1. Date of download: 7/3/2016 Copyright © ASME. All rights reserved. From: Analysis of Flow and Thermal Performance of a Water-Cooled Transversal Wavy Microchannel Heat Sink for Chip Cooling J. Electron. Packag. 2012;134(4):041010-041010-6. doi:10.1115/1.4023035 Schematic of a transversal wavy microchannel heat sink Figure Legend:

2. Date of download: 7/3/2016 Copyright © ASME. All rights reserved. From: Analysis of Flow and Thermal Performance of a Water-Cooled Transversal Wavy Microchannel Heat Sink for Chip Cooling J. Electron. Packag. 2012;134(4):041010-041010-6. doi:10.1115/1.4023035 Schematic of one-branch straight microchannel Figure Legend:

3. Date of download: 7/3/2016 Copyright © ASME. All rights reserved. From: Analysis of Flow and Thermal Performance of a Water-Cooled Transversal Wavy Microchannel Heat Sink for Chip Cooling J. Electron. Packag. 2012;134(4):041010-041010-6. doi:10.1115/1.4023035 Schematic of one-branch transversal wavy microchannel Figure Legend:

4. Date of download: 7/3/2016 Copyright © ASME. All rights reserved. From: Analysis of Flow and Thermal Performance of a Water-Cooled Transversal Wavy Microchannel Heat Sink for Chip Cooling J. Electron. Packag. 2012;134(4):041010-041010-6. doi:10.1115/1.4023035 Channel pressure drop varying with Reynolds number Figure Legend:

5. Date of download: 7/3/2016 Copyright © ASME. All rights reserved. From: Analysis of Flow and Thermal Performance of a Water-Cooled Transversal Wavy Microchannel Heat Sink for Chip Cooling J. Electron. Packag. 2012;134(4):041010-041010-6. doi:10.1115/1.4023035 Temperature distribution of TWC2 at u = 1.4 m/s Figure Legend:

6. Date of download: 7/3/2016 Copyright © ASME. All rights reserved. From: Analysis of Flow and Thermal Performance of a Water-Cooled Transversal Wavy Microchannel Heat Sink for Chip Cooling J. Electron. Packag. 2012;134(4):041010-041010-6. doi:10.1115/1.4023035 Nusselt numbers varying with Reynolds number Figure Legend:

7. Date of download: 7/3/2016 Copyright © ASME. All rights reserved. From: Analysis of Flow and Thermal Performance of a Water-Cooled Transversal Wavy Microchannel Heat Sink for Chip Cooling J. Electron. Packag. 2012;134(4):041010-041010-6. doi:10.1115/1.4023035 Overall thermal resistance varying with Reynolds number Figure Legend:

8. Date of download: 7/3/2016 Copyright © ASME. All rights reserved. From: Analysis of Flow and Thermal Performance of a Water-Cooled Transversal Wavy Microchannel Heat Sink for Chip Cooling J. Electron. Packag. 2012;134(4):041010-041010-6. doi:10.1115/1.4023035 Overall thermal resistances versus pumping power Figure Legend: