1):010910-010910-9. doi:10.1115/1.4032496 Optical and scanning electron microscopy image of the heat sink Figure Legend:

3. Date of download: 6/6/2016 Copyright © ASME. All rights reserved. From: Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications J. Electron. Packag. 2016;138(1):010910-010910-9. doi:10.1115/1.4032496 Fabrication process of the heat sink sample Figure Legend:

4. Date of download: 6/6/2016 Copyright © ASME. All rights reserved. From: Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications J. Electron. Packag. 2016;138(1):010910-010910-9. doi:10.1115/1.4032496 Flow loop schematic Figure Legend:

5. Date of download: 6/6/2016 Copyright © ASME. All rights reserved. From: Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications J. Electron. Packag. 2016;138(1):010910-010910-9. doi:10.1115/1.4032496 Pin-fin array dimensions Figure Legend:

6. Date of download: 6/6/2016 Copyright © ASME. All rights reserved. From: Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications J. Electron. Packag. 2016;138(1):010910-010910-9. doi:10.1115/1.4032496 (a) Heat transfer coefficient, (b) mean temperature difference from wall to fluid, (c) convective resistance, and (d)pressure drop for single-phase Figure Legend:

7. Date of download: 6/6/2016 Copyright © ASME. All rights reserved. From: Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications J. Electron. Packag. 2016;138(1):010910-010910-9. doi:10.1115/1.4032496 (a) Local two-phase heat transfer coefficient, (b) boiling curve, (c) pressure drop, and (d) vapor quality Figure Legend:

8. Date of download: 6/6/2016 Copyright © ASME. All rights reserved. From: Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications J. Electron. Packag. 2016;138(1):010910-010910-9. doi:10.1115/1.4032496 Flow visualization of sample 1 at 381 W Figure Legend:

9. Date of download: 6/6/2016 Copyright © ASME. All rights reserved. From: Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications J. Electron. Packag. 2016;138(1):010910-010910-9. doi:10.1115/1.4032496 Three-dimensional interconnect link Figure Legend:

10. Date of download: 6/6/2016 Copyright © ASME. All rights reserved. From: Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications J. Electron. Packag. 2016;138(1):010910-010910-9. doi:10.1115/1.4032496 Delay, wire length, and TSV capacitance versus (a) micropin-fin pitch and (b) TSV height Figure Legend:

11. Date of download: 6/6/2016 Copyright © ASME. All rights reserved. From: Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications J. Electron. Packag. 2016;138(1):010910-010910-9. doi:10.1115/1.4032496 Delay and R CONV versus (a) micropin-fin pitch and (b) TSV height Figure Legend: