1. New single-chip “box” to test laser soldering in vacuum WP6 meeting, 16/01/14

2. The vacuum table for FPC and chip

3. The full set-up The vacuum system The goal is to reduce O 2 content to max ~100 ppm. At primary vacuum of 10 mbar O 2 ~ 2000 ppm; to avoid complications related to usage of a turbo pump, we will inject N 2 at few l/h to help O 2 removal. Proposed procedure: -Place and align chips and FPC on vacuum table -Place and align macor grid, fix all together -Stop vacuum table and mount top cover -Connect both box outlet and vacuum table to vacuum system -Start N 2 flushing, then start pumping down -Monitor O 2 content