1. Date of download: 6/24/2016 Copyright © ASME. All rights reserved. From: High Performance Anisotropic Conductive Adhesives Using Copper Particles With an Anti-Oxidant Coating Layer J. Electron. Packag. 2010;132(1):011007-011007-5. doi:10.1115/1.4001229 Schematic illustration of I-V measurement for ACA joint Figure Legend:

2. Date of download: 6/24/2016 Copyright © ASME. All rights reserved. From: High Performance Anisotropic Conductive Adhesives Using Copper Particles With an Anti-Oxidant Coating Layer J. Electron. Packag. 2010;132(1):011007-011007-5. doi:10.1115/1.4001229 Results on the contact angles of the CA treated copper samples and the average contact angle of the freshly cleaned untreated sample with variation in the dipping times Figure Legend:

3. Date of download: 6/24/2016 Copyright © ASME. All rights reserved. From: High Performance Anisotropic Conductive Adhesives Using Copper Particles With an Anti-Oxidant Coating Layer J. Electron. Packag. 2010;132(1):011007-011007-5. doi:10.1115/1.4001229 Contact angle versus aging temperatures (10 min) for the CA treated copper samples Figure Legend:

4. Date of download: 6/24/2016 Copyright © ASME. All rights reserved. From: High Performance Anisotropic Conductive Adhesives Using Copper Particles With an Anti-Oxidant Coating Layer J. Electron. Packag. 2010;132(1):011007-011007-5. doi:10.1115/1.4001229 Contact resistance changes of Cu-filled ACA and conventional ACA joints as a function of temperature up to 240 °C Figure Legend: