1. Shroff S.R. Rotary Institute of Chemical Technology, Vataria (099)
ANALOG ELECTRONICS ( )
Enrolment no

2. Operational Amplifier Basics - 2
Types of Integrated Circuits
Designations
Packages
Pin Configuration
Power supplies

3. Types of Integrated Circuits
The two types of linear IC packages are as follows:
Monolithic IC
Hybrid IC

4. Monolithic IC It is consist of transistor and some passive element.
This element are fabricated on a one single chip.
Chip is consist of semiconductor like silicon this process is called “planar technology”.
The word monolithic IC is a Greek word its meaning is “SINGLE STONE”.
It is by diffusion process and metallisation process.
Isolation process is carried out by three process:-
Di-electric
Beam lead
PN junction

5. Advantages of Monolithic IC
It contains high thermal stability.
All the component are integrated on the one single chip.
They are constructed very closer to each other

6. http://www. circuitstoday

7. Hybrid IC
Hybrid IC is consist of passive element and the interconnected with the substract which is used in integrated IC
It is also classified as thin film and thick film.
The active component (TRANSISTOR, DIODE and MOOLITIC INTEGRATED CIRCUIT) is connected to this circuit to complete this circuit.

8. Advantages of Hybrid IC
The advantage of hybrid circuits is that components which cannot be included in a monolithic IC can be used, e.g., capacitors of large value, wound components, crystals, inductors.

9. Manufacturer’s Designation for IC

10. In the united States alone there are well over 30 IC manufacturer’s producing millions of IC’s per year.
Each manufacturer uses a specific code and assigns a specific type no to the IC’s it produces.
That is, each manufacturer uses its own identifying initials followed by its own type no.
Ex. The 741 types of initially compensated Op-amp was originally manufacture by Fairchild and is sold as the μA741 where μA represents the identifying initials used by Fairchild.

11. Initials used by some of the well-known manufacturers of linear IC’s are as follows:
Fairchild μA, μAF
National Semiconductor LM, LH, LF, TBA
Motorola MC, MFC
RCA CA, CD
Texas Instruments SN
Burr-Brown BB

12. In addition to producing their own IC’s, A no of manufacturers also produces one another’s popular IC’s.
Some manufacturers usually retain the original type no of IC’s in their own IC designation.
Some Linier IC’s are available in Different classes such as A,C,E,S etc.
For Ex. 741,741A,741C,741E,741S are different versions of the same Op-amp.

13. Types of Packages
The three types of linear IC packages are as follows:
The Flat Pack
The Metal-can OR Transistor Pack
The Dual Inline Package (DIP)
(Flat pack)
Images from
(Metal-can)
(DIP)

14. Flat Pack
The chip is enclosed in a rectangular ceramic case with terminal leads extending through the sides & ends.
8,10,14,&18 leads.
Accomodate power supplies, input, output & several special corrections require to complete the circuit.
Images from pack.jpg

15. Metal-can The chip is encapsulated in a metal or plastic case.
3,5,8,10 or 12 pins.
Voltage regulator IC like :- LM117 – 3 pins
Power op-amp & audio power amplifiers - 5 pins
Best suited for power amplifier cause metal as a good heat conductor.
Better decipation capability then the flat pack & DIP packages.
Images from

16. Dual Inline Package Mounted inside a plastic or ceramic case.
Most widely used package cause it can mounted easily.
Available with 8,12,14,16 & 20 pins.
(Base)
Images from
(DIP)

17. Pin Configuration of Integrated Circuits

18. Pin 1 & 5 is Offset Null.
Pin 2 is Input & connected with Inverting terminal (V-).
Pin 3 is Input & connected with Non-inverting terminal (V+).
Pin 4 is –Vcc.
Pin 6 is Output.
Pin 7 is +Vcc.
Pin 8 is not connected & only used for special operations.

19. Any questions ?

20. Thank You