1. Marc Anduze first drawings of Ecal eudet module COPIED FROM : Marc Anduze PICTURES FROM : CALICE/EUDET electronic meeting – CERN – 12 July 07

2. Julien Fleury – EUDET/CALICE Electronic Meeting – 12 Jul 07 Why this prototype ?  Next step after the physics prototype and before the module 0  To study “full scale” technological solutions which will be used for the final detector (moulding process, thermal cooling, inlet/outlet, integration tools …)  To take account of the industrial point of view  To estimate the cost of the future Si/W ECAL “Final” Detector ECAL HCAL Tech. prototype 1 st ECAL Module (module 0) ECAL Prototype From M. Anduze

3. Julien Fleury – EUDET/CALICE Electronic Meeting – 12 Jul 07 Global Presentation Concept : to be the most representative of the final detector module :  An alveolar composite/tungsten structure with : - same W sampling : 20×2.1 mm and 9×4.2 mm thick - 3 columns of cells to have representative cells in the middle of the structure (with thin composite sheets ) width : 124 mm 180 mm - Identical global dimensions (1.5m long) and shape (trapezoidal) - fastening system ECAL/HCAL (include in the design of composite structure)  15 Detector slabs with FE chips integrated - 1 long and complete slab ? (L=1.3m) - 14 short slabs to obtain a complete tower of detection (typ. L=40 cm) - design of compact outlet (support system) Complete Tower of 4 wafers Long detector slab (1) Short detector slabs (14) 3×15 cells Alveolar Structure C/W Fastening system From M. Anduze

4. Julien Fleury – EUDET/CALICE Electronic Meeting – 12 Jul 07 Assuming that the chip power is 25 µW/channel total power to dissipate will be : 2055 W  external cooling OK for the “full scale ECAL” inside each slab : necessity of cooling system but active or passive ? Ex: Pessimist s imulation of heat conduction just by the heat shield : λ = 400 W/m/K (copper) ;S = 124*0,4 mm 2 L = 1,55 m ;  = 50*  chip = 0,18 W We can estimate the temperature difference along the slab layer around 7°C and without contribution of all material from slab (PCB, tungsten, carbon fibers…)  passive cooling OK : Thermal conductors (heat shield) can be added in the slab to carry heat more efficiently along the slab direction. Design of the module … Thermal sources: … while taking account of Slab Thermal analysis CALICE ECAL: ~ 82.2 M of channels 21.8 M From M. Anduze

5. Julien Fleury – EUDET/CALICE Electronic Meeting – 12 Jul 07 The expected alveolar thickness is 6.5 mm if :  Gaps (slab integration) : 500 µm - OK  Heat shield : 400 µm ? but real thermal dissipation ? (active cooling ?)  PCB : 800 µm but chips embedded in PCB ?  Thickness of glue : 100 µm ? study of the size of dots ?  Thickness of wafer : 300 µm ?  Ground or isolate foil : 100 µm ? AC vs DC ?  Thickness of W : 2100 µm - OK Heat shield: 100+400 µm (copper) Design EUDET Slab PCB: 800 µm glue: 100 µm (needs tests) wafer: 300 µm Chip without packaging ground foil: 100 µm 6000 µm Design of the module… … based on the definition of the detector slab : Chips and bonded wires inside the PCB Several technological issues have to be studied and validated From M. Anduze

6. Julien Fleury – EUDET/CALICE Electronic Meeting – 12 Jul 07 The Design of alveolar structure 545 mm 186 1510 Composite part with metal inserts (15 mm thick) Composite part (2 mm thick) 180×6,5 mm 180×8,6 mm Composite part (1 mm thick) Thickness : 1 mm Weight ~ 650 Kg From M. Anduze

7. Julien Fleury – EUDET/CALICE Electronic Meeting – 12 Jul 07 Detector slab - principle Connection between 2 PCB 7 “unit” PCB “end” PCB Short sample Long slab is made by several short PCBs :  Design of one interconnection (glue ?)  Development easier : study, integration and tests of short PCB (with chips and wafers) before assembly  The length of each long slab will be obtained by the size of one “end PCB” (tools) From M. Anduze

8. Julien Fleury – EUDET/CALICE Electronic Meeting – 12 Jul 07 Chip on board design ILC_PHY4 Last prototype EUDET prototype

9. Julien Fleury – EUDET/CALICE Electronic Meeting – 12 Jul 07 High voltage distribution -200V Amp AC coupling : 12345678910101 1212 1313 1414 1515 1616 1717 1818 1919 2020 21212 2323 2424 2525 2626 2727 2828 2929 3030 3131 32323 3434 3535 3636 1 Wafer 1 Channel DC coupling : 12345678910101 1212 1313 1414 1515 1616 1717 1818 1919 2020 21212 2323 2424 2525 2626 2727 2828 2929 3030 3131 32323 3434 3535 3636 200V Amp 1 Channel 200V 1 Wafer

10. Julien Fleury – EUDET/CALICE Electronic Meeting – 12 Jul 07 Slab issues No room for external components Not possible (and too expensive) to embed decoupling capacitance and high voltage resistor on the wafer  Only DC coupling possible

11. Julien Fleury – EUDET/CALICE Electronic Meeting – 12 Jul 07 Solution for HV decoupling N high-voltage lines, suppliing 1/N of the total number of wafer + decoupling Ground return through PCB Amp Decoupling with parasitic capacitance of other channels FEE : DC coupled Nb of channel/HV line > 1000  Crosstalk < 1/1000