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AHCAL LDA CALICE electronics and DAQ Meeting DESY Hamburg, Dec. 10, 2012 André Welker Bruno Bauss, Volker Büscher, Reinhold Degele, Sascha Krause, Yong.

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Presentation on theme: "AHCAL LDA CALICE electronics and DAQ Meeting DESY Hamburg, Dec. 10, 2012 André Welker Bruno Bauss, Volker Büscher, Reinhold Degele, Sascha Krause, Yong."— Presentation transcript:

1 AHCAL LDA CALICE electronics and DAQ Meeting DESY Hamburg, Dec. 10, 2012 André Welker Bruno Bauss, Volker Büscher, Reinhold Degele, Sascha Krause, Yong Liu, Lucia Masetti, Uli Schäfer, Rouven Spreckels, Stefan Tapprogge, Rainer Wanke

2 Readout chain General info: 2André Welker, CALICE electronics Meeting, DESY, Dec. 10, 2012 Clock and Control Card

3 Readout chain General info: 2 AHCAL specific LDA André Welker, CALICE electronics Meeting, DESY, Dec. 10, 2012

4 Cambridge Meeting September 2012 3 Put LDA board inside cable shaft: André Welker, CALICE electronics Meeting, DESY, Dec. 10, 2012

5 Cambridge Meeting September 2012 4 Solution: LDA with flex ribbon cable: Consists of four separated parts: 1.Three passive PCBs: the 48 HDMI-connectors are on this three PCBs. 2.One active PCB: on this mezzanine we can change our FPGA/processor without problems. André Welker, CALICE electronics Meeting, DESY, Dec. 10, 2012

6 Cambridge Meeting September 2012 4 Solution: LDA with flex ribbon cable: Consists of four separated parts: 1.Three passive PCBs: the 48 HDMI-connectors are on this three PCBs. 2.One active PCB: on this mezzanine we can change our FPGA/processor without problems. André Welker, CALICE electronics Meeting, DESY, Dec. 10, 2012

7 ILD and the LDA 5 ILD barrel : André Welker, CALICE electronics Meeting, DESY, Dec. 10, 2012

8 ILD and the LDA 5 ILD barrel : André Welker, CALICE electronics Meeting, DESY, Dec. 10, 2012 readout 2 HCAL segments

9 ILD and the LDA 5 ILD barrel : André Welker, CALICE electronics Meeting, DESY, Dec. 10, 2012 HCAL shaft with cooling pipes and TPC cables readout 2 HCAL segments

10 ILD and the LDA 5 ILD barrel : André Welker, CALICE electronics Meeting, DESY, Dec. 10, 2012 HCAL shaft with cooling pipes and TPC cables readout 2 HCAL segments ECAL shaft

11 ILD and the LDA 5 ILD barrel : André Welker, CALICE electronics Meeting, DESY, Dec. 10, 2012 readout 2 HCAL segments More than anticipated: 48 96 HDMI-connectors on the PCBs. HCAL shaft with cooling pipes and TPC cables ECAL shaft

12 Specific AHCAL LDA 6 Solution: LDA with flex ribbon cable: Consists of four separated parts: 1.Three passive PCBs: the 48 96 HDMI-connectors are on this three PCBs. 2.One active PCB: on this mezzanine we can change our FPGA/processor without problems. André Welker, CALICE electronics Meeting, DESY, Dec. 10, 2012 Middle WingRight WingLeft Wing

13 Wing-LDA The three PCBs: 1. Wing with 18 HDMI-connectors routed (without flex ribbon cable): 7 450mm André Welker, CALICE electronics Meeting, DESY, Dec. 10, 2012

14 Wing-LDA The three PCBs: 2. Middle PCB with 12 HDMI-connectors (without flex ribbon cable): 8 400mm DATA/BUSY TRIG/CLK/DATA DATA/BUSY TRIG/CLK/DATA André Welker, CALICE electronics Meeting, DESY, Dec. 10, 2012

15 Wing-LDA The three PCBs: 3. FPGA mezzanine: 9 1.First test with Mars-ZX3 PCB:  New Xilinx FPGA/processor (108 I/Os), needed 490 2.Later with a FPGA/processor who can handle more I/Os: 110mm Zync André Welker, CALICE electronics Meeting, DESY, Dec. 10, 2012 Mars-ZX3

16 Amount of data Data: 1.1 SPIROC max. 18696bits (8bits ID, 256bits time stamp, 9216bits TDC, 9216bits Data) 10André Welker, CALICE electronics Meeting, DESY, Dec. 10, 2012

17 Amount of data Data: 1.1 SPIROC max. 18696bits (8bits ID, 256bits time stamp, 9216bits TDC, 9216bits Data) 2.Per Slab max. 24 SPIROCs 10André Welker, CALICE electronics Meeting, DESY, Dec. 10, 2012

18 Amount of data Data: 1.1 SPIROC max. 18696bits (8bits ID, 256bits time stamp, 9216bits TDC, 9216bits Data) 2.Per Slab max. 24 SPIROCs 3.Max. 3 Slabs  72 SPIROCs per DIF  1346112 bits (per 200ms)  829,9kB/s  96 x 829,9 kB/s max. 100MB/s with 1GBit Ethernet  77,03MB/s maximum amount of data 10André Welker, CALICE electronics Meeting, DESY, Dec. 10, 2012

19 Beam DAQ HCAL (Ethernet) DAQ ECAL (Ethernet) HBU 2013 TB (DESY) André Welker, CALICE electronics Meeting, DESY, Dec. 10, 201211

20 Next steps Timeline: 1.Finalizing layout for a full-sized functional demonstrator. 2.Working on the software/firmware for the LDA. 3.Requiring more details on the new DIF firmware. 4.Start tests at the Mainz PRISMA detector lab. So that we are ready for the next TB. 12André Welker, CALICE Collaboration Meeting, Cambridge, Sep. 18, 2012

21 Next steps Are there some questions? 12André Welker, CALICE Collaboration Meeting, Cambridge, Sep. 18, 2012 Thank you for your attention!


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