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1 C1-UD 4 THE PC Academic Year 08-09 DAI. Credit 1 (Single and Multiuser Operating Systems) Ferran Chic PELE-08/09 (Pla Experimental Llengües Estrangeres).Potenciació.

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Presentation on theme: "1 C1-UD 4 THE PC Academic Year 08-09 DAI. Credit 1 (Single and Multiuser Operating Systems) Ferran Chic PELE-08/09 (Pla Experimental Llengües Estrangeres).Potenciació."— Presentation transcript:

1 1 C1-UD 4 THE PC Academic Year 08-09 DAI. Credit 1 (Single and Multiuser Operating Systems) Ferran Chic PELE-08/09 (Pla Experimental Llengües Estrangeres).Potenciació de la llengua Anglesa a la FP) © Ferran Chic. DAI-1er- C1 (SO)

2 2 KEY CONCEPTS MOTHER BOARD CHIPSET BIOS RAM-CMOS

3 3 MOTHER BOARD Printed circuit where all the electronic components of the computer are placed.

4 4 MB Main Components Integrated circuits Chipset Rom-Bios Keyboard controller Other MB IC’s IDE / SATA controller NETWORK controller USB,MULTI I/O controller Slots Expansion slots Memory slots Processor slots Battery Internal connectors Power, floppy, ide, sata, leds and button chassis connectors. External connectors Network,paralel, serial, keyboard, mouse PS/2, usb, audio connectors...

5 5 MOTHER BOARD EXAMPLE 1 source

6 6 MOTHER BOARD EXAMPLE 2

7 7 MB EXAMPLE (3)

8 8 EXTERNAL CONNECTORS

9 9 CHIPSET SET OF IC’S THAT DETERMINES Computer features Maximum expansion capabilities CHIPSET CONTROLS, MANAGES AND ADAPTS THE DIFERENCES BETWEEN THE HETEROGENEUS SET OF COMPONENTS WITHIN A COMPUTER Memory CPU Cache L1 & L2 PCI BUS (PCIset) OTHER BUSES …

10 10 CHIPSET COMMON FUNCTIONS Microprocessor support Which one(s) ? How many ? MMU (Memory management unit) for cache and RAM control IDE/ATA control Keyboard,USB and PS/2 control Other buses PCI-set AGP-set RTC: (Real Time Clock) Power management

11 11 CHIPSET :Structure Northbridge : Memory Processor AGP PCI Southbridge: IDE Floppy USB RTC Energy Keyboard

12 12 CHIPSET brands VIA TECHNOLOGIES AMD SiS INTEL ALI ASUS

13 13 CHIPSET FIXES THIS FEATURES (and far more …) Memory type (SDRAM/RAMBUS/DDR) FSB speeds supported (100MHz, 133, 200...) IDE support and frequency supported (UDMA66,100) Processor types (celeron, athlon, duron, PIV,) Number of processors supported within the motherboard AGP types supported (x2,x4,x8, …) Type of expansion slots (isa, PCI,…) and maximum slots supported. Maximum ammount of RAM supported Maximum cache support CPU multiplier factor configuration RAM:FSB relationship. Serial ata support

14 14 MB COMPONENTS CHIPSET POWER CONNECTORS MICROPROCESSOR(s) SOCKET(s) BATTERY I/O SLOTS: PCI,ISA, AGP, PCI express x1, x2, etc LED AND BUTTON CONNECTORS EXTERNAL SLOTS: SERIAL, PARALEL, USB,PS/2, AUDIO, VGA, HDMI, RJ-45 Memory sockets BIOS RAM CMOS

15 15 Internal connectors FLOPPY IDE Microprocessor Power Fan WakeOnLan WakeONRing MB COMPONENTS II

16 16 KEY CONCEPTS P&P (PLUG AND PLAY) Requirements HARDWARE CHIPSET, BUS PCI &AGP DEVICE SUPPORT BIOS support Operating system support

17 17 ACPI (Advanced Configuration & Power Interface) Improvement of APM (by bios) ACPI allows O.S. to control energy management. Several states in ACPI protocol S0  on S1  monitor off S2  HD off S3  STR (Suspend to RAM) S4  software shutdown S5  standard shutdown REQUERIMENTS: ACPI must be supportted by O.S. BIOS Microprocessador Chipset Motherboard

18 18 ROM-BIOS Contains: SETUP program Startup initial code P&P support Uses : Flash Technology Easily updatable. Do you know how ? Do you know why ?

19 19 Just to remember … PC startup process

20 20 RAM-CMOS Small memory (2K’s) within the MB. Stores values that SETUP display and/or modify. Values are permanently stored due to the lithium battery of the motherboard


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