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Study of PC-HPGe detector for dark matter search CDEX collaboration Application of Germanium Detector in Fundamental Research Apr. 7-13,2013
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Outline Brief review: PC-HPGe detector HPGe detector development Conclusion 2 of 22
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Point-contact HPGe detector 3 of 22 First developed in the late 1980s as large volume, low noise HPGe detectors 1 pF capacitance ~ 300 eV noise threshold Recently “rediscovered” for neutrino detection, dark matter search, etc. MAJORANA, GERDA, CoGeNT, CDEX,…
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Charge Collection &Signal Induction 4 of 22 Charge collection and signal induction characteristics can be used to separate single- and multi-site events Hole Drift(mm/ns) Strong field exists in front of the point contact Significant signal induced only in close proximity to point contact - significant contribution typically only made by holes - relatively insensitive to electron trapping Strong field exists in front of the point contact Significant signal induced only in close proximity to point contact - significant contribution typically only made by holes - relatively insensitive to electron trapping Drift Time Electric Field Distribution
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Pulse Shape 5 of 22 Current pulse Charge pulse Very useful for background suppression: WIMP interaction is eminently single-site type. A large fraction of background is not. Very useful for background suppression: WIMP interaction is eminently single-site type. A large fraction of background is not.
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Detector Development Laboratory Crystal processing Pre-amplifier design –JFET based –CMOS based Simulation study 6 of 22
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Laboratory devices Clean room Chemical Lab 7 of 22 Vacuum Coating Machine Sputtering Device Mechanical-room
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Crystals Processed 8 of 22
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Detector Performance Planar Configuration 9 of 22 @132 K Recycled crystal ~10 g E = 2.24 KeV E = 2.13 KeV
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Detector Performance Point-contact Configuration-7# (17mm diameter) Test Result with 2-outer grooves Recycled crystal ~10 g E = 1.33 KeV E = 880 eV
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11 of 22 Cs-137, 550V,6 s, =0.273% Am-241, 550V,4 s, =1.69% Detector Performance Point-contact Configuration-11# (25mm diameter)
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13# Crystal (50mm diameter) 12 of 22 First try, ER = 1.34% @(1600V, 662keV) No improvement after many times of try Why? crystal? Capacitance analysis Leakage Current analysis See next pages Capacitance analysis Leakage Current analysis See next pages surface after etching More flaw founded, see following page
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Capacitance Analysis 13 of 22 Conclusion : –Match the results from others’ study and the simulation values; –The cryostat and the electronics design meet the requirement of low capacitance. 2 pF
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Leakage Current Analysis 14 of 22 7# detector 11# detector Theory Model 13# detector 13#crystal, the tendency is OK, but the value is too big
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More flaws were discovered: 15 of 22 Hole diameter: 10 mm Hole surface: groove Hole diameter: 10 mm Hole surface: groove Enlarge the hole Hole diameter: 13 mm Hole surface: smooth Hole diameter: 13 mm Hole surface: smooth
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Pre-amplifier Study: J-FET based Feedback methods –Resistor feedback –Pulse-reset feedback Test Cryostat for Pre- amplifier
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Performance: J-FET based Resistor Feedback Pulse-reset feedback ENC=14 e @-112 C 17 of 22 ENC=55 e @ -100 C With Low noise resistor With unpackaged JFET die
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18 of 22 In order to reduce the radioactivity, several bonding materials for J-FET were studied Teflon Quartz PCB based on PTFE J-FET bonding methods
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CMOS-ASIC Pre-amp 19 of 22 No on-chip reset 6.5e
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CMOS-ASIC Pre-amp ( 2 ) Second version chip – with on-chip reset and much higher driver capability 20 of 22 10ns rise time for negative signal for 200pF // 1kOhm load
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CMOS-ASIC Pre-amp ( 3 ) 21 of 22 Noise capacitor ratio @ room temperature Noise @ low temperature 10.6e @ Cin=2pF
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Framework of Simulation Study Geometric model Electric field simulation Geant4: energy deposition Simulation of carriers trajectory Calculation of induced current
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Simulation Study on MSE/SSE Event Discrimination E/A method LE method LT method Amplitude of charge pulse / amplitude of current pulse method
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MSE current pulse E/A method LE method LT method Simulation Study on MSE/SSE Event Discrimination
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Conclusion We are making progress, though slow… Some preliminary results are achieved; Next step: –Further understanding –Larger size –Better performance New processing technology –Passivation: Amorphous germanium sputtering Amorphous-Ge R f Digital signal processing –Low radiation background material selection. 25 of 22
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