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Date of download: 7/8/2016 Copyright © 2016 SPIE. All rights reserved. Cross section of MOS capacitor TEG. Figure Legend: From: Evaluation of damage induced.

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Presentation on theme: "Date of download: 7/8/2016 Copyright © 2016 SPIE. All rights reserved. Cross section of MOS capacitor TEG. Figure Legend: From: Evaluation of damage induced."— Presentation transcript:

1 Date of download: 7/8/2016 Copyright © 2016 SPIE. All rights reserved. Cross section of MOS capacitor TEG. Figure Legend: From: Evaluation of damage induced by electron-beam irradiation to metal-oxide semicondoctor gate pattern and method for damage-free inspection J. Micro/Nanolith. MEMS MOEMS. 2007;6(1):013009-013009-7. doi:10.1117/1.2437195

2 Date of download: 7/8/2016 Copyright © 2016 SPIE. All rights reserved. High-frequency C-V characteristics after electron irradiation. Beam energy was changed from 0.5to5.0keV. Figure Legend: From: Evaluation of damage induced by electron-beam irradiation to metal-oxide semicondoctor gate pattern and method for damage-free inspection J. Micro/Nanolith. MEMS MOEMS. 2007;6(1):013009-013009-7. doi:10.1117/1.2437195

3 Date of download: 7/8/2016 Copyright © 2016 SPIE. All rights reserved. Vfb shift measured from high-frequency C-V characteristics before and after electron irradiation. Beam energy was changed from 0.5to5.0keV. Figure Legend: From: Evaluation of damage induced by electron-beam irradiation to metal-oxide semicondoctor gate pattern and method for damage-free inspection J. Micro/Nanolith. MEMS MOEMS. 2007;6(1):013009-013009-7. doi:10.1117/1.2437195

4 Date of download: 7/8/2016 Copyright © 2016 SPIE. All rights reserved. Vfb shift as a function of number of scans at beam energy of (a) 3.0 and (b) 5.0keV. Figure Legend: From: Evaluation of damage induced by electron-beam irradiation to metal-oxide semicondoctor gate pattern and method for damage-free inspection J. Micro/Nanolith. MEMS MOEMS. 2007;6(1):013009-013009-7. doi:10.1117/1.2437195

5 Date of download: 7/8/2016 Copyright © 2016 SPIE. All rights reserved. Quasi-static C-V characteristics for beam energy of 0.5to5.0keV. Figure Legend: From: Evaluation of damage induced by electron-beam irradiation to metal-oxide semicondoctor gate pattern and method for damage-free inspection J. Micro/Nanolith. MEMS MOEMS. 2007;6(1):013009-013009-7. doi:10.1117/1.2437195

6 Date of download: 7/8/2016 Copyright © 2016 SPIE. All rights reserved. Trap density at mid-gap as a function of beam energy. Trap densities were calculated from quasi-static C-V characteristics. Figure Legend: From: Evaluation of damage induced by electron-beam irradiation to metal-oxide semicondoctor gate pattern and method for damage-free inspection J. Micro/Nanolith. MEMS MOEMS. 2007;6(1):013009-013009-7. doi:10.1117/1.2437195

7 Date of download: 7/8/2016 Copyright © 2016 SPIE. All rights reserved. Trap density at mid-gap as a function of number of scanning. Beam energy was (a) 3.0 and (b) 5.0keV. Figure Legend: From: Evaluation of damage induced by electron-beam irradiation to metal-oxide semicondoctor gate pattern and method for damage-free inspection J. Micro/Nanolith. MEMS MOEMS. 2007;6(1):013009-013009-7. doi:10.1117/1.2437195

8 Date of download: 7/8/2016 Copyright © 2016 SPIE. All rights reserved. High-frequency and quasi-static C-V characteristics. Figure Legend: From: Evaluation of damage induced by electron-beam irradiation to metal-oxide semicondoctor gate pattern and method for damage-free inspection J. Micro/Nanolith. MEMS MOEMS. 2007;6(1):013009-013009-7. doi:10.1117/1.2437195

9 Date of download: 7/8/2016 Copyright © 2016 SPIE. All rights reserved. High-frequency and quasi-static CV characteristics after annealing. The thickness of the gate dielectric was 10.0nm. Figure Legend: From: Evaluation of damage induced by electron-beam irradiation to metal-oxide semicondoctor gate pattern and method for damage-free inspection J. Micro/Nanolith. MEMS MOEMS. 2007;6(1):013009-013009-7. doi:10.1117/1.2437195


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