1. Status 1 5/07/08 UCB RBSP EFW STATUS 5/07/08

2. Status 2 5/07/08 UCB Agenda Project Stuff Monthly Report Submitted Schedule Submitted  Milestones Upcoming : Combined IRR/PDR 9/04/08 (new agenda)  See Project Action List attached Safety and Mission Assurance  The Matrix.v. PAIP  Upcoming Telecon on Wed 5/14 at 9:00-11:30am Pacific  Parts  Micro 4Gbit part purchase (1000 qty!)  OpAmp Tester  Materials Selection  Radiation Tests at APL: Should the Cable be Tested? Mechanical Status  SPB (Spec, Preamp Shield Design, New Wire, Electrical Diagram)  Preamp Shielding Design.  AXB (Spec, Sensor Whip Design, Electrical Diagram)  Sensor Whip Design Complete, Breadboard Sensor Built. Test Results  IDPU( Box Concept)  Connector Radiation Paths

3. Status 3 5/07/08 UCB Goal: 350 mils Al equivalent Rule of Thumb: Al thickness x (Al density / Ta density) Tantalum equivalent: 56 mils Bronze equivalent: 106 mils PEEK equivalent: 726 mils GD 5/7/08 e-e- e-e- e-e- Preamp Enclosure

4. Status 4 5/07/08 UCB EFW Action Items

5. Status 5 5/07/08 UCB Project Action Items

6. Status 6 5/07/08 UCB Project Action Items

7. Status 7 5/07/08 UCB Schedule

8. Status 8 5/07/08 UCB Next Weeks Agenda Electrical Status, Documents, Breadboarding  SYSTEM Developments  Removal of Density Mode  IDPU Development  DCB (Breadboard, FPGA design, ALBM, A/D latchup)  DFB (New Specification)  BEB (Spec, Breadboards, EMFISIS buffers)  LVPS w/PCB (Spec, Breadboard, Candidate Parts for Radiation Tests)  Backplane (Spec, Stress Analysis)  FSW (Spec, Test Plan)  Preamp (Shielding, Insulation, DDD, First Circuit mods)  GSE (Requirements, Selection of Heritage Software, S/C Sim, Schedule)