1. Chapter 10 – Liquids and Solids 10.4 – 10.5 Notes AP Chemistry

2. Metallic Crystal Structures  Metallic crystal structures follow the closest packing model.  The closest packing model assumes metal atoms are uniform, hard spheres.  These spheres then pack together in a manner that most efficiently uses the available space.  Closest packed structures include the following arrangements: Hexagonal closest packed (aba) Cubic closest packed (abc)  In each arrangement any particular atom has six neighbors in the same layer, three in the layer above and three in the layer below (twelve total).

3. Bonding Model for Metals  Metals are characterized by having: High thermal conductivity High electrical conductivity Malleable Ductile High melting point  These properties are a result of the nondirectional covalent bonding found in metallic crystals.

4. Bonding Continued  Metal ions exist spread out in a closest packed structure with a “sea of electrons” in between them.  This accounts for a metals ability to be bent and stretched without breaking.  It is difficult to separate metal atoms, but easy to move them.  Mobile electrons can also conduct heat and electricity

5. Metal Alloys  Substance containing two or more elements and has metallic properties.  Two types of alloys: Substitutional – host metal atoms are replaced by metal atoms of similar size (brass – 2/3 Cu and 1/3 Zn, sterling silver – 93% Ag and 7% Cu) Interstitial – interstices in the closest packed structure are occupied by small atoms (steel – Fe with carbon atoms in interstices)  Different proportions of metal give alloys different properties (more carbon = stronger steel due to directional bonding).

6. Network Atomic Solids  Large molecules contain strong directional bonds.  Do not efficiently conduct heat or electricity.

7. Carbon 1. Diamond – hard colorless, nonconductor, insulator, tetrahedral arrangement with 4 other carbons 2. Graphite – black, slippery conductor  Layers of six carbon rings (sp 2 hybridized)  Delocalized electrons in pi bonds  Strong bonding within the layers, but weak bonding between them

8. Silicon  Silicon is to geology as carbon is to biology.  Different from carbon compound bonding although they are in the same group. Carbon makes long chains while silicon makes Si-O chains  Silica - SiO 2 is the fundamental compound  CO 2 uses sigma and pi bonding, but silicon is to large for that. Silicon satisfies its octet by forming single bonds with four oxygen atoms (quartz).  When cooled quickly, silica compounds can form amorphous glass.

9. Ceramics and Semiconductors  Ceramics – typically made from clays and are strong, brittle, and resistant to heat and chemical reactions  Semiconductors – a substance conducting only a slight electrical current at room temperature, but showing increased conductivity at higher temperatures