1. BonnellFIELDS iCDR – AEB Solar Probe Plus FIELDS Instrument CDR Antenna Electronics Board AEB J. Bonnell, D. Seitz UC Berkeley, SSL jbonnell@ssl.berkeley.edu 1

2. BonnellFIELDS iCDR – AEB Agenda 2 Antenna Electronics Board (AEB) Requirements and Specifications: –AEB1 and 2 in FIELDS – Interfaces and Functions. –Design Description – Specifications and EM Performance. Resources Engineering Model Testing and Verification Plans Parts and Materials Peer Reviews Schedule, Open Work, Readiness for Flight Issues

3. BonnellFIELDS iCDR – AEB AEB1 and 2 in FIELDS 3

4. BonnellFIELDS iCDR – AEB 4 LF Section Details: Biasing

5. BonnellFIELDS iCDR – AEB Performance Requirements (unchanged) 5 The AEB1 and AEB2 perform the following functions: Generate independent +/- 15-V floating power (PA LF and HF input buffer). Generate regulated +/- 5-V fixed power from +/- 6-V analog (PA HF backend). Generate FGND driver from low-passed LF PA output. Generate BIAS, STUB, and SHIELD biasing outputs from low- passed LF PA output and DAC-controlled DC offset voltage. Control PA1..4 R_BIAS relay driver signals. Control V5 internal heater and power switching. Generate current, temperature, and DAC output voltage housekeeping for DCB/TDS readback. Distribute LF science signals: –from PA1..5 to DFB (AEB1: 1, 2, 5; AEB2: 3, 4). –From PA5 to TDS (AEB1 only).

6. BonnellFIELDS iCDR – AEB EM AEB (AEB1/SN002) 6

7. BonnellFIELDS iCDR – AEB Performance Requirements 7 The AEB1 and AEB2 perform the following functions: Generate independent +/- 15-V floating power (PA LF and HF input buffer). Generate regulated +/- 5-V fixed power from +/- 6-V analog (PA HF backend). Generate FGND driver from low-passed LF PA output. Generate BIAS, STUB, and SHIELD biasing outputs from low- passed LF PA output and DAC-controlled DC offset voltage. Control PA1..4 R_BIAS relay driver signals. Control V5 internal heater and power switching. Generate current, temperature, and DAC output voltage housekeeping for DCB/TDS readback. Distribute LF science signals: –from PA1..5 to DFB (AEB1: 1, 2, 5; AEB2: 3, 4). –From PA5 to TDS (AEB1 only).

8. BonnellFIELDS iCDR – AEB AEB Requirements/Specs (1 of 2) AEB Input Signal Characteristics (Preamp LF Output) –DC voltage level: up to ± 60Vdc w.r.t. AGND: ± 60 Vdc at full bias offsets. up to +/- 100Vdc at reduced bias current and voltage levels –AC voltage level: up to ± 10V w.r.t. floating ground (FGND): ± 15V floating supply and Preamp LF design support up to ± 13 V w.r.t. FGND. Floating Ground Driver –Input: LF Preamp signal –Bandwidth: 450 Hz –Output voltage level: ± 60Vdc w.r.t. AGND –Floating supply rails: ± 15Vdc Bias, Stub, Shield Output Drivers (Bias and Box on V5) –Reference Input: LF Preamp signal –Bandwidth: 450 Hz –Output voltage level: Vref ± 40Vdc (max, programmable) w.r.t. AGND –DAC resolution: 12-bit (~.025%) 8

9. BonnellFIELDS iCDR – AEB AEB Requirements/Specs (2 of 2) Bias, Stub, Shield Drivers (Bias and Box on V5) – Output Currents –Bias Range Control (AEB+PA, V5 is lowest range only): LOW:+/- 802 nA; covers 1 AU ops - 360 nA CBE. MED:+/- 14 uA; covers 0.25 AU ops - 6 uA CBE. HIGH:+/- 414 uA; covers perihelion ops - <=184 uA CBE. –PA1..4 Stub Currents: 60 nA (1 AU) ~ 0 uA for Science Ops (in shadow) –PA1..4 Shield Currents: 200 nA (1 AU) 100 uA (9.5 Rs) –V5 Box Currents: ~40 nA (1 AU) ~ 0 uA for Science Ops (in shadow) 9

10. BonnellFIELDS iCDR – AEB Resources Mass: 362 g (416 g NTE) –PWA only – does not include MEP frame and EMI shield. –Does not include staking and conformal coating. Power (dissipated on PWA): –AEB1: 460 mW nominal CBE (530 mW NTE). –AEB2: 270 mW nominal CBE (310 mW NTE). –Includes power dissipated in floating supply generation. –Does not include power dissipated at PAs. 10

11. BonnellFIELDS iCDR – AEB EM Testing Bench (Functional) Testing: –Safe-To-Mate (isolation/continuity) –Power Generation, Regulation, and Consumption (passive loads, incl. bypass caps; voltage margin; min/max load) –DAC and Relay Commanding –AC Response (gain and phase vs. frequency) –DC Response (FGND and bias output vs. LF_in and DAC setting) –Scripted AC and DC Response testing already developed for use in FM Functional Testing. Integrated Testing: –Safe-to-Mate (isolation/continuity; LNPS supply levels; AEB output levels) –Power Consumption (with active loads (PA’s); nominal and maximal signals). –DAC and Relay Commanding (PA+AEB biasing tests). –Verification of AC and DC response in integrated configuration (PA+AE B+LNPS, full FIELDS (1,2, or both)) 11

12. BonnellFIELDS iCDR – AEB Bench Testing - Setup 12 AEB2 AEB1 PA4 BOB PA3 BOB Bench Supply I/F (LNPS Sim) Digital Ctrl/Data I/F (DCB/TDS Sim) BOB = Break Out Board PA LF In/FGND, Bias Out I/F

13. BonnellFIELDS iCDR – AEB I&T Testing – Setup (PA+AEB1+DCB+DFB+LNPS1, 31 Oct 2014) 13 Safe-to-Mate. Power Consumption – as expected. LF/MF/HF response check – as expected (LF and MF termination off-nominal). PA/AEB Bias ranging and setting (HSK and Science readback) – as expected.

14. BonnellFIELDS iCDR – AEB Reviews 14 Oct 2013 - FIELDS I-PDR Peer Review –6 items, all closed. Dec 2013 - FIELDS I-PDR –1 item, all closed. Apr 2014 - AEB EM Layout Review –12 items, all closed prior to fabrication and assembly. Nov 2014 - FIELDS I-CDR Peer Review –5 items, responses complete and available on FIELDS ftp site: –ftp://apollo.ssl.berkeley.edu/pub/FIELDS/1_Management/1.7_Meetings/PhaseC_20141119_PRE _AEB_Peer_Review/ftp://apollo.ssl.berkeley.edu/pub/FIELDS/1_Management/1.7_Meetings/PhaseC_20141119_PRE _AEB_Peer_Review/

15. BonnellFIELDS iCDR – AEB Parts And Materials PARTS –Approvals: All parts conditionally approved by Parts Control Board (Nov 2014). Single-Event Transient (SET) effects analysis on MAX256 to be completed. –Derating and Stress Analysis: Complete - no issues found for worst-case board temperatures. –Procurement: FM procurement underway - See SMA-Parts for details. 15

16. BonnellFIELDS iCDR – AEB Schedule: Open EM Work, Transition to FM 16 Open EM Work: –Board-Level Thermal Testing: –PA+AEB1/2 – power, noise, gain, phase, DC offset changes (FGND, BIAS, STUB, SHIELD) –FIELDS TVAC Testing: –FIELDS1/2 MEP TVAC tests to verify board ops temperature predicts. –Support of PA1..4 and V5 Mechanical TVAC testing as needed. Transition to FM: –Feb to Mar 2015 – EM to FM Design Updates (schematic, layout, etc.) –Apr 2015 – FM AEB Pre-Fabrication Review –Apr to Jul 2015 – FM AEB Fab, Assy, and Test –27 Jul 2015 – Delivery of FM AEB1/2 to FIELDS I&T.

17. BonnellFIELDS iCDR – AEB Backup Slides (AEB) 17