1. EMV Update Maryam Poursardar May 2008

2. 2 Agenda Specifications Update Type Approval Update Contactless Update VeriFone Solutions VeriFone Roadmap

3. 3 Specifications Update EMV 4.2 Specifications –integrating bulletins and clarifications to the specifications since EMV 4.1 –No impact on Level 1 and Level 2 testing –EMVCo will continue to issue 4.0 Approvals with 4.2 specifications as the basis of conformance Since 2006, bulletins published quarterly (End of each calendar quarter + one month) Specification and Application Note bulletins will follow today’s process

4. Click to edit Master title style Type Approval Update

5. 5 New EMVCo Policy EMVCo is introducing expiry (renewal) dates –Renewal testing to be applied prior to renewal date Pass: LoA to be extended and stays on EMVCo website Fail or no tested: LoA to be revoked or removed from EMVCo website Renewal date based on announcement date of the policy New approvals –3 years for H/W (IFMs) –4 years for kernels (EMV modules)

6. 6 New EMVCo Policy Previously Approved Devices and Kernels –Against 3.1.1 test plans 12 months grace period for IFMs and Kernels –Against 4.0 test plans (kernels only) 2 years grace period after bulletin publication or 3 years after LoA Example (assuming policy is announced in July 2008) –Kernel approved in Aug 2006, renewal will be July 2010 (2 years after bulletin publication) –Kernel approved in Aug 2007, renewal will be Aug 2010 (3 years from LoA)

7. 7 Type Approval Test Plans Test Plans – Currently published quarterly (End of each calendar quarter + one month) –Current effective test plan is 4.1e

8. 8 New Test Plan Release Process To provide more stability in the Level 2 test plan To reduce number of TA bulletins to once a year To reduce updates to test cases to once a year To provide sufficient time for test tool enhancement and qualification To allow vendors to continue leveraging the Multiple Configuration Kernel process

9. 9 New Test Plan Release Process All TA bulletins will be published on every May 1 st Six months later, these test case updates are incorporated in the Test Plan for November 1 st release Test cases updates introduced by the bulletins become effective upon publication of the test plan on November 1 st TA bulletins related to field issues would be exceptions This process will start May 2008 –4.1.f will be published on November 1 st, 2008

10. 10 Test Tool Qualification Process Achieve consistent test results from all EMVCo laboratories Ensure common test tool validation –Validation is done for each tool implementation EMVCo is currently working in a tool qualification tool –Targeted end of 2008

11. Click to edit Master title style Contactless Update

12. 12 Contactless Specifications Multiple Schemes –Visa (MSD, qVSDC, Paywave) –MasterCard (Paypass Magstripe, MChip) –AMEX (ExpressPay) –JCB (JSpeedy) –Discover Specifications not stable

13. 13 EMVCo Contactless Specifications EMV Contactless Communication Protocol Specifications August 2007- Version 2.0 Level 1 – Test Equipment Specifications March 2008 - Version 2.0 No current plan for Level 2

14. 14 EMVCo Contactless Specifications Entry Point Specifications –Mechanism to allow any payment system application to co-exist on the same device (backwards compatibility) –Ability for future applications to co-exit (forwards compatibility) –Initial draft published October 2007 –Final version expected in May 2008 Entry Point available by EMVCo but not mandated –Up to payment systems –Testing process expected to be defined end of 2008

15. 15 EMVCo Contactless Testing Level 1 only (no Level 2 planned at this point) –Pre-validation –Analog –Digital Level 1 approval process to start in Q4 2008 Entry Point –Pre-validation –Application testing –Testing availability expected end of Q3, beginning Q4 2008

16. 16 EMVCo Contactless Testing Two laboratories under accreditation Process modeled based on current EMVCo contact –New registration and contract Process expected to start Q4, 2008 Administrative fees to be confirmed (expected to be $4,000 per approval)

17. 17 Mobile Payments This will be a major focus for EMVCo In May 2007, they have created a workgroup for this topic. There is no timeline for specs and approval process at this point

18. Click to edit Master title style VeriFone Solutions

19. 19 VeriFone EMV Solutions SC 5000 EMV Module 4.0 –Multi-configuration Approval ( 4 configurations) –New bulletins implemented –Supports Interac Requirements Vx EMV Module 4.0 –Multi-configuration Approval ( 7 configurations) –New bulletins implemented –Enhancements added –Supports Interac Requirements

20. 20 VeriFone EMV Solutions Verix EMV Module 4.0 –Multi-configuration Approval ( 7 configurations) –New bulletins implemented –Reported issues addressed MX EMV Module 1.0 –Multi-configuration Approval ( 3 configurations) –Compliant with 4.1a test cases MX EMV Module 2.0.0 (In progress) –Multi-configuration Approval ( 7 configurations) –Compliant with 4.1e test cases

21. 21 VeriFone EMV Solutions Nurit Kernel v4.4d –Multi-configuration Nurit Kernel v5.0a –Configurations targeted for Israel Dione Kernel 4.1

22. 22 VeriFone EMV Solutions OpenPay Kernel EMV2004.01 CardSlot Library –Smart Card Library –Included in EMV Modules –Released as part of the DTK –Released on Devnet –Enhanced for Vx, Verix, SC 5000, MX platforms Support for new cards added per custom request

23. Click to edit Master title style EMV Roadmap

24. 24 EMV Roadmap Regular upgrade of existing modules –MX EMV Module 2.0.0 (in progress) Modules for new H/W (Vx 700 + MX 710) –Vx UPT EMV Module 1.0.0 (in progress) Custom modules (France, China) Support for certified modules Renewals per new EMVCo rules

25. Click to edit Master title style Questions?