1. 1 No.6 Tung-Yuan Road.,Chung-Li Industrial Park,Taoyuan, Taiwan.

2. 2 EstablishmentAugust,1990 CapitalUS$ 5,000,000 Estate2,500 sq meter Plant Area3,600 sq meter Product Type Multi-Layer PCB 、 High frequency and 3C product Employees250 Company Profile

3. 3 Company Organization General Manager PCB Dept Director x2 PCB Dept Director x2 Control Planning Supervisor x1 Engineer x 4 Shift leader x2 Operator x5 Control Planning Supervisor x1 Engineer x 4 Shift leader x2 Operator x5 A&F Supervisor x1 Engineer x 5 A&F Supervisor x1 Engineer x 5 QA&QC Supervisor x2 Engineer x4 Shift leader x1 Operator x10 QA&QC Supervisor x2 Engineer x4 Shift leader x1 Operator x10 Sales & Eng Manager x1 Supervisor x1 Shift leader x1 Engineer x8 Sales & Eng Manager x1 Supervisor x1 Shift leader x1 Engineer x8 Production Director x1 Manager x1 Assistant Manager x2 Supervisor x6 Engineer x14 Shift leader x4 Operator x175 Production Director x1 Manager x1 Assistant Manager x2 Supervisor x6 Engineer x14 Shift leader x4 Operator x175

4. 4 Sales Revenue

5. 5 Sales Group

6. 6 OHSAS 18001 Certification of Registration ISO 9001TS16949 cert

7. Certification of Registration 7 UL cert

8. 1990 Built primarily as a service for reliable fine line circuit imaging transfer 1994 Expanded technology to buildup multi-laminate process, laser via and high performance material 1995 Services to include PCB Design, CAM + A/W plotting, AOI inspection, Flying Probe Electrical Testing. 2000 Expand production capacity to build the 2 nd Factory. Equipped with new equipments. 2005 Expanded service to provide complete fabrication of flex board on inner and outer layers imaging transfer, developing and etching. 2006 Improved technology to fine registration of imaging transfer by LDI. 2007 Expanded services to include Copper plating, Solder Mask and Silkscreen process. 2008 Expanded service to HMLV (High Mix Low to mid Volume). 2011 Obtained certification for OHSAS 18001. 2013 Upgrade LDI machine capability to Paragon-9800U. 2014 Add new Paragon-9800U LDI machine. TS16949 certification passed. 8 Milestone

9. Palpilot Corp The No.1 PCB design center in US, Taiwan and China. SANTA CLARA: DESIGN, SALES, WAREHOUSE & TECHNICAL SUPPORT FACILITY: 500 Yosemite Dr Milpitas, CA 95035 9 Cooperative partner

10. 10 Finished PCB High Frequency ¸ High performance design PCB HDI design PCB Backplane design PCB Burn-in Board POV (Pad On Via) design Punching PCB design and manufacturing Solar energy PCB Normal design PCB

11. PCB Technology Description High frequency High performance Impedance +/- 7%, Special to +/-5% Frequency application in 10~50GHz Burn-In board Impedance +/- 10%, +/- 7% Via in pad, pitch: 19.7mil (0.5mm) High reliability Punch designDie tooling design and manufacturing Solar energy boardNew generation product HDI board1+N+1 construction for mass production Backplane boardHeavy copper (3oz inner layer, 4oz outer layer) MCPCBThin MCPCB for Light bar and back light application 11 Special fabrication

12. 12 High frequency material strategy SupplierMaterial typeResin system Tg ( ℃ ) Dk (1GHz) Df (1GHz)RemarkDf Spec. NelcoMercurywave 9350Enhanced epoxy2003.50.004 Ultra low loss 0.001~0.005 RogersRO4350 Hydrocarbon ceramic 2803.660.0031 Ultra low loss 0.001~0.005 ITEQIT-150DA Multifunctional Epoxy 1803.60.004 Ultra low loss 0.001~0.005 ITEQIT-200DK Multifunctional Epoxy 2003.60.009 Very low loss 0.005~0.01 TUCTU872LKModified epoxy20040.008 Very low loss 0.005~0.01 NelcoN4000-13siEnhanced epoxy2003.60.008 Very low loss 0.005~0.01 VentecVT-464Modified epoxy1753.780.009 Very low loss 0.005~0.01 IsolaFR408HR High performance 2003.690.009 Very low loss 0.005~0.01 ITEQIT-180i Multifunctional Epoxy 1804.30.013 Middle low loss 0.01~0.015

13. Item Description Fine Line/Pitch/Hole Fine line: 2.5/2.5 mil. Drilling pitch: 19.6mil. via Hole: 6mil (mechanical) High layer countsMin.: single Max: 34 layers ConstructionNon-regular shapes and constructions Panel sizeMax. 24” x 30” Finished Board thicknessMin.: 4mil (0.1mm) Max: 126mil (3.2mm) Thin coreMin. 2mil Copper thicknessMin.: 0.5 OZ; Max.: 4 OZ (outer layer) Impedance+/- 7% Aspect ratio1:8 (Through hole) Material FR4, FR5,FCCL, (Rogers, Ventec, Nelco, Arlon, Polyimide..) further material request can be done per customer requirement. 13 Technology Capability

14. ItemDescription HASL / HALAvailable Nickel platingAvailable Gold platingAvailable Tin platingAvailable Immersion GoldAvailable Immersion TinAvailable Immersion SilverAvailable OSPAvailable Selective Gold PlatingAvailable Gold finger platingAvailable 14 Surface finished Capability

15. 15 Continue to improve quality and delivery in order to win customer satisfaction. Continue to improve cost and efficiency in order to achieve sustainable management. Quality Policy CUSTOMER SATIFICAITON IN TIME SPECIFIC UL CERTIFICAITON ISO 9001 ISO 14001 OHSAS18001 TS16949

16. 16 Taiwan : Japan: USA : Singapore : Major Customer

17. 17 Brown oxide Lamination King Circuits Equipments

18. 18 Drilling machine King Circuits Equipments

19. 19 Cu plating pretreatmentCu plating equipment King Circuits Equipments

20. 20 Chemical pre-treatment King Circuits Equipments Automatic Cut Sheet Laminator

21. 21 6 DES LINE (TCM) King Circuits Equipments ORC CCD Exposure Machine

22. 22 LDI 9800 (Laser Direct Imaging) High registration: +/- 1mil King Circuits Equipments CAM system: Genesis and Par CAM

23. 23 Automatic AOI King Circuits Equipments VRS inspector

24. 24 Solder Mask pretreatment King Circuits Equipments Solder Mask Exposure

25. 25 30 sets Flying Probe Test machines King Circuits Equipments 2 sets of holes inspectors

26. 26 Micro-section Inspection Instrument King Circuits Equipments T.D.R. (Time Domain Reflector)

27. 27 King Circuits Provide 26 years history as a reliable source with excellent quality and service. Competitive pricing in the market. Time to market. Modern PCB design, capability and fabrication. Best quality assurance. Just in Time Service, and Delivery.

28. 28 Thank You for taking time to review King Circuits. Updated date:2016/03/01