1. Electronic Packaging DMT 243/3 Mohammad Nuzaihan Md Nor m.nuzaihan@unimap.edu.my 04-9798431 / 012-4296433 M.Nuzaihan DMT 243 – Chapter 1

2. Course Outcomes M.Nuzaihan DMT 243 – Chapter 1 At the end of the course students will have the ability to understand and explain the electronic packaging process flow. be able to identify the critical parameters for semiconductor packaging process. be able to discuss the technology trend in semiconductor packaging.

3. Evaluation Contribution M.Nuzaihan DMT 243 – Chapter 1 Final examination : 50% Course work: 50% - Labs / Assignments: 40% - Test 1 & 2: 10%

4. Course Contents M.Nuzaihan DMT 243 – Chapter 1 Chapter 1: Introduction to Microsystems Packaging Chapter 2:The Role of Packaging in Microelectronics Chapter 3: General Semiconductor Packaging Process Flow Chapter 4:Interconnection in IC Assembly Chapter 5:Fundamental Design for Reliability Chapter 6: Quantitative Analysis

5. List of Experimants M.Nuzaihan DMT 243 – Chapter 1 Lab 1: Wire bond pull Lab 2:Decapsulation Lab 3: Wire bonding LAB GROUP

6. Teaching Plan M.Nuzaihan DMT 243 – Chapter 1

7. References M.Nuzaihan DMT 243 – Chapter 1 Text book Rao Tummala. 2001. Fundamentals of Microsystem Packaging. Mc-Graw Hill Professional. References: M. Datta, T.Osaka, J.W Schultze (Editor). 2005. “Microelectronic Packaging”. CRC Press, Florida U.S Glenn R. Blackweel, 2000. “The Electronic Packaging Handbook”. CRC Press LLC. Florida U.S. William D. Brown (Editor). 1999,” Advanced Electronic Packaging with Emphasis on Multichip Modules”, IEEE Press Series on Microelectronics Systems. The Institute of Electrical and Electronics Engineers, Inc. New York

8. M.Nuzaihan DMT 243 – Chapter 1 Introduction to Microsystems Packaging Definition of Microsystems, Microsystems technologies, Microsystems Packaging (MSP), The importance of Microsystems packaging, System level Microsystems packaging.

9. M.Nuzaihan DMT 243 – Chapter 1 Introduction to Microsystems Packaging What is Electronic Packaging This is packaging but not in the sense of semiconductor

10. M.Nuzaihan DMT 243 – Chapter 1 Introduction to Microsystems Packaging

11. M.Nuzaihan DMT 243 – Chapter 1 Introduction to Microsystems Packaging Why Do We Need Packaging?

12. M.Nuzaihan DMT 243 – Chapter 1 Introduction to Microsystems Packaging Microsystem Products

13. M.Nuzaihan DMT 243 – Chapter 1 Introduction to Microsystems Packaging Definition of Microsystem Packaging Microsystems are microminiaturized and integrated systems based on microelectronics, RF, photonic, MEMS and packaging technologies.

14. M.Nuzaihan DMT 243 – Chapter 1 Introduction to Microsystems Packaging Microsystem Technologies Microelectronics: The First Technology Wave RF and Wireless: The Second Technology Wave Photonics: The Third Technology Wave MEMS: The Fourth Technology Wave

15. M.Nuzaihan DMT 243 – Chapter 1 Introduction to Microsystems Packaging 1 st Wave: Microelectronic Microelectronics is the first, and most important technology wave Invention of the transistor in 1949 by Brattain, Bardeen and Shockley at Bell Labs Development of planar transistor technology by Bob Noyce in 1959. First IC (2 transistors and 1 resistor) developed by Jack Kilby in 1959; Nobel prize 2000

16. M.Nuzaihan DMT 243 – Chapter 1 Introduction to Microsystems Packaging Communications are going portable and wireless History: i.Marconi (1901) received first wireless message in Newfoundland from Cornwall ii.Marconi’s companies were highly successful at providing radio communications iii.Received Nobel Prize for Physics in 1908 2 nd Wave : RF/Wireless Applications

17. M.Nuzaihan DMT 243 – Chapter 1 Introduction to Microsystems Packaging 3 rd Wave : Photonics Corning Glass demonstrated highly transparent fibers (1970) Bell labs demonstrated semiconductor lasers operating at room temperature

18. M.Nuzaihan DMT 243 – Chapter 1 Introduction to Microsystems Packaging Micro-Electro-Mechanical Systems (MEMS) is the integration of mechanical elements, sensors, actuators, and electronics on a common silicon substrate through microfabrication technology

19. M.Nuzaihan DMT 243 – Chapter 1 Introduction to Microsystems Packaging What is Microsystems Packaging (MSP) It includes 3 major technologies: Microelectronics,Photonics, MEMS and RF Devices Systems Engineering Systems Packaging Micro refers to micro devices ( ICs - which are fabricated in sub-micron dimensions). Systems refers to all electronic products. Packaging is defined as the bridge that interconnects the ICs and other components into a system –level board to form electronic product.

20. M.Nuzaihan DMT 243 – Chapter 1 Introduction to Microsystems Packaging Analogy Between Human and Electronics 1.Electronic products are like humans – they have “brains” or microprocessors 2.Packaging provides Power (feeding); Cooling (circulatory system); Protection (skeletal); Nervous system (signals too and from transducer); Photonic functions (eye) 3.Without packaging, microprocessors are useless

21. M.Nuzaihan DMT 243 – Chapter 1

22. M.Nuzaihan DMT 243 – Chapter 1 Introduction to Microsystems Packaging Packaging Hierarchy

23. M.Nuzaihan DMT 243 – Chapter 1 Critical Microsystem Packaging Technologies from Wafer to Systems- level board

24. M.Nuzaihan DMT 243 – Chapter 1 Introduction to Microsystems Packaging

25. M.Nuzaihan DMT 243 – Chapter 1 Introduction to Microsystems Packaging Summary of IC/Microsystems Packaging

26. M.Nuzaihan DMT 243 – Chapter 1 Assignment 1 A1 – Ist wave (moore’s law) A2 – 2 nd Wave A3 – 3 rd Wave B1 – 4 th Wave B2 – Why is Microsystems packaging important? B3 – Examples of Microsystems Packaging (SOC,SOB,SOP)